ISSI IS61WV2568EDBLL-10BI 256k x 8 high speed asynchronous cmos static ram with ecc Datasheet

IS61WV2568EDBLL
IS64WV2568EDBLL
256K x 8 HIGH SPEED ASYNCHRONOUS
CMOS STATIC RAM WITH ECC
DECEMBER 2011
DESCRIPTION
The ISSI IS61/64WV2568EDBLL is a high-speed,
FEATURES
• High-speed access time: 8, 10 ns
• Low Active Power: 85 mW (typical)
• Low Standby Power: 7 mW (typical)
CMOS standby
• Single power supply
— Vdd 2.4V to 3.6V (10 ns)
— Vdd 3.3V ± 10% (8 ns)
• Fully static operation: no clock or refresh
required
• Three state outputs
• Industrial and Automotive temperature support
• Lead-free available
• Error Detection and Error Correction
2,097,152-bit static RAMs organized as 262,144 words by
8 bits. It is fabricated using ISSI's high-performance CMOS
technology. This highly reliable process coupled with innovative circuit design techniques, yields high-performance
and low power consumption devices.
When CE is HIGH (deselected), the device assumes a
standby mode at which the power dissipation can be reduced down with CMOS input levels.
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs, CE and OE. The active LOW
Write Enable (WE) controls both writing and reading of
the memory. The IS61/64WV2568EDBLL is packaged in the JEDEC
standard 44-pin TSOP-II, 36-pin SOJ and 36-pin Mini BGA
(6mm x 8mm).
FUNCTIONAL BLOCK DIAGRAM
A0-A17
Memory Array
(256Kx8)
Decoder
8
8
IO0-7
I/O Data
Circuit
/CE
/OE
/WE
Control
Circuit
8
ECC Array
(256Kx4)
4
12
ECC
Column I/O
Copyright © 2011 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications
unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances Integrated Silicon Solution, Inc. — www.issi.com
Rev. A
11/08/2011
1
IS61/64WV2568EDBLL
PIN CONFIGURATION
44-Pin TSOP (Type II)
36 mini BGA
1
2
3
4
5
6
A
A0
A1
NC
A3
A6
A8
B
I/O4
A2
WE
A4
A7
I/O0
C
I/O5
NC
A5
D
GND
E
VDD
F
I/O6
G
I/O7
H
A9
I/O1
VDD
GND
I/O2
NC
A17
OE
CE
A16
A15
I/O3
A10
A11
A12
A13
A14
NC
NC
A0
A1
A2
A3
A4
CE
I/O0
I/O1
VDD
GND
I/O2
I/O3
WE
A5
A6
A7
A8
A9
NC
NC
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
NC
NC
NC
A17
A16
A15
A14
OE
I/O7
I/O6
GND
VDD
I/O5
I/O4
A13
A12
A11
A10
NC
NC
NC
NC
36-Pin SOJ
PIN DESCRIPTIONS
A0-A17
CE
OE
WE
I/O0-I/O7
Vdd
GND
NC
2
Address Inputs
Chip Enable Input
Output Enable Input
Write Enable Input
Bidirectional Ports
Power
Ground
No Connection
A0
1
36
NC
A1
2
35
A17
A2
3
34
A16
A3
4
33
A15
A4
5
32
A14
CE
6
31
OE
I/O0
7
30
I/O7
I/O1
8
29
I/O6
VDD
9
28
GND
GND
10
27
VDD
I/O2
11
26
I/O5
I/O3
12
25
I/O4
WE
13
24
A13
A5
14
23
A12
A6
15
22
A11
A7
16
21
A10
A8
17
20
NC
A9
18
19
NC
Integrated Silicon Solution, Inc. — www.issi.com
Rev. A
11/08/2011
IS61/64WV2568EDBLL
ABSOLUTE MAXIMUM RATINGS(1)
Symbol
Vterm
Vdd
Tstg
Pt
Parameter
Terminal Voltage with Respect to GND
Vdd Relates to GND
Storage Temperature
Power Dissipation
Value
–0.5 to Vdd + 0.5
–0.3 to 4.0
–65 to +150
1.0
1
Unit
V
V
°C
W
2
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at these or any other conditions
above those indicated in the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliability.
3
4
CAPACITANCE(1,2)
Symbol
Parameter
Cin
CI/O
Input Capacitance
Input/Output Capacitance
Conditions
Max.
Unit
Vin = 0V
Vout = 0V
6
8
pF
pF
5
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: Ta = 25°C, f = 1 MHz, Vdd = 3.3V.
6
ERROR DETECTION AND ERROR CORRECTION
•
•
•
•
7
Independent ECC with hamming code for each byte
Detect and correct one bit error per byte
Better reliability than parity code schemes which can only detect an error but not correct an error
Backward Compatible: Drop in replacement to current in industry standard devices (without ECC)
8
TRUTH TABLE
Mode
CE
Not Selected
H
(Power-down)
Output Disabled L
Read
L
Write
L
WE
X
OE
X
H
H
L
H
L
X
9
I/O Operation Vdd Current
High-Z
Isb1, Isb2
10
Icc
Icc
Icc
High-Z
Dout
Din
11
OPERATING RANGE (Vdd)1
Range
Ambient Temperature
Industrial
–40°C to +85°C
Automotive (A1)
Automotive (A3)
–40°C to +85°C
–40°C to +125°C
IS61WV2568EDBLL
Vdd (8, 10ns)
2.4V-3.6V (10ns)
3.3V ± 10% (8ns)
—
—
IS64WV2568EDBLL
Vdd (10ns)
—
12
2.4V-3.6V
2.4V-3.6V
Note:
1. Contact [email protected] for 1.8V option
Integrated Silicon Solution, Inc. — www.issi.com
Rev. A
11/08/2011
3
IS61/64WV2568EDBLL
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Vdd = 3.3V + 10%
Symbol
Voh
Vol
Vih
Vil
Ili
Ilo
Parameter
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage(1)
Input Leakage
Output Leakage
Test Conditions
Vdd = Min., Ioh = –4.0 mA
Vdd = Min., Iol = 8.0 mA
GND ≤ Vin ≤ Vdd
GND ≤ Vout ≤ Vdd, Outputs Disabled
Min.
2.4
—
2
–0.3
–1
–1
Max.
—
0.4
Vdd + 0.3
0.8
1
1
Unit
V
V
V
V
µA
µA
Max.
—
0.4
Vdd + 0.3
0.8
1
1
Unit
V
V
V
V
µA
µA
Note:
1. Vil (min.) = –0.3V DC; Vil (min.) = –2.0V AC (pulse width < 10 ns). Not 100% tested.
Vih (max.) = Vdd + 0.3V DC; Vih (max.) = Vdd + 2.0V AC (pulse width < 10 ns). Not 100% tested.
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Vdd = 2.4V-3.6V
Symbol
Voh
Vol
Vih
Vil
Ili
Ilo
Parameter
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage(1)
Input Leakage
Output Leakage
Test Conditions
Vdd = Min., Ioh = –1.0 mA
Vdd = Min., Iol = 1.0 mA
GND ≤ Vin ≤ Vdd
GND ≤ Vout ≤ Vdd, Outputs Disabled
Min.
1.8
—
2.0
–0.3
–1
–1
Note:
1. Vil (min.) = –0.3V DC; Vil (min.) = –2.0V AC (pulse width < 10 ns). Not 100% tested.
Vih (max.) = Vdd + 0.3V DC; Vih (max.) = Vdd + 2.0V AC (pulse width < 10 ns). Not 100% tested.
POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)
-8 -10 -20
Symbol Parameter
Test ConditionsMin. Max.
Min. Max.
Min. Max.
Icc
Vdd Dynamic Operating Vdd = Max.,
Com.
— 40
—
30
—
25
Supply Current
Iout = 0 mA, f = fmax
Ind.
— 45
—
35
—
30
Auto.
—
—
—
50
—
45
21
21
typ.(2)
Icc1
Operating
Vdd = Max.,
Com.
— 20
—
20
—
20
Supply Current
Iout = 0 mA, f = 0
Ind.
— 25
—
25
—
25
Auto.
—
—
—
40
—
40
Isb1
TTL Standby Current
Vdd = Max.,
Com.
— 10
—
10
—
10
(TTL Inputs)
Vin = Vih or Vil
Ind.
— 15
—
15
—
15
CE ≥ Vih, f = 0
Auto.
—
—
—
30
—
30
Isb2
CMOS Standby
Vdd = Max.,
Com.
—
5
—
5
—
5
Current (CMOS Inputs) CE ≥ Vdd – 0.2V,
Ind.
—
6
—
6
—
6
Vin ≥ Vdd – 0.2V, or
Auto.
—
—
—
15
—
15
Vin ≤ 0.2V, f = 0
typ.(2)
1.5
1.5
Unit
mA
mA
mA
mA
Note:
1. At f = fmax, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
2. Typical values are measured at Vdd = 3.0V, Ta = 25oC and not 100% tested.
4
Integrated Silicon Solution, Inc. — www.issi.com
Rev. A
11/08/2011
IS61/64WV2568EDBLL
AC TEST CONDITIONS
Parameter
Input Pulse Level
Input Rise and Fall Times
Input and Output Timing
and Reference Level (VRef)
Output Load
1
Unit
(2.4V-3.6V)
0.4V to Vdd-0.3V
1V/ ns
Vdd/2
2
See Figures 1 and 2
3
AC TEST LOADS
4
319 Ω
ZO = 50Ω
3.3V
50Ω
1.5V
OUTPUT
30 pF
Including
jig and
scope
Figure 1.
OUTPUT
5
353 Ω
5 pF
Including
jig and
scope
6
Figure 2.
7
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)
-8 -10 -20
Symbol
Parameter
Min.Max.
Min.Max.
Min.Max.
trc
Read Cycle Time
8
—
10
—
20 —
taa
Address Access Time
—
8
—
10
— 20
toha
Output Hold Time
2.0 —
2.0 —
2.5 —
tace
CE Access Time
—
8
—
10
— 20
tdoe
OE Access Time
— 4.5
— 4.5
—
8
thzoe(2)
OE to High-Z Output
—
3
—
4
—
8
(2)
tlzoe
OE to Low-Z Output
0
—
0
—
0
—
thzce(2
CE to High-Z Output
0
3
0
4
0
8
(2)
tlzce
CE to Low-Z Output
3
—
3
—
3
—
tpu
Power Up Time
0
—
0
—
0
—
tpd
Power Down Time
—
8
—
10
— 20
8
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
9
10
11
Notes:
1. Test conditions and output loading conditions are specified in the AC Test Conditions and AC Test Loads (Figure 1).
2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage.
Integrated Silicon Solution, Inc. — www.issi.com
Rev. A
11/08/2011
12
5
IS61/64WV2568EDBLL
AC WAVEFORMS
READ CYCLE NO. 1(1,2) (Address Controlled) (CE = OE = Vil)
t RC
ADDRESS
t AA
t OHA
DOUT
t OHA
DATA VALID
PREVIOUS DATA VALID
READ1.eps
READ CYCLE NO. 2(1,3) (CE and OE Controlled)
t RC
ADDRESS
t AA
t OHA
OE
t HZOE
t DOE
t LZOE
CE
t LZCE
DOUT
t ACE
HIGH-Z
t HZCE
DATA VALID
CE_RD2.eps
Notes:
1. WE is HIGH for a Read Cycle.
2. The device is continuously selected. OE, CE = Vil.
3. Address is valid prior to or coincident with CE LOW transitions.
6
Integrated Silicon Solution, Inc. — www.issi.com
Rev. A
11/08/2011
IS61/64WV2568EDBLL
WRITE CYCLE SWITCHING CHARACTERISTICS(1,3) (Over Operating Range)
-8 -10 -20
Symbol
Parameter Min.Max. Min.Max.
Min. Max.
twc
Write Cycle Time
8
—
10
—
20
—
tsce
CE to Write End
6.5
—
8
—
12
—
taw
Address Setup Time
6.5
—
8
—
12
—
to Write End
tha
Address Hold from Write End
0
—
0
—
0
—
tsa
Address Setup Time
0
—
0
—
0
—
tpwe1
WE Pulse Width
6.5
—
8
—
12
—
tpwe2
WE Pulse Width (OE = LOW)
8.0
—
10
—
17
—
tsd
Data Setup to Write End
5
—
6
—
9
—
thd
Data Hold from Write End
0
—
0
—
0
—
thzwe(2)
WE LOW to High-Z Output
—
3.5
—
5
—
9
(2)
tlzwe
WE HIGH to Low-Z Output
2
—
2
—
2
—
1
Unit
ns
ns
ns
2
3
ns
ns
ns
ns
ns
­ns
ns
ns
4
5
Notes:
1. Test conditions and output loading conditions are specified in the AC Test Conditions and AC Test Loads (Figure 1).
2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
3. The internal write time is defined by the overlap of CE LOW, and WE LOW. All signals must be in valid states to initiate a
Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising
or falling edge of the signal that terminates the write. Shaded area product in development
6
7
8
9
10
11
12
Integrated Silicon Solution, Inc. — www.issi.com
Rev. A
11/08/2011
7
IS61/64WV2568EDBLL
AC WAVEFORMS
WRITE CYCLE NO. 1(1,2) (CE Controlled, OE = HIGH or LOW)
t WC
VALID ADDRESS
ADDRESS
t SA
t SCE
t HA
CE
t AW
t PWE1
t PWE2
WE
t HZWE
DOUT
DATA UNDEFINED
t LZWE
HIGH-Z
t SD
DIN
t HD
DATAIN VALID
CE_WR1.eps
8
Integrated Silicon Solution, Inc. — www.issi.com
Rev. A
11/08/2011
IS61/64WV2568EDBLL
WRITE CYCLE NO. 2(1,2) (WE Controlled: OE is HIGH During Write Cycle)
t WC
ADDRESS
1
VALID ADDRESS
t HA
2
OE
CE
3
LOW
t AW
t PWE1
WE
t SA
DOUT
t HZWE
4
t LZWE
HIGH-Z
DATA UNDEFINED
t SD
5
t HD
DATAIN VALID
DIN
CE_WR2.eps
Notes:
1. The internal write time is defined by the overlap of CE LOW and WE LOW. All signals must be in valid states to initiate a Write,
but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling
edge of the signal that terminates the Write.
2. I/O will assume the High-Z state if OE > Vih.
6
7
WRITE CYCLE NO. 3 (WE Controlled: OE is LOW During Write Cycle)
8
t WC
ADDRESS
VALID ADDRESS
OE
LOW
CE
LOW
9
t HA
t AW
10
t PWE2
11
WE
t SA
DOUT
t HZWE
DATA UNDEFINED
t LZWE
HIGH-Z
t SD
DIN
12
t HD
DATAIN VALID
CE_WR3.eps
Integrated Silicon Solution, Inc. — www.issi.com
Rev. A
11/08/2011
9
IS61/64WV2568EDBLL
HIGH SPEED
DATA RETENTION SWITCHING CHARACTERISTICS (2.4V-3.6V)
Symbol
Idr
Parameter
Vdd for Data Retention
Data Retention Current
Test Condition
See Data Retention Waveform
Vdd = 2.0V, CE ≥ Vdd – 0.2V
tsdr
trdr
Data Retention Setup Time
Recovery Time
See Data Retention Waveform
See Data Retention Waveform
Vdr
Options
Com.
Ind.
Auto.
Min.
2.0
—
—
Typ.(1)
—
0.5
—
0
—
—
trc
Max.
3.6
5
6
15
—
—
Unit
V
mA
ns
ns
Note 1: Typical values are measured at Vdd = Vdr(min), Ta = 25 C and not 100% tested.
o
DATA RETENTION WAVEFORM (CE Controlled)
tSDR
Data Retention Mode
tRDR
VDD
VDR
CE
GND
10
CE ≥ VDD - 0.2V
Integrated Silicon Solution, Inc. — www.issi.com
Rev. A
11/08/2011
IS61/64WV2568EDBLL
ORDERING INFORMATION
1
Industrial Range: -40°C to +85°C
Speed (ns)
8
Order Part No.
IS61WV2568EDBLL-8BLI
IS61WV2568EDBLL-8TLI
IS61WV2568EDBLL-8KLI
Package
36 mini BGA (6mm x 8mm), Lead-free
TSOP (Type II), Lead-free
400-mil Plastic SOJ, Lead-free
2
3
Industrial Range: -40°C to +85°C
Speed (ns)
10
Order Part No.
IS61WV2568EDBLL-10BI
IS61WV2568EDBLL-10BLI
IS61WV2568EDBLL-10TI
IS61WV2568EDBLL-10TLI
IS61WV2568EDBLL-10KLI
Package
36 mini BGA (6mm x 8mm)
36 mini BGA (6mm x 8mm), Lead-free
TSOP (Type II)
TSOP (Type II), Lead-free
400-mil Plastic SOJ, Lead-free
4
5
Automotive (A1) Range: -40°C to +85°C
Speed (ns)
10
Order Part No.
IS64WV2568EDBLL-10BA1
IS64WV2568EDBLL-10BLA1
IS64WV2568EDBLL-10CTA1
IS64WV2568EDBLL-10CTLA1
IS64WV2568EDBLL-10KLA1
Package
36 mini BGA (6mm x 8mm)
36 mini BGA (6mm x 8mm), Lead-free
TSOP (Type II), Copper Leadframe
TSOP (Type II), Lead-free, Copper Leadframe
400-mil Plastic SOJ, Lead-free
6
7
8
Automotive (A3) Range: -40°C to +125°C
Speed (ns)
10
Order Part No.
IS64WV2568EDBLL-10BA3
IS64WV2568EDBLL-10BLA3
IS64WV2568EDBLL-10CTA3
IS64WV2568EDBLL-10CTLA3
IS64WV2568EDBLL-10KLA3
Package
36 mini BGA (6mm x 8mm)
36 mini BGA (6mm x 8mm), Lead-free
TSOP (Type II), Copper Leadframe
TSOP (Type II), Lead-free, Copper Leadframe
400-mil Plastic SOJ, Lead-free
9
10
11
12
Integrated Silicon Solution, Inc. — www.issi.com
Rev. A
11/08/2011
11
12
Θ
Package Outline
06/04/2008
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION/INTRUSION.
2. DIMENSION D AND E1 DO NOT INCLUDE MOLD PROTRUSION.
1. CONTROLLING DIMENSION : MM
NOTE :
Θ
IS61/64WV2568EDBLL
Integrated Silicon Solution, Inc. — www.issi.com
Rev. A
11/08/2011
Integrated Silicon Solution, Inc. — www.issi.com
Rev. A
11/08/2011
4. Formed leads shall be planar with respect to one another within 0.1mm
at the seating plane after final test.
5. Reference document : JEDEC SPEC MS-027.
3. Dimension b2 does not include dambar protrusion/intrusion.
2. Dimension D and E1 do not include mold protrusion .
1. Controlling dimension : mm
NOTE :
12/20/2007
IS61/64WV2568EDBLL
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Package Outline
08/12/2008
1. CONTROLLING DIMENSION : MM .
2. Reference document : JEDEC MO-207
NOTE :
IS61/64WV2568EDBLL
Integrated Silicon Solution, Inc. — www.issi.com
Rev. A
11/08/2011
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