ON HBL1015T1G Led shunt Datasheet

HBL1015, HBL1025 Series
LED Shunt
The HBL1015/25 Series are electronic shunts which provide a
current bypass in the case of LEDs going into open circuit. LEDs are by
nature quite fragile when subjected to transients and surge conditions.
There are also many cases where high reliability of the LED lighting
must be maintained such as in headlights, lighthouses, bridges, aircraft,
runways and so forth. In these cases the low cost addition of the HBL
device will provide full assurance that an entire string of LEDs will not
extinguish should one LED fail open. The HBL device is also
applicable to other loads where circuit continuity is required. The
devices can be used with LED string currents from 140 to 500 mA.
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Anode
Control
Circuit
Features
•
•
•
•
•
A Bidirectional Device
Automatically Resets Itself if the LED Heals Itself or is Replaced
ON−State Voltage Typically 1.8 V
OFF−State Current less than 0.5 mA
These are Pb−Free Devices
Cathode
5
Typical Applications
•
•
•
•
•
1
LEDs where Preventive Maintenance is Impractical
LED Headlights
LEDs with High Reliability Requirements
Crowbar Protection for Open Circuit Conditions
Overvoltage Protection for Sensitive Circuits
TSOP−5
CASE 483
MARKING DIAGRAM
5
xxx MG
G
1
xxx
M
G
1. Device is bidirectional. Either configuration shown is acceptable.
2. Pin 2 must be electrically floating
Figure 1. Pin Connections
= Specific Device Code
(015 or 025)
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
June, 2015 − Rev. 4
1
Publication Order Number:
HBL1015/D
HBL1015, HBL1025 Series
MAXIMUM RATINGS
Rating
Symbol
On−State Current, (TA = 25°C)
(Note 1)
(Note 2)
(Note 3)
Value
Unit
IT(AVG)
mA
500
425
250
°C/W
Thermal Resistance, Junction−to−Air
(Note 1)
(Note 2)
(Note 3)
qJA
Operating Temperature Range
TJ
−40 to 150
°C
Non−Operating Temperature Range
TJ
150
°C
Lead Temperature, Soldering (10 Sec)
TL
260
°C
140
150
255
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Mounted onto a 1500 mm2, Denka K1, 1.5 mm AI, 2 kV thermally conductive dielectric, 2 oz. Cu, or equivalent board. Heat sinking should
be spread equally among all pins (caution: pin 2 must be electrically isolated).
2. Mounted onto a 2−layer, 1000 mm2 per layer, 3 oz Cu, FR4 PCB. Heat sinking should be spread equally among all pins (caution: pin 2 must
be electrically isolated).
3. Mounted onto a 2−layer, 50 mm2 per layer, 1 oz Cu, FR4 PCB. Heat sinking should be spread equally among all pins (caution: pin 2 must
be electrically isolated).
NOTE: Normally this device would be mounted on the same copper heat sink and adjacent to the LED(s). If the LED(s) were to go open,
then the HBL shunt would now dissipate the power using the same copper heat sink. Since the HBL has a voltage that is lower
than that of the LED(s), then the power dissipation would be easily handled by the same heat sink as the LED.
ELECTRICAL CHARACTERISTICS (Unless otherwise noted: TA = 25°C)
Symbol
Characteristics
Min
Min
V(BR)
Breakdown Voltage: The minimum voltage across the device in or at
the breakdown region. Measured at IBR = 1 mA.
HBL1015
8.0
HBL1025
11.5
Holding Current: The minimum current required to maintain the device in the on-state.
HBL1015
125
HBL1025
125
Breakover Voltage: The voltage across the device in the breakover
region. Measured at IBO = 10 mA.
HBL1015
14.0
HBL1025
16.0
Off−State Current: The dc value of current that results from the application of the off-state voltage. This is measured at 8.0 V for
HBL1015 and 11.5 V for HBL1025.
HBL1015
0.5
HBL1025
0.5
On−State Voltage
HBL1015
1.2
1.8
2.4
HBL1025
1.2
1.8
2.4
IH
VBO
IR
VT
Typ
Max
Unit
V
mA
V
mA
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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2
HBL1015, HBL1025 Series
TYPICAL PERFORMANCE CURVES
(TA = 25°C unless otherwise noted)
20
19
120
HBL1025
Cd, CAPACITANCE (pF)
IH, HOLDING CURRENT (mA)
140
100
80 HBL1015
60
40
20
0
−50
HBL1015
17
16
15
14 HBL1025
13
12
11
−25
0
25
50
75
100
125
10
150
0
1
2
3
4
5
6
TA, AMBIENT TEMPERATURE (°C)
VOLTS (V)
Figure 2. Holding Current vs Temperature
Figure 3. Capacitance vs Voltage
15
7
8
2.5
14.5
14
VT, ON−STATE VOLTAGE (V)
VBR, BREAKDOWN VOLTAGE (V)
18
HBL1025
13.5
13
12.5
12
HBL1015
11.5
11
2.0
HBL1015/25 @ 350 mA
1.5
1.0
0.5
10.5
10
−50
−25
0
25
50
75
100
125
150
0
−50
−25
0
25
50
75
100
125
TA, AMBIENT TEMPERATURE (°C)
TA, AMBIENT TEMPERATURE (°C)
Figure 4. Breakover Voltage vs Temperature
Figure 5. On−State Voltage vs Temperature
Current
On−state
Current
Holding Current
Latching Current
Voltage
Off−state
Current
Breakdown
Voltage
Breakover
Voltage
Figure 6. I−V Characteristics
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3
150
HBL1015, HBL1025 Series
TYPICAL APPLICATION CIRCUIT
Typical Application Circuit for HBL1015
Typical Application Circuit for HBL1025
Current
Source
Current
Source
HBL1015
HBL1025
Control
Circuit
Control
Circuit
HBL1015
HBL1025
Control
Circuit
Control
Circuit
HBL1015
HBL1025
Control
Circuit
Control
Circuit
HBL1015
HBL1025
Control
Circuit
Control
Circuit
Figure 7. Typical Application Circuit
DEVICE ORDERING INFORMATION
Marking
Package
Shipping†
HBL1015T1G
015
TSOP−5
(Pb−Free)
3000 / Tape & Reel
HBL1025T1G
025
TSOP−5
(Pb−Free)
3000 / Tape & Reel
Device
†For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
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4
HBL1015, HBL1025 Series
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE K
NOTE 5
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
D 5X
0.20 C A B
0.10 T
M
2X
0.20 T
B
5
1
4
2
S
3
K
B
DETAIL Z
G
A
A
TOP VIEW
DIM
A
B
C
D
G
H
J
K
M
S
DETAIL Z
J
C
0.05
H
SIDE VIEW
C
SEATING
PLANE
END VIEW
MILLIMETERS
MIN
MAX
3.00 BSC
1.50 BSC
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
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For additional information, please contact your local
Sales Representative
HBL1015/D
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