TI1 LP38693MP-2.5/NOPB Lp38693 500ma low dropout cmos linear regulators stable with ceramic output capacitor Datasheet

LP38691, LP38693
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SNVS321K – JANUARY 2005 – REVISED APRIL 2013
LP38691
LP38693 500mA Low Dropout CMOS Linear Regulators
Stable with Ceramic Output Capacitors
Check for Samples: LP38691, LP38693
FEATURES
DESCRIPTION
•
The LP38691/3 low dropout CMOS linear regulators
provide tight output tolerance (2.0% typical),
extremely low dropout voltage (250 mV @ 500mA
load current, VOUT = 5V), and excellent AC
performance utilizing ultra low ESR ceramic output
capacitors.
1
2
•
•
•
•
•
•
•
•
•
•
All WSON Options are Available as AEC-Q100
Grade 1
2.0% Output Accuracy (25°C)
Low Dropout Voltage: 250 mV @ 500mA (typ,
5V out)
Wide Input Voltage Range (2.7V to 10V)
Precision (Trimmed) Bandgap Reference
Ensured Specs for -40°C to +125°C
1µA Off-State Quiescent Current
Thermal Overload Protection
Foldback Current Limiting
PFM, SOT-223 and 6-Lead WSON Packages
Enable Pin (LP38693)
The low thermal resistance of the WSON, SOT-223
and PFM packages allow the full operating current to
be used even in high ambient temperature
environments.
The use of a PMOS power transistor means that no
DC base drive current is required to bias it allowing
ground pin current to remain below 100 µA
regardless of load current, input voltage, or operating
temperature.
Dropout Voltage: 250 mV (typ) @ 500mA (typ. 5V
out).
APPLICATIONS
•
•
•
•
Hard Disk Drives
Notebook Computers
Battery Powered Devices
Portable Instrumentation
Ground Pin Current: 55 µA (typ) at full load.
Precision Output Voltage: 2.0% (25°C) accuracy.
Typical Application Circuits
VIN
VOUT
VIN
VOUT
LP38691
**
SNS
1 PF *
GND
1 PF *
VIN
VOUT
VIN
VEN
1 PF *
VEN
VOUT
LP38693
**
SNS
GND
1 PF *
* Minimum value required for stability.
**WSON package devices only.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2013, Texas Instruments Incorporated
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Connection Diagrams
VEN 1
N/C 2
5 GND
VOUT 3
VIN 4
Figure 1. PFM (LP38691DT-X.X) – Top View
See Package Number NDP0003B
VIN
1
GND
2
N/C
3
Exposed Pad
on Bottom
(DAP)
6
VIN
5
4
Figure 2. SOT-223 (LP38693MP-X.X) – Top View
See Package Number NDC0005A
VIN
1
SNS
GND
2
VOUT
VEN
3
Figure 3. 6-Lead WSON (LP38691SD-X.X) – Top
View
See Package Number NGG0006A
Exposed Pad
on Bottom
(DAP)
6
VIN
5
SNS
4
VOUT
Figure 4. 6-Lead WSON (LP38693SD-X.X) – Top
View
See Package Number NGG
PIN DESCRIPTIONS
Pin
Description
VIN
This is the input supply voltage to the regulator. For WSON devices, both VIN pins must be tied together for
full current operation (250mA maximum per pin).
GND
Circuit ground for the regulator. For the PFM and SOT-223 packages this is thermally connected to the die
and functions as a heat sink when the soldered down to a large copper plane.
SNS
Output sense pin allows remote sensing at the load which will eliminate the error in output voltage due to
voltage drops caused by the resistance in the traces between the regulator and the load. This pin must be
tied to VOUT.
VEN
The enable pin allows the part to be turned ON and OFF by pulling this pin high or low.
VOUT
Regulated output voltage
DAP
WSON Only - The DAP (Exposed Pad) functions as a thermal connection when soldered to a copper plane.
See WSON MOUNTING section in APPLICATION HINTS for more information.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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ABSOLUTE MAXIMUM RATINGS (1) (2)
−65°C to +150°C
Storage Temperature Range
Lead Temp. (Soldering, 5 seconds)
260°C
ESD Rating (3)
2 kV
Power Dissipation (4)
Internally Limited
V(max) All pins (with respect to GND)
-0.3V to 12V
IOUT (5)
Internally Limited
Junction Temperature
−40°C to +150°C
(1)
(2)
(3)
(4)
(5)
Absolute maximum ratings indicate limits beyond which damage to the component may occur. Operating ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications, see Electrical
Characteristics. Specifications do not apply when operating the device outside of its rated operating conditions.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
ESD is tested using the human body model which is a 100pF capacitor discharged through a 1.5k resistor into each pin.
At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink values (if a
heatsink is used). The junction-to-ambient thermal resistance ( θJ-A) for the PFM is approximately 90°C/W for a PC board mounting with
the device soldered down to minimum copper area (less than 0.1 square inch). If one square inch of copper is used as a heat dissipator
for the PFM, the θJ-A drops to approximately 50°C/W. The SOT-223 package has a θJ-A of approximately 125°C/W when soldered down
to a minimum sized pattern (less than 0.1 square inch) and approximately 70°C/W when soldered to a copper area of one square inch.
The θJ-A values for the WSON package are also dependent on trace area, copper thickness, and the number of thermal vias used (refer
to the TI (AN-1187 Application Report) and the WSON MOUNTING section in this datasheet). If power dissipation causes the junction
temperature to exceed specified limits, the device will go into thermal shutdown.
If used in a dual-supply system where the regulator load is returned to a negative supply, the output pin must be diode clamped to
ground.
OPERATING RATINGS
VIN Supply Voltage
2.7V to 10V
−40°C to +125°C
Operating Junction Temperature Range
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ELECTRICAL CHARACTERISTICS
Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the full operating temperature range.
Unless otherwise specified: VIN = VOUT + 1V, CIN = COUT = 10 µF, ILOAD = 10mA. Min/Max limits are specified through testing,
statistical correlation, or design.
Symbol
Parameter
Conditions
Min
Typ (1)
Max
-2.0
2.0
-4.0
4.0
Units
VO
Output Voltage Tolerance
100 µA < IL < 0.5A
VO + 1V ≤ VIN ≤ 10V
ΔVO/ΔVIN
Output Voltage Line Regulation (2)
VO + 0.5V ≤ VIN ≤ 10V
IL = 25mA
0.03
0.1
%/V
ΔVO/ΔIL
Output Voltage Load Regulation (3)
1 mA < IL < 0.5A
VIN = VO + 1V
1.8
5
%/A
(VO = 2.5V)
IL = 0.1A
IL = 0.5A
80
430
145
725
(VO = 3.3V)
IL = 0.1A
IL = 0.5A
65
330
110
550
(VO = 5V)
IL = 0.1A
IL = 0.5A
45
250
100
450
VIN ≤ 10V, IL =100 µA - 0.5A
55
100
VEN ≤ 0.4V, (LP38693 Only)
0.001
VIN - VOUT
Dropout Voltage (4)
IQ
Quiescent Current
IL(MIN)
Minimum Load Current
VIN - VO ≤ 4V
IFB
Foldback Current Limit
VIN - VO > 5V
350
VIN - VO < 4V
850
VIN = VO + 2V(DC), with 1V(p-p) /
120Hz Ripple
55
Ripple Rejection
TSD
Thermal Shutdown Activation
(Junction Temp)
160
TSD (HYST)
Thermal Shutdown Hysteresis
(Junction Temp)
10
en
Output Noise
BW = 10Hz to 10kHz
VO = 3.3V
0.7
VO (LEAK)
Output Leakage Current
VO = VO(NOM) + 1V @ 10VIN
0.5
VEN
Enable Voltage (LP38693 Only)
Output = OFF
(1)
(2)
(3)
(4)
4
Enable Pin Leakage (LP38693
Only)
mV
µA
100
PSRR
IEN
1
%VOUT
mA
dB
°C
µV/√Hz
12
µA
0.4
Output = ON, VIN = 4V
1.8
Output = ON, VIN = 6V
3.0
Output = ON, VIN = 10V
4.0
VEN = 0V or 10V, VIN = 10V
-1
V
0.001
1
µA
Typical numbers represent the most likely parametric norm for 25°C operation.
Output voltage line regulation is defined as the change in output voltage from nominal value resulting from a change in input voltage.
Output voltage load regulation is defined as the change in output voltage from nominal value as the load current increases from 1mA to
full load.
Dropout voltage is defined as the minimum input to output differential required to maintain the output within 100mV of nominal value.
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BLOCK DIAGRAMS
VIN
P-FET
N/C
+
ENABLE
LOGIC
P-FET
MOSFET
DRIVER
FOLDBACK
CURRENT
LIMITING
VOUT
SNS
THERMAL
SHUTDOWN
1.25V
REFERENCE
R1
R2
GND
Figure 5. LP38691 Functional Diagram (WSON)
VIN
P-FET
+
ENABLE
LOGIC
P-FET
MOSFET
DRIVER
FOLDBACK
CURRENT
LIMITING
THERMAL
SHUTDOWN
VOUT
1.25V
REFERENCE
R1
R2
GND
Figure 6. LP38691 Functional Diagram (PFM)
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VIN
P-FET
VEN
ENABLE
LOGIC
+
P-FET
MOSFET
DRIVER
FOLDBACK
CURRENT
LIMITING
VOUT
SNS
THERMAL
SHUTDOWN
1.25V
REFERENCE
R1
R2
GND
Figure 7. LP38693 Functional Diagram (WSON)
VIN
P-FET
VEN
ENABLE
LOGIC
+
P-FET
MOSFET
DRIVER
FOLDBACK
CURRENT
LIMITING
THERMAL
SHUTDOWN
VOUT
1.25V
REFERENCE
R1
R2
GND
Figure 8. LP38693 Functional Diagram (SOT-223)
6
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TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise specified: TJ = 25°C, CIN = COUT = 10 µF, Enable pin is tied to VIN (LP38693 only), VOUT = 1.8V, VIN = VOUT
+1V, IL = 10mA.
Noise vs Frequency
Noise vs Frequency
Figure 9.
Figure 10.
Noise vs Frequency
Ripple Rejection
60
RIPPLE REJECTION (dB)
50
40
30
COUT = 10 PF
20
VIN(DC) = 5.3V
VIN(AC) = 1V(p-p)
10
VOUT = 3.3V
0
10
100
1k
10k
100k
FREQUENCY (Hz)
Figure 11.
Figure 12.
Ripple Rejection
60
50
50
RIPPLE REJECTION (dB)
RIPPLE REJECTION (dB)
Ripple Rejection
60
40
30
COUT = 100 PF
20
VIN(DC) = 5.3V
VIN(AC) = 1V(p-p)
10
40
30
COUT = 1 PF
20
VIN(DC) = 5.3V
VIN(AC) = 1V(p-p)
10
VOUT = 3.3V
VOUT = 3.3V
0
0
10
100
1k
10k
100k
10
FREQUENCY (Hz)
100
1k
10k
100k
FREQUENCY (Hz)
Figure 13.
Figure 14.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified: TJ = 25°C, CIN = COUT = 10 µF, Enable pin is tied to VIN (LP38693 only), VOUT = 1.8V, VIN = VOUT
+1V, IL = 10mA.
Line Transient Response
Line Transient Response
VOUT = 3.3V
COUT = 100 PF
'VOUT (mV)
20
10
VOUT
0
-10
-20
4
VIN (V)
5
VIN
3
200 Ps/DIV
8
Figure 15.
Figure 16.
Line Transient Response
Load Transient Response
Figure 17.
Figure 18.
Load Transient Response
VOUT vs Temperature (5.0V)
Figure 19.
Figure 20.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified: TJ = 25°C, CIN = COUT = 10 µF, Enable pin is tied to VIN (LP38693 only), VOUT = 1.8V, VIN = VOUT
+1V, IL = 10mA.
VOUT vs Temperature (3.3V)
VOUT vs Temperature (2.5V)
Figure 21.
Figure 22.
VOUT vs Temperature (1.8V)
VOUT vs VIN (1.8V)
Figure 23.
Figure 24.
VOUT vs VIN, Power-Up
VOUT vs VEN, ON (LP38693 Only)
Figure 25.
Figure 26.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified: TJ = 25°C, CIN = COUT = 10 µF, Enable pin is tied to VIN (LP38693 only), VOUT = 1.8V, VIN = VOUT
+1V, IL = 10mA.
VOUT vs VEN, OFF (LP38693 Only)
Enable Voltage vs Temperature
Figure 27.
Figure 28.
Load Regulation vs Temperature
Line Regulation vs Temperature
Figure 29.
Figure 30.
MIN VIN vs IOUT
Dropout Voltage vs IOUT
2.7
900
800
2.6
700
VDROPOUT (mV)
MIN VIN (V)
2.5
2.4
-40°C
2.3
2.2
500
400
125°C
300
25°C
125°C
2.1
-40°C
600
200
100
25°C
2
0
0
100
200
300
400
500
0
200
300
400
500
IOUT (mA)
IOUT (mA)
Figure 31.
10
100
Figure 32.
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APPLICATION HINTS
EXTERNAL CAPACITORS
Like any low-dropout regulator, external capacitors are required to assure stability. These capacitors must be
correctly selected for proper performance.
INPUT CAPACITOR:
An input capacitor of at least 1µF is required (ceramic recommended). The capacitor must be located not more
than one centimeter from the input pin and returned to a clean analog ground.
OUTPUT CAPACITOR:
An output capacitor is required for loop stability. It must be located less than 1 centimeter from the device and
connected directly to the output and ground pins using traces which have no other currents flowing through them.
The minimum amount of output capacitance that can be used for stable operation is 1µF. Ceramic capacitors are
recommended (the LP38691/3 was designed for use with ultra low ESR capacitors). The LP38691/3 is stable
with any output capacitor ESR between zero and 100 Ohms.
ENABLE PIN (LP38693 only):
The LP38693 has an Enable pin (EN) which allows an external control signal to turn the regulator output On and
Off. The Enable On/Off threshold has no hysteresis. The voltage signal must rise and fall cleanly, and promptly,
through the ON and OFF voltage thresholds. The Enable pin has no internal pull-up or pull-down to establish a
default condition and, as a result, this pin must be terminated either actively or passively. If the Enable pin is
driven from a source that actively pulls high and low, the drive voltage should not be allowed to go below ground
potential or higher than VIN. If the application does not require the Enable function, the pin should be connected
directly to the VIN pin.
Foldback Current Limiting:
Foldback current limiting is built into the LP38691/3 which reduces the amount of output current the part can
deliver as the output voltage is reduced. The amount of load current is dependent on the differential voltage
between VIN and VOUT. Typically, when this differential voltage exceeds 5V, the load current will limit at about 350
mA. When the VIN - VOUT differential is reduced below 4V, load current is limited to about 850 mA.
SELECTING A CAPACITOR
It is important to note that capacitance tolerance and variation with temperature must be taken into consideration
when selecting a capacitor so that the minimum required amount of capacitance is provided over the full
operating temperature range.
Capacitor Characteristics
CERAMIC
For values of capacitance in the 10 to 100 µF range, ceramics are usually larger and more costly than tantalums
but give superior AC performance for bypassing high frequency noise because of very low ESR (typically less
than 10 mΩ). However, some dielectric types do not have good capacitance characteristics as a function of
voltage and temperature.
Z5U and Y5V dielectric ceramics have capacitance that drops severely with applied voltage. A typical Z5U or
Y5V capacitor can lose 60% of its rated capacitance with half of the rated voltage applied to it. The Z5U and Y5V
also exhibit a severe temperature effect, losing more than 50% of nominal capacitance at high and low limits of
the temperature range.
X7R and X5R dielectric ceramic capacitors are strongly recommended if ceramics are used, as they typically
maintain a capacitance range within ±20% of nominal over full operating ratings of temperature and voltage. Of
course, they are typically larger and more costly than Z5U/Y5U types for a given voltage and capacitance.
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TANTALUM
Solid Tantalum capacitors have good temperature stability: a high quality Tantalum will typically show a
capacitance value that varies less than 10-15% across the full temperature range of -40°C to +125°C. ESR will
vary only about 2X going from the high to low temperature limits.
REVERSE VOLTAGE
A reverse voltage condition will exist when the voltage at the output pin is higher than the voltage at the input pin.
Typically this will happen when VIN is abruptly taken low and COUT continues to hold a sufficient charge such that
the input to output voltage becomes reversed. A less common condition is when an alternate voltage source is
connected to the output.
There are two possible paths for current to flow from the output pin back to the input during a reverse voltage
condition.
1. While VIN is high enough to keep the control circuity alive, and the Enable pin (LP38693 only) is above the
VEN(ON) threshold, the control circuitry will attempt to regulate the output voltage. If the input voltage is less
than the programmed output voltage, the control circuit will drive the gate of the pass element to the full ON
condition. In this condition, reverse current will flow from the output pin to the input pin, limited only by the
RDS(ON) of the pass element and the output to input voltage differential. Discharging an output capacitor up to
1000 μF in this manner will not damage the device as the current will rapidly decay. However, continuous
reverse current should be avoided. When the Enable pin is low this condition will be prevented.
2. The internal PFET pass element has an inherent parasitic diode. During normal operation, the input voltage
is higher than the output voltage and the parasitic diode is reverse biased. However, when VIN is below the
value where the control circuity is alive, or the Enable pin is low (LP38693 only), and the output voltage is
more than 500 mV (typical) above the input voltage the parasitic diode becomes forward biased and current
flows from the output pin to the input pin through the diode. The current in the parasitic diode should be
limited to less than 1A continuous and 5A peak.
If used in a dual-supply system where the regulator output load is returned to a negative supply, the output
pin must be diode clamped to ground to limit the negative voltage transition. A Schottky diode is
recommended for this protective clamp.
PCB LAYOUT
Good PC layout practices must be used or instability can be induced because of ground loops and voltage drops.
The input and output capacitors must be directly connected to the input, output, and ground pins of the regulator
using traces which do not have other currents flowing in them (Kelvin connect).
The best way to do this is to lay out CIN and COUT near the device with short traces to the VIN, VOUT, and ground
pins. The regulator ground pin should be connected to the external circuit ground so that the regulator and its
capacitors have a "single point ground".
It should be noted that stability problems have been seen in applications where "vias" to an internal ground plane
were used at the ground points of the IC and the input and output capacitors. This was caused by varying ground
potentials at these nodes resulting from current flowing through the ground plane. Using a single point ground
technique for the regulator and it’s capacitors fixed the problem. Since high current flows through the traces
going into VIN and coming from VOUT, Kelvin connect the capacitor leads to these pins so there is no voltage drop
in series with the input and output capacitors.
WSON MOUNTING
The NGG0006A (No Pullback) 6-Lead WSON package requires specific mounting techniques which are detailed
in the TI AN-1187 Application Report. Referring to the section PCB Design Recommendations (Page 5), it should
be noted that the pad style which should be used with the WSON package is the NSMD (non-solder mask
defined) type. Additionally, it is recommended the PCB terminal pads to be 0.2 mm longer than the package
pads to create a solder fillet to improve reliability and inspection.
The input current is split between two VIN pins, 1 and 6. The two VIN pins must be connected together to ensure
that the device can meet all specifications at the rated current.
The thermal dissipation of the WSON package is directly related to the printed circuit board construction and the
amount of additional copper area connected to the DAP.
12
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The DAP (exposed pad) on the bottom of the WSON package is connected to the die substrate with a conductive
die attach adhesive. The DAP has no direct electrical (wire) connection to any of the pins. There is a parasitic PN
junction between the die substrate and the device ground. As such, it is strongly recommend that the DAP be
connected directly to the ground at device lead 2 (i.e. GND). Alternately, but not recommended, the DAP may be
left floating (i.e. no electrical connection). The DAP must not be connected to any potential other than ground.
For the LP38691SD and LP38693SD in the NGG0006A 6-Lead WSON package, the junction-to-case thermal
rating, θJC, is 10.4°C/W, where the case is the bottom of the package at the center of the DAP. The junction-toambient thermal performance for the LP38691SD and LP38693SD in the NGG0006A 6-Lead WSON package,
using the JEDEC JESD51 standards is summarized in the following table:
Board
Type
Thermal
Vias
θJC
θJA
JEDEC
2-Layer
JESD 51-3
None
10.4°C/W
237° C/W
1
10.4°C/W
74° C/W
2
10.4°C/W
60° C/W
4
10.4°C/W
49° C/W
6
10.4°C/W
45° C/W
JEDEC
4-Layer
JESD 51-7
RFI/EMI SUSCEPTIBILITY
RFI (radio frequency interference) and EMI (electromagnetic interference) can degrade any integrated circuit’s
performance because of the small dimensions of the geometries inside the device. In applications where circuit
sources are present which generate signals with significant high frequency energy content (> 1 MHz), care must
be taken to ensure that this does not affect the IC regulator.
If RFI/EMI noise is present on the input side of the regulator (such as applications where the input source comes
from the output of a switching regulator), good ceramic bypass capacitors must be used at the input pin of the IC.
If a load is connected to the IC output which switches at high speed (such as a clock), the high-frequency current
pulses required by the load must be supplied by the capacitors on the IC output. Since the bandwidth of the
regulator loop is less than 100 kHz, the control circuitry cannot respond to load changes above that frequency.
This means the effective output impedance of the IC at frequencies above 100 kHz is determined only by the
output capacitor(s).
In applications where the load is switching at high speed, the output of the IC may need RF isolation from the
load. It is recommended that some inductance be placed between the output capacitor and the load, and good
RF bypass capacitors be placed directly across the load.
PCB layout is also critical in high noise environments, since RFI/EMI is easily radiated directly into PC traces.
Noisy circuitry should be isolated from "clean" circuits where possible, and grounded through a separate path. At
MHz frequencies, ground planes begin to look inductive and RFI/ EMI can cause ground bounce across the
ground plane. In multi-layer PCB applications, care should be taken in layout so that noisy power and ground
planes do not radiate directly into adjacent layers which carry analog power and ground.
OUTPUT NOISE
Noise is specified in two ways: Spot Noise or Output Noise Density is the RMS sum of all noise sources,
measured at the regulator output, at a specific frequency (measured with a 1Hz bandwidth). This type of noise is
usually plotted on a curve as a function of frequency. Total Output Noise or Broad-Band Noise is the RMS
sum of spot noise over a specified bandwidth, usually several decades of frequencies.
Attention should be paid to the units of measurement. Spot noise is measured in units µV/root-Hz or nV/root-Hz
and total output noise is measured in µV(rms)
The primary source of noise in low-dropout regulators is the internal reference. Noise can be reduced in two
ways: by increasing the transistor area or by increasing the current drawn by the internal reference. Increasing
the area will decrease the chance of fitting the die into a smaller package. Increasing the current drawn by the
internal reference increases the total supply current (ground pin current).
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LP38691 LP38693
13
LP38691, LP38693
SNVS321K – JANUARY 2005 – REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision J (April 2013) to Revision K
•
14
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 13
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LP38691 LP38693
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LP38691DT-1.8
NRND
TO-252
NDP
3
75
TBD
Call TI
Call TI
-40 to 125
LP38691
DT-1.8
LP38691DT-1.8/NOPB
ACTIVE
TO-252
NDP
3
75
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
LP38691
DT-1.8
LP38691DT-2.5
NRND
TO-252
NDP
3
75
TBD
Call TI
Call TI
-40 to 125
LP38691
DT-2.5
LP38691DT-2.5/NOPB
ACTIVE
TO-252
NDP
3
75
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
LP38691
DT-2.5
LP38691DT-3.3
NRND
TO-252
NDP
3
75
TBD
Call TI
Call TI
-40 to 125
LP38691
DT-3.3
LP38691DT-3.3/NOPB
ACTIVE
TO-252
NDP
3
75
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
LP38691
DT-3.3
LP38691DT-5.0
ACTIVE
TO-252
NDP
3
75
TBD
Call TI
Call TI
-40 to 125
LP38691DT-5.0/NOPB
ACTIVE
TO-252
NDP
3
75
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
LP38691DTX-1.8
ACTIVE
TO-252
NDP
3
2500
TBD
Call TI
Call TI
-40 to 125
LP38691DTX-1.8/NOPB
ACTIVE
TO-252
NDP
3
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
LP38691DTX-2.5
ACTIVE
TO-252
NDP
3
2500
TBD
Call TI
Call TI
-40 to 125
LP38691DTX-2.5/NOPB
ACTIVE
TO-252
NDP
3
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
LP38691
DT-2.5
LP38691DTX-3.3
NRND
TO-252
NDP
3
2500
TBD
Call TI
Call TI
-40 to 125
LP38691
DT-3.3
LP38691DTX-3.3/NOPB
ACTIVE
TO-252
NDP
3
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
LP38691
DT-3.3
LP38691DTX-5.0
ACTIVE
TO-252
NDP
3
2500
TBD
Call TI
Call TI
-40 to 125
LP38691DTX-5.0/NOPB
ACTIVE
TO-252
NDP
3
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
LP38691
DT-5.0
LP38691QSD-1.8/NOPB
ACTIVE
WSON
NGG
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L256B
LP38691QSD-2.5/NOPB
ACTIVE
WSON
NGG
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L257B
Addendum-Page 1
LP38691
DT-5.0
LP38691
DT-1.8
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
1-Nov-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LP38691QSD-3.3/NOPB
ACTIVE
WSON
NGG
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L258B
LP38691QSD-5.0/NOPB
ACTIVE
WSON
NGG
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L259B
LP38691QSDX-1.8/NOPB
ACTIVE
WSON
NGG
6
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L256B
LP38691QSDX-2.5/NOPB
ACTIVE
WSON
NGG
6
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L257B
LP38691QSDX-3.3/NOPB
ACTIVE
WSON
NGG
6
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L258B
LP38691QSDX-5.0/NOPB
ACTIVE
WSON
NGG
6
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L259B
LP38691SD-1.8
NRND
WSON
NGG
6
1000
TBD
Call TI
Call TI
-40 to 125
L118B
LP38691SD-1.8/NOPB
ACTIVE
WSON
NGG
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L118B
LP38691SD-2.5/NOPB
ACTIVE
WSON
NGG
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L119B
LP38691SD-3.3/NOPB
ACTIVE
WSON
NGG
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L120B
LP38691SD-5.0/NOPB
ACTIVE
WSON
NGG
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L121B
LP38691SDX-1.8/NOPB
ACTIVE
WSON
NGG
6
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L118B
LP38691SDX-2.5/NOPB
ACTIVE
WSON
NGG
6
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L119B
LP38691SDX-3.3/NOPB
ACTIVE
WSON
NGG
6
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L120B
LP38691SDX-5.0/NOPB
ACTIVE
WSON
NGG
6
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L121B
LP38693MP-1.8
NRND
SOT-223
NDC
5
1000
TBD
Call TI
Call TI
-40 to 125
LJVB
LP38693MP-1.8/NOPB
ACTIVE
SOT-223
NDC
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LJVB
LP38693MP-2.5/NOPB
ACTIVE
SOT-223
NDC
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LJXB
LP38693MP-3.3
NRND
SOT-223
NDC
5
1000
TBD
Call TI
Call TI
-40 to 125
LJYB
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
1-Nov-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LP38693MP-3.3/NOPB
ACTIVE
SOT-223
NDC
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LJYB
LP38693MP-5.0/NOPB
ACTIVE
SOT-223
NDC
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LJZB
LP38693MPX-1.8/NOPB
ACTIVE
SOT-223
NDC
5
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LJVB
LP38693MPX-2.5/NOPB
ACTIVE
SOT-223
NDC
5
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LJXB
LP38693MPX-3.3
NRND
SOT-223
NDC
5
2000
TBD
Call TI
Call TI
-40 to 125
LJYB
LP38693MPX-3.3/NOPB
ACTIVE
SOT-223
NDC
5
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LJYB
LP38693MPX-5.0/NOPB
ACTIVE
SOT-223
NDC
5
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LJZB
LP38693QSD-1.8/NOPB
ACTIVE
WSON
NGG
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L260B
LP38693QSD-2.5/NOPB
ACTIVE
WSON
NGG
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L261B
LP38693QSD-3.3/NOPB
ACTIVE
WSON
NGG
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L262B
LP38693QSD-5.0/NOPB
ACTIVE
WSON
NGG
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L263B
LP38693QSDX-1.8/NOPB
ACTIVE
WSON
NGG
6
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L260B
LP38693QSDX-2.5/NOPB
ACTIVE
WSON
NGG
6
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L261B
LP38693QSDX-3.3/NOPB
ACTIVE
WSON
NGG
6
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L262B
LP38693QSDX-5.0/NOPB
ACTIVE
WSON
NGG
6
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L263B
LP38693SD-1.8
NRND
WSON
NGG
6
1000
TBD
Call TI
Call TI
-40 to 125
L128B
LP38693SD-1.8/NOPB
ACTIVE
WSON
NGG
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L128B
LP38693SD-2.5/NOPB
ACTIVE
WSON
NGG
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L129B
LP38693SD-3.3
NRND
WSON
NGG
6
1000
TBD
Call TI
Call TI
-40 to 125
L130B
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
1-Nov-2013
Status
(1)
LP38693SD-3.3/NOPB
Package Type Package Pins Package
Drawing
Qty
ACTIVE
WSON
NGG
6
1000
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L130B
(4/5)
LP38693SD-5.0
NRND
WSON
NGG
6
1000
TBD
Call TI
Call TI
-40 to 125
L131B
LP38693SD-5.0/NOPB
ACTIVE
WSON
NGG
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L131B
LP38693SDX-1.8/NOPB
ACTIVE
WSON
NGG
6
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L128B
LP38693SDX-2.5/NOPB
ACTIVE
WSON
NGG
6
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L129B
LP38693SDX-3.3/NOPB
ACTIVE
WSON
NGG
6
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L130B
LP38693SDX-5.0/NOPB
ACTIVE
WSON
NGG
6
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L131B
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 4
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LP38691, LP38691-Q1, LP38693, LP38693-Q1 :
• Catalog: LP38691, LP38693
• Automotive: LP38691-Q1, LP38693-Q1
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 5
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LP38691DTX-1.8/NOPB
TO-252
NDP
3
2500
330.0
16.4
6.9
10.5
2.7
8.0
16.0
Q2
LP38691DTX-2.5/NOPB
TO-252
NDP
3
2500
330.0
16.4
6.9
10.5
2.7
8.0
16.0
Q2
LP38691DTX-3.3
TO-252
NDP
3
2500
330.0
16.4
6.9
10.5
2.7
8.0
16.0
Q2
LP38691DTX-3.3/NOPB
TO-252
NDP
3
2500
330.0
16.4
6.9
10.5
2.7
8.0
16.0
Q2
LP38691DTX-5.0/NOPB
TO-252
NDP
3
2500
330.0
16.4
6.9
10.5
2.7
8.0
16.0
Q2
LP38691QSD-1.8/NOPB
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38691QSD-2.5/NOPB
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38691QSD-3.3/NOPB
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38691QSD-5.0/NOPB
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38691QSDX-1.8/NOPB WSON
NGG
6
4500
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38691QSDX-2.5/NOPB WSON
NGG
6
4500
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38691QSDX-3.3/NOPB WSON
NGG
6
4500
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38691QSDX-5.0/NOPB WSON
NGG
6
4500
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38691SD-1.8
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38691SD-1.8/NOPB
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38691SD-2.5/NOPB
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38691SD-3.3/NOPB
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38691SD-5.0/NOPB
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LP38691SDX-1.8/NOPB
WSON
NGG
6
4500
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38691SDX-2.5/NOPB
WSON
NGG
6
4500
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38691SDX-3.3/NOPB
WSON
NGG
6
4500
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38691SDX-5.0/NOPB
WSON
NGG
6
4500
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38693MP-1.8
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP38693MP-1.8/NOPB
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP38693MP-2.5/NOPB
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP38693MP-3.3
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP38693MP-3.3/NOPB
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP38693MP-5.0/NOPB
SOT-223
NDC
5
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP38693MPX-1.8/NOPB SOT-223
NDC
5
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP38693MPX-2.5/NOPB SOT-223
NDC
5
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
SOT-223
NDC
5
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP38693MPX-3.3/NOPB SOT-223
NDC
5
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP38693MPX-5.0/NOPB SOT-223
NDC
5
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LP38693QSD-1.8/NOPB
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38693QSD-2.5/NOPB
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38693QSD-3.3/NOPB
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38693QSD-5.0/NOPB
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38693QSDX-1.8/NOPB WSON
NGG
6
4500
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38693QSDX-2.5/NOPB WSON
NGG
6
4500
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38693QSDX-3.3/NOPB WSON
NGG
6
4500
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38693QSDX-5.0/NOPB WSON
NGG
6
4500
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38693MPX-3.3
LP38693SD-1.8
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38693SD-1.8/NOPB
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38693SD-2.5/NOPB
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38693SD-3.3
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38693SD-3.3/NOPB
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38693SD-5.0
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38693SD-5.0/NOPB
WSON
NGG
6
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38693SDX-1.8/NOPB
WSON
NGG
6
4500
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38693SDX-2.5/NOPB
WSON
NGG
6
4500
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38693SDX-3.3/NOPB
WSON
NGG
6
4500
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LP38693SDX-5.0/NOPB
WSON
NGG
6
4500
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LP38691DTX-1.8/NOPB
TO-252
NDP
3
2500
367.0
367.0
38.0
LP38691DTX-2.5/NOPB
TO-252
NDP
3
2500
367.0
367.0
38.0
LP38691DTX-3.3
TO-252
NDP
3
2500
367.0
367.0
35.0
LP38691DTX-3.3/NOPB
TO-252
NDP
3
2500
367.0
367.0
38.0
LP38691DTX-5.0/NOPB
TO-252
NDP
3
2500
367.0
367.0
38.0
LP38691QSD-1.8/NOPB
WSON
NGG
6
1000
210.0
185.0
35.0
LP38691QSD-2.5/NOPB
WSON
NGG
6
1000
210.0
185.0
35.0
LP38691QSD-3.3/NOPB
WSON
NGG
6
1000
210.0
185.0
35.0
LP38691QSD-5.0/NOPB
WSON
NGG
6
1000
210.0
185.0
35.0
LP38691QSDX-1.8/NOPB
WSON
NGG
6
4500
367.0
367.0
35.0
LP38691QSDX-2.5/NOPB
WSON
NGG
6
4500
367.0
367.0
35.0
LP38691QSDX-3.3/NOPB
WSON
NGG
6
4500
367.0
367.0
35.0
LP38691QSDX-5.0/NOPB
WSON
NGG
6
4500
367.0
367.0
35.0
LP38691SD-1.8
WSON
NGG
6
1000
210.0
185.0
35.0
LP38691SD-1.8/NOPB
WSON
NGG
6
1000
210.0
185.0
35.0
LP38691SD-2.5/NOPB
WSON
NGG
6
1000
210.0
185.0
35.0
LP38691SD-3.3/NOPB
WSON
NGG
6
1000
210.0
185.0
35.0
LP38691SD-5.0/NOPB
WSON
NGG
6
1000
210.0
185.0
35.0
LP38691SDX-1.8/NOPB
WSON
NGG
6
4500
367.0
367.0
35.0
LP38691SDX-2.5/NOPB
WSON
NGG
6
4500
367.0
367.0
35.0
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LP38691SDX-3.3/NOPB
WSON
NGG
6
4500
367.0
367.0
35.0
LP38691SDX-5.0/NOPB
WSON
NGG
6
4500
367.0
367.0
35.0
LP38693MP-1.8
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP38693MP-1.8/NOPB
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP38693MP-2.5/NOPB
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP38693MP-3.3
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP38693MP-3.3/NOPB
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP38693MP-5.0/NOPB
SOT-223
NDC
5
1000
367.0
367.0
35.0
LP38693MPX-1.8/NOPB
SOT-223
NDC
5
2000
367.0
367.0
35.0
LP38693MPX-2.5/NOPB
SOT-223
NDC
5
2000
367.0
367.0
35.0
LP38693MPX-3.3
SOT-223
NDC
5
2000
367.0
367.0
35.0
LP38693MPX-3.3/NOPB
SOT-223
NDC
5
2000
367.0
367.0
35.0
LP38693MPX-5.0/NOPB
SOT-223
NDC
5
2000
367.0
367.0
35.0
LP38693QSD-1.8/NOPB
WSON
NGG
6
1000
210.0
185.0
35.0
LP38693QSD-2.5/NOPB
WSON
NGG
6
1000
210.0
185.0
35.0
LP38693QSD-3.3/NOPB
WSON
NGG
6
1000
210.0
185.0
35.0
LP38693QSD-5.0/NOPB
WSON
NGG
6
1000
210.0
185.0
35.0
LP38693QSDX-1.8/NOPB
WSON
NGG
6
4500
367.0
367.0
35.0
LP38693QSDX-2.5/NOPB
WSON
NGG
6
4500
367.0
367.0
35.0
LP38693QSDX-3.3/NOPB
WSON
NGG
6
4500
367.0
367.0
35.0
LP38693QSDX-5.0/NOPB
WSON
NGG
6
4500
367.0
367.0
35.0
LP38693SD-1.8
WSON
NGG
6
1000
210.0
185.0
35.0
LP38693SD-1.8/NOPB
WSON
NGG
6
1000
210.0
185.0
35.0
LP38693SD-2.5/NOPB
WSON
NGG
6
1000
210.0
185.0
35.0
LP38693SD-3.3
WSON
NGG
6
1000
210.0
185.0
35.0
LP38693SD-3.3/NOPB
WSON
NGG
6
1000
210.0
185.0
35.0
LP38693SD-5.0
WSON
NGG
6
1000
210.0
185.0
35.0
LP38693SD-5.0/NOPB
WSON
NGG
6
1000
210.0
185.0
35.0
LP38693SDX-1.8/NOPB
WSON
NGG
6
4500
367.0
367.0
35.0
LP38693SDX-2.5/NOPB
WSON
NGG
6
4500
367.0
367.0
35.0
LP38693SDX-3.3/NOPB
WSON
NGG
6
4500
367.0
367.0
35.0
LP38693SDX-5.0/NOPB
WSON
NGG
6
4500
367.0
367.0
35.0
Pack Materials-Page 4
MECHANICAL DATA
NDP0003B
TD03B (Rev F)
www.ti.com
MECHANICAL DATA
NDC0005A
www.ti.com
MECHANICAL DATA
NGG0006A
SDE06A (Rev A)
www.ti.com
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