AD ADL5723ACPZN-R7 High linearity input Datasheet

FEATURES
FUNCTIONAL BLOCK DIAGRAM
Frequency range: 10.1 GHz to 11.7 GHz
Typical gain of >24 dB
Low noise input
Noise figure
2.2 dB typical at 10.1 GHz
2.3 dB typical at 11.7 GHz
High linearity input
≥2.2 dBm typical input third-order intercept (IIP3)
−10 dBm typical input 1 dB compression point (P1dB)
Matched 50 Ω single-ended input
Matched 100 Ω differential outputs
8-lead, 2.00 mm × 2.00 mm LFCSP microwave packaging
VCC1
50Ω
SINGLE-ENDED
ADL5723
GND
VCC2
OUTN 100Ω
DIFFERENTIAL
OUTP
INPT
RBIAS
DNC
DNC = DO NOT CONNECT.
DO NOT CONNECT TO THIS PIN.
14316-001
Data Sheet
10.1 GHz to 11.7 GHz, Low Noise Amplifier
ADL5723
Figure 1.
APPLICATIONS
Point to point microwave radios
Instrumentation
Satellite communications (SATCOM)
Phased arrays
GENERAL DESCRIPTION
The ADL5723 is a narrow-band, high performance, low noise
amplifier (LNA) targeting microwave radio link receiver designs.
The monolithic silicon germanium (SiGe) design is optimized for
microwave radio link bands ranging from 10.1 GHz to 11.7 GHz.
The unique design offers a single-ended 50 Ω input impedance
and provides a 100 Ω balanced differential output that is ideal
for driving Analog Devices, Inc., differential downconverters
and radio frequency (RF) sampling analog-to-digital converters
Rev. 0
(ADCs). This LNA provides noise figure performance that, in
the past, required more expensive three-five (III-V) compounds
process technology to achieve.
The ADL5721 and ADL5723 to ADL5726 family of narrow-band
LNAs are each packaged in a tiny, thermally enhanced, 2.00 mm ×
2.00 mm LFCSP package. The ADL5721 and ADL5723 to
ADL5726 family operates over the temperature range of −40°C
to +85°C.
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One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
©2016 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
ADL5723* Product Page Quick Links
Last Content Update: 11/01/2016
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ADL5723
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Typical Performance Characteristics ..............................................6
Applications ....................................................................................... 1
Theory of Operation .........................................................................8
Functional Block Diagram .............................................................. 1
Applications Information .................................................................9
General Description ......................................................................... 1
Layout .............................................................................................9
Revision History ............................................................................... 2
Differential vs. Single-Ended Output .........................................9
Specifications..................................................................................... 3
Evaluation Board ............................................................................ 10
AC Specifications.......................................................................... 3
Initial Setup ................................................................................. 10
DC Specifications ......................................................................... 3
Results .......................................................................................... 10
Absolute Maximum Ratings............................................................ 4
Basic Connections for Operation ............................................. 11
Thermal Resistance ...................................................................... 4
Outline Dimensions ....................................................................... 12
ESD Caution .................................................................................. 4
Ordering Guide .......................................................................... 12
Pin Configuration and Function Descriptions ............................. 5
REVISION HISTORY
4/16—Revision 0: Initial Version
Rev. 0 | Page 2 of 12
Data Sheet
ADL5723
SPECIFICATIONS
AC SPECIFICATIONS
VCC1 = 1.8 V, VCC2 = 3.3 V, RBIAS = 442 Ω, TA = 25°C, ZSOURCE = 50 Ω, ZLOAD = 100 Ω differential, unless otherwise noted.
Table 1.
Parameter
FREQUENCY RANGE
FREQUENCY = 10.1 GHz
Gain (S21)
Noise Figure
Input Third-Order Intercept (IIP3)
Input 1 dB Compression Point (P1dB)
Input Return Loss (S11)
Output Return Loss (S22)
FREQUENCY = 11.7 GHz
Gain (S21)
Noise Figure
Input Third-Order Intercept (IIP3)
Input 1 dB Compression Point (P1dB)
Input Return Loss (S11)
Output Return Loss (S22)
Test Conditions/Comments
Min
10.1
Δf = 1 MHz, input power (PIN) = −30 dBm per tone
Δf = 1 MHz, PIN = −30 dBm per tone
Typ
Max
11.7
Unit
GHz
24.5
2.2
2.2
−10
10
10
dB
dB
dBm
dBm
dB
dB
24.1
2.3
3.5
−10
10
10
dB
dB
dBm
dBm
dB
dB
DC SPECIFICATIONS
Table 2.
Parameter
POWER INTERFACE
Voltage
VCC1
VCC2
Quiescent Current vs. Temperature
VCC1
VCC2
Test Conditions/Comments
TA = 25°C
−40°C ≤ TA ≤ +85°C
TA = 25°C
−40°C ≤ TA ≤ +85°C
Rev. 0 | Page 3 of 12
Min
Typ
Max
Unit
1.65
3.1
1.8
3.3
1.95
3.5
V
V
23.2
23.5
85.0
85.6
mA
mA
mA
mA
ADL5723
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 3.
Parameter
Supply Voltages
VCC1
VCC2
Maximum Junction Temperature
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range (Soldering 60 sec)
Rating
2.25 V
4.1 V
150°C/W
−40°C to +85°C
−55°C to +125°C
−65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
θJA is thermal resistance, junction to ambient (°C/W), θJB is
thermal resistance, junction to board (°C/W), and θJC is thermal
resistance, junction to case (°C/W).
Table 4. Thermal Resistance
Package Type
8-Lead LFCSP
1
θJA1
39.90
θJB1
23.88
θJC1
3.71
Unit
°C/W
See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance for a printed circuit board (PCB) with 3 × 4 vias.
ESD CAUTION
Rev. 0 | Page 4 of 12
Data Sheet
ADL5723
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
VCC1 1
INPT 3
RBIAS 4
8 VCC2
ADL5723
TOP VIEW
(Not to Scale)
7 OUTN
6 OUTP
5 DNC
NOTES
1. DNC = DO NOT CONNECT. DO NOT
CONNECT TO THIS PIN.
2. THE EXPOSED PAD MUST BE
SOLDERED TO A LOW IMPEDANCE
GROUND PLANE.
3. THE DEVICE NUMBER ON THE FIGURE
DOES NOT INDICATE THE LABEL ON
THE PACKAGE. REFER TO THE PIN 1
INDICATOR FOR THE PIN LOCATIONS.
14316-002
GND 2
Figure 2. Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
1
2
3
4
Mnemonic
VCC1
GND
INPT
RBIAS
5
6, 7
8
DNC
OUTP, OUTN
VCC2
EPAD (EP)
Description
1.8 V Power Supply. It is recommended to place the decoupling capacitors as close to this pin as possible.
Ground.
RF Input. This is a 50 Ω single-ended input.
Resistor Bias. For typical operation, connect a 442 Ω resistor from RBIAS to GND. It is recommended to
place the RBIAS resistor as close to the pin as possible.
Do Not Connect. Do not connect to this pin.
RF Outputs. These pins are 100 Ω differential outputs.
3.3 V Power Supply. It is recommended to place the decoupling capacitors as close to this pin as possible.
Exposed Pad. The exposed pad must be soldered to a low impedance ground plane.
Rev. 0 | Page 5 of 12
ADL5723
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
35
10
TA = –40°C
TA = +25°C
TA = +85°C
30
9
3.1V/1.65V
3.3V/1.8V
3.5V/1.95V
8
NOISE FIGURE (dB)
GAIN (dB)
25
20
15
10
7
6
5
4
3
2
5
10.5
10.7
10.9
11.1
11.3
11.5
11.7
FREQUENCY (GHz)
0
10.1
14316-003
10.3
10.7
10.9
11.1
11.3
11.5
11.7
Figure 6. Noise Figure vs. Frequency for Various Supply Voltages
3.1V/1.65V
3.3V/1.8V
3.5V/1.95V
30
10.5
FREQUENCY (GHz)
Figure 3. Gain vs. Frequency for Various Temperatures
35
10.3
14316-006
1
0
10.1
TA = –40°C
TA = +25°C
TA = +85°C
INPUT P1dB (dBm)
GAIN (dB)
25
20
15
10
10.3
10.5
10.7
10.9
11.1
11.3
11.5
11.7
FREQUENCY (GHz)
10.1
9
10.5
10.7
10.9
11.1
11.3
11.5
11.7
FREQUENCY (GHz)
Figure 4. Gain vs. Frequency for Various Supply Voltages
10
10.3
14316-007
0
10.1
14316-004
5
Figure 7. Input P1dB vs. Frequency for Various Temperatures
3.1V/1.65V
3.3V/1.8V
3.5V/1.95V
TA = –40°C
TA = +25°C
TA = +85°C
INPUT P1dB (dBm)
7
6
5
4
3
2
0
10.1
10.3
10.5
10.7
10.9
11.1
11.3
11.5
11.7
FREQUENCY (GHz)
Figure 5. Nosie Figure vs. Frequency for Various Temperatures
10.1
10.3
10.5
10.7
10.9
11.1
11.3
11.5
11.7
FREQUENCY (GHz)
Figure 8. Input P1dB vs. Frequency for Various Supply Voltages
Rev. 0 | Page 6 of 12
14316-008
1
14316-005
NOISE FIGURE (dB)
8
Data Sheet
15
10
ADL5723
TA = –40°C
TA = +25°C
TA = +85°C
TA = –40°C
TA = +25°C
TA = +85°C
INPUT RETURN LOSS (dB)
INPUT IP3 (dBm)
5
0
–5
–10
–15
10.3
10.5
10.7
10.9
11.1
11.3
11.5
11.7
FREQUENCY (GHz)
10.1
10.9
11.1
11.3
11.5
11.7
Figure 11. Input Return Loss vs. Frequency for Various Temperatures
3.1V/1.65V
3.3V/1.8V
3.5V/1.95V
TA = –40°C
TA = +25°C
TA = +85°C
5
0
–5
–10
–15
–25
10.1
10.3
10.5
10.7
10.9
11.1
11.3
11.5
11.7
FREQUENCY (GHz)
Figure 10. Input IP3 vs. Frequency Various Supply Voltages
10.1
10.3
10.5
10.7
10.9
11.1
FREQUENCY (GHz)
11.3
11.5
11.7
14316-012
–20
14316-010
INPUT IP3 (dB)
10.7
OUTPUT RETURN LOSS (dB)
10
10.5
FREQUENCY (GHz)
Figure 9. Input IP3 vs. Frequency for Various Temperatures
15
10.3
14316-011
–25
10.1
14316-009
–20
Figure 12. Output Return Loss vs. Frequency for Various Temperatures
Rev. 0 | Page 7 of 12
ADL5723
Data Sheet
THEORY OF OPERATION
The ADL5723 is a narrow-band, high performance, low noise
amplifier targeting microwave radio link receiver designs. The
monolithic SiGe design is optimized for microwave radio link
bands ranging from 10.1 GHz to 11.7 GHz.
The unique design of the ADL5723 offers a single-ended 50 Ω
input impedance via the INPT pin, and provides a 100 Ω
balanced differential output via the OUTP and OUTN pins.
This LNA is ideal for driving Analog Devices differential
downconverters and RF sampling ADCs.
The ADL5723 provides cost-effective noise figure performance
without requiring more expensive III-V compounds process
technology.
The ADL5723 is available in a 2.00 mm × 2.00 mm LFCSP package,
and operates over the temperature range of −40°C to +85°C.
Rev. 0 | Page 8 of 12
Data Sheet
ADL5723
APPLICATIONS INFORMATION
10
LAYOUT
9
8
NOISE FIGURE (dB)
Solder the exposed pad on the underside of the ADL5723 to a
low thermal and electrical impedance ground plane. This pad is
typically soldered to an exposed opening in the solder mask on
the evaluation board. Connect the ground vias to all other
ground layers on the evaluation board to maximize heat
dissipation from the device package.
7
6
5
4
3
2
10.5
10.7
10.9
11.1
11.3
11.5
11.7
11.5
11.7
14316-021
10.3
11.5
11.7
14316-020
0
10.1
14316-018
1
FREQUENCY (GHz)
Figure 15. Noise Figure vs. Frequency
14316-016
15
10
5
DIFFERENTIAL vs. SINGLE-ENDED OUTPUT
This section provides the test results that compare the ADL5723
using a differential vs. a single-ended output. When using the
device as a single-ended output, use the RFOP output on the
evaluation board and terminate RFON to 50 Ω. Note that the
converse can be done as well; however, doing so produces
slightly different results from the plots shown in this section
because there is some amplitude imbalance between the two
differential ports, RFOP and RFON. The output trace and
connector loss were not deembedded for these measurements.
INPUT IP3 (dBm)
Figure 13. Evaluation Board Layout for the ADL5723 Package
0
–5
–10
–15
–20
–25
10.1
10.3
10.5
10.7
10.9
11.1
11.3
FREQUENCY (GHz)
Figure 16. Input IP3 vs. Frequency
35
0
30
–5
INPUT P1dB (dBm)
20
15
10
5
0
10.1
–10
–15
–20
–25
10.3
10.5
10.7
10.9
11.1
11.3
FREQUENCY (GHz)
11.5
11.7
14316-017
GAIN (dB)
25
Figure 14. Gain vs. Frequency
–30
10.1
10.3
10.5
10.7
10.9
11.1
11.3
FREQUENCY (GHz)
Figure 17. Input P1dB vs. Frequency
Rev. 0 | Page 9 of 12
ADL5723
Data Sheet
EVALUATION BOARD
The ADL5723-EVALZ comes with an ADL5723 chip. It supports
a single 5 V supply for ease of use. For 5 V operation, use the
3.3 V and 1.8 V test loops for evaluation purposes only. When
using a 3.3 V or 1.8 V supply, remove the R1 and R2 resistors
from the evaluation board. Figure 19 shows the ADL5723EVALZ evaluation board lab bench setup.
RESULTS
INITIAL SETUP
Figure 18 shows the results of the differential output for an input
of 10.1 GHz at −15 dBm. The hybrid and board loss have not
been deembedded.
Figure 18 shows the expected results when testing the
ADL5723-EVALZ using the Rev. A version of the evaluation
board and its software. Note that future iterations of the software
may produce different results. See the ADL5723 product page
for the most recent software version.
To set up the ADL5723-EVALZ, take the following steps:
4.
RESOLUTION BANDWIDTH = 20kHz
VIDEO BANDWIDTH = 20kHz
10 SWEEP = 301ms (1001pts)
1
0
–10
–20
–30
–40
–50
–60
See Figure 19 for the ADL5723-EVALZ lab bench setup.
–70
–80
10.95 10.96 10.97 10.98 10.99 10.10 10.11 10.12 10.13 10.14 10.15
FREQUENCY (GHz)
Figure 18. Test Results at 10.1 GHz
+5V DC
GND
RFON
SPECTRUM
ANALYZER
INPUT
RFOP
RF FREQUENCY GENERATOR
180° HYBRID FOR DIFFERENTIAL
TO SINGLE ENDED OUTPUT
Figure 19. ADL5723-EVALZ Lab Bench Setup
Rev. 0 | Page 10 of 12
14316-013
3.
20
14316-014
2.
Power up the ADL5723-EVALZ with a 5 V dc supply. The
supply current of the evaluation board is approximately
111 mA, which is a combination of the VCC1 (1.8 V) and
the VCC2 (3.3 V) currents.
Connect the signal generator to the input of the ADL5723EVALZ.
Connect RFOP and RFON to a 180° hybrid that works
within the 10.1 GHz to 11.7 GHz frequency range.
Connect the difference output of the hybrid to the
spectrum analyzer. The sum port of the hybrid must be
terminated to 50 Ω.
POWER OUTPUT (dBm)
1.
Data Sheet
ADL5723
BASIC CONNECTIONS FOR OPERATION
Figure 20 shows the basic connections for operating the ADL5723 as it is implemented on the evaluation board of the device.
1.8V
3.3V
C5
0.1UF
C1
4.7NF
C2
33PF
C3
33PF
C4
4.7NF
C6
0.1UF
AGND
AGND
AGND
AGND
AGND
AGND
OUTN 1
572X_RFON
25-146-1000-92
4 3 2 CNSRI2516100092_SW109201A5
DUTA
RFIN
1
25-146-1000-92
CNSRI2516100092_SW109201A5 2 3 4
1
2
3
4
RFIN
VCC1
GND
INPT
RBIAS PAD
PAD
AGND
AGND
RBIAS
442
8
VCC2
OUTN 7
6
OUTP
DNC 5
AGND
OUTP 1
ADL5723
AGND
1.8V
AGND
R4
10K
DNI
R3
572X_RFOP
25-146-1000-92
4 3 2 CNSRI2516100092_SW109201A5
AGND
1
2
0
AGND
R1
0
C7
4.7UF
1
VOUT
2
VOUT
AGND
VIN
VIN
EN
SS
SENSE
EP GND
PAD 6
5V
RED
1
3P3V
RED
1
1P8V
RED
1
GND
BLK
5V
3.3V
1.8V
AGND
69157-102HLF
U2
8
7
5
4
3
5V
C9
4.7UF
AGND
C8
1000PF
AGND
3.3V
R2
0
C10
4.7UF
AGND
ADM7172ACPZ-3.3
1
8
VOUT1
VIN1
2
7
VOUT2
VIN2
5
EN
4
SS
3
SENSE
EP GND
PAD 6
5V
C12
4.7UF
AGND
C11
1000PF
AGND
AGND
AGND
14316-016
U1
ADM7170ACPZ-1.8
1.8V
1
P1
Figure 20. Evaluation Board Schematic
Table 6. Evaluation Board Configuration Options
Component
3P3V, 1P8V, GND, 5V
RFIN, 572X_RFOP, 572x_RFON
RBIAS
R1, R2
R3
R4
C1 to C12
Function
Power supplies and ground.
Input, output, and data.
442 Ω for RBIAS.
1.8 V and 3.3 V regulator connections.
Do not install (DNI).
Pull-up or pull-down resistor.
The capacitors provide the required decoupling for the supply
related pins.
P1
U1
U2
DUTA
Jumper to change bands, 2-pin jumper.
ADM7170ACPZ-1.8 1.8 V regulator.
ADM7172ACPZ-3.3 3.3 V regulator.
ADL5723 device under test (DUT).
Rev. 0 | Page 11 of 12
Default Condition
Not applicable
Not applicable
RBIAS = 442 Ω (0402)
R1, R2 = 0 Ω (0402)
R3 = DNI (0402)
R4 = 10 kΩ (0402)
C1, C4 = 4.7 nF (0402),
C2, C3 = 33 pF (0402),
C5, C6 = 0.1 μF (0402),
C7, C9, C10, C12 = 4.7 μF (0603),
C8, C11 = 1000 pF (0603)
Not applicable
Not applicable
Not applicable
Not applicable
ADL5723
Data Sheet
OUTLINE DIMENSIONS
1.70
1.60
1.50
2.10
2.00 SQ
1.90
0.50 BSC
8
5
1.10
1.00
0.90
EXPOSED
PAD
0.425
0.350
0.275
4
TOP VIEW
0.60
0.55
0.50
0.05 MAX
0.02 NOM
SEATING
PLANE
0.30
0.25
0.20
1
BOTTOM VIEW
PIN 1
INDICATOR
(R 0.15)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.20 REF
01-14-2013-C
PIN 1 INDEX
AREA
0.15 REF
Figure 21. 8-Lead Lead Frame Chip Scale Package [LFCSP]
2.00 mm × 2.00 mm Body, and 0.55 mm Package Height
(CP-8-10)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADL5723ACPZN-R7
ADL5723-EVALZ
1
Temperature Range
−40°C to +85°C
Package Description
8-Lead Lead Frame Chip Scale Package [LFCSP]
Evaluation Board
Z = RoHS-Compliant Part.
©2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D14316-0-4/16(0)
Rev. 0 | Page 12 of 12
Package Option
CP-8-10
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