Material Content Data Sheet Sales Product Name TLE7714G MA# MA001356014 Package PG-DSO-52-4 Issued 17. April 2015 Weight* 869.20 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 17.200 1.98 0.073 0.01 0.293 0.03 337 5.854 0.67 6735 237.701 27.35 28.06 273470 280626 2.311 0.27 0.27 2659 2659 1.183 0.14 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.98 19788 19788 84 1361 54.413 6.26 535.848 61.64 68.04 616481 680443 7.602 0.87 0.87 8746 8746 0.968 0.11 0.11 1113 1113 1.440 0.17 4.319 0.50 62601 1656 0.67 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 4969 6625 1000000