ON NUF2450 2 line emi filter with esd protection Datasheet

NUF2450
2 Line EMI Filter with
ESD Protection
This device is a 2 line EMI filter array for audio applications.
Greater than −30 dB attenuation is obtained at frequencies from
800 MHz to 5.0 GHz. The NUF2450MU has a cut−off frequency of
20 MHz and minimal line resistance, making it ideal for applications
requiring low bandpass attenuation. This UDFN package is
specifically designed to enhance EMI filtering for low−profile or slim
design electronics especially where space and height is a premium. It
also offers ESD protection−clamping transients from static discharges.
ESD protection is provided across all capacitors.
Features
•
L
1
Cd
8
Cd
L
4
• EMI Filtering and ESD Protection
• Integration of 10 Discrete Components
• Compliance with IEC61000−4−2 (Level 4)
•
•
•
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Cd
5
Cd
(Top View)
20 kV (Contact)
UDFN Package, 1.2 x 1.8 mm
Moisture Sensitivity Level 1
ESD Ratings:
Machine Model = C
Human Body Model = 3B
This is a Pb−Free Device*
8
MARKING
DIAGRAM
1
UDFN8
CASE 517AD
24 MG
G
1
Benefits
• Reduces EMI/RFI Emissions on Audio Lines
• Low Profile Package; Typical Height of 0.5 mm
• Design−Friendly and Easy−to−Use Pin Configurations,
•
•
•
•
Particularly for Portable Electronics
Integrated Solution Offers Cost and Space Savings in UDFN Package
Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass
Filter Response
Integrated Solution Improves System Reliability
Excellent ESD Performance with Large GND Pad
24 = Specific Device Code
M = Month Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
1
4
GND
Applications
• Headsets, MP3 Players, and PDAs
• Portable DVDs
• Hands−Free Interface
8
October, 2011 − Rev. 0
5
ORDERING INFORMATION
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2011
(Bottom View)
1
Device
Package
Shipping†
NUF2450MUT2G
UDFN8
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
NUF2450/D
NUF2450
MAXIMUM RATINGS
Parameter
Symbol
ESD Discharge IEC61000−4−2
Value
VPP
Contact Discharge
Machine Model
Human Body Model
Unit
kV
20
1.6
16
Operating Temperature Range
TOP
−40 to 85
°C
Storage Temperature Range
TSTG
−55 to 150
°C
TL
260
°C
Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Parameter
Symbol
Maximum Reverse Working Voltage
VRWM
Breakdown Voltage
Test Conditions
Min
Typ
Max
Unit
−
−
5.0
V
VBR
IR = 1.0 mA
6.0
7.0
8.0
V
Leakage Current
IR
VRWM = 3.3 V
−
−
100
nA
Inductance
L
−
2.3
−
nH
Series Resistance
0.9
1.3
1.7
Capacitance (Note 1)
Cline
RS
VR = 0 V, f = 1.0 MHz
190
240
290
pF
Cut−Off Frequency (Note 2)
f3dB
Above this frequency,
Appreciable Attenuation Occurs
−
20
−
MHz
1. Measured at 25°C.
2. 50 source and 50 load termination.
0
0
−5
−10
−10
−20
−20
S41 (dB)
S21 (dB)
−15
−25
−30
−35
−30
−40
−50
−40
−60
−45
−50
1.00E+06
1.00E+07
1.00E+08
1.00E+09
1.00E+10
−70
1.E+06
1.E+07
1.E+08
1.E+09
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 1. Typical Insertion Loss
Characteristics (S21 Measurement)
Figure 2. Analog Crosstalk Curve (S41
Measurement)
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2
1.E+10
NUF2450
PACKAGE DIMENSIONS
UDFN8, 1.8x1.2, 0.4P
CASE 517AD
ISSUE C
A
B
D
2X
0.10 C
PIN ONE
REFERENCE
2X
ÉÉÉ
ÉÉÉ
ÇÇ
ÉÉ
ÉÉ
MOLD CMPD
EXPOSED Cu
A3
A1
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DETAIL B
ALTERNATE
CONSTRUCTIONS
0.10 C
DIM
A
A1
A3
b
D
E
e
D2
E2
J
K
L
L1
TOP VIEW
A
DETAIL B
0.05 C
8X
0.05 MIN
(A3)
(0.10)
0.05 C
NOTE 4
SIDE VIEW
L
C
L
L1
D2
1
DETAIL A
SEATING
PLANE
J
DETAIL A
8X
A1
E2
SOLDERING FOOTPRINT*
DETAIL A
OPTIONAL
CONSTRUCTION
8X
K
8
e
e/2
1.10
7X
8X b
0.25
8X
0.45
PACKAGE
OUTLINE
0.10 C A B
0.05 C
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.80 BSC
1.20 BSC
0.40 BSC
0.90
1.10
0.20
0.30
0.19 REF
0.20
−−−
0.20
0.30
−−−
0.10
NOTE 3
BOTTOM VIEW
1.50
0.35
1
0.35
0.40 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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3
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Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NUF2450/D
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