Material Content Data Sheet Sales Product Name IPB100N08S2L-07 MA# MA000275860 Package PG-TO263-3-2 Issued 29. August 2013 Weight* 1564.38 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7439-89-6 7440-50-8 12.294 0.79 0.304 0.02 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.79 7858 7858 195 0.091 0.01 304.026 19.43 19.46 194343 58 194596 7.692 0.49 0.49 4917 4917 10.110 0.65 6463 111.212 7.11 552.691 35.32 43.08 353295 430849 9.657 0.62 0.62 6173 6173 0.228 0.01 0.001 0.00 0.192 0.01 0.154 0.01 7.350 0.47 0.165 0.01 0.548 0.04 547.666 35.01 71090 146 0.01 1 98 0.49 4699 2. 3. 351 35.06 350085 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 4920 105 Important Remarks: 1. 146 123 350541 1000000