ON MT9M034 1/3-inch cmos digital image sensor Datasheet

MT9M034
MT9M034 1/3-Inch CMOS
Digital Image Sensor
Table 1. KEY PARAMETERS
Parameter
www.onsemi.com
Value
Optical Format
1/3−inch (6 mm)
Active Pixels
1280 × 960 = 1.2 Mp
Pixel Size
3.75 μm
Color Filter Array
RGB Bayer or Monochrome
Shutter Type
Electronic Rolling Shutter
Input Clock Range
6–50 MHz
Output Clock Maximum
74.25 MHz
Output
Parallel
12−bit
Frame Rate
Full Resolution
45 fps
720p
60 fps
Responsivity
5.48 V/lux−sec
SNRMAX
43.9 dB
Maximum Dynamic Range
>115 dB
Supply Voltage
I/O
1.8 V* or 2.8 V
Digital
1.8 V
Analog
2.8 V
ILCC48 10x10
CASE 847AD
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
Applications
• Video Surveillance
• 720p60 Video Applications
• High Dynamic Range Imaging
Power Consumption
270 mW (1280 × 720
60 fps Parallel Output Linear
Mode)
460 mW (1280 × 720 60 fps
Parallel Output HDR Mode)
Operating Temperature (ambient) −TA
–30°C to + 70°C (Surveillance)
Package Options
10×10 mm 48−pin iLCC
Bare Die
*1.8 V VDD_IO is recommended due to better row noise performance
Features
•
•
•
•
•
•
•
•
•
Superior Low−light performance
HD Video (720p60)
Linear or High Dynamic Range Capture
Video/Single Frame Modes
On−chip AE and Statistics Engine
Parallel and Serial Output
Auto Black Level Calibration
Context Switching
Temperature Sensor
© Semiconductor Components Industries, LLC, 2010
May, 2017 − Rev. 9
1
Publication Order Number:
MT9M034/D
MT9M034
ORDERING INFORMATION
Table 2. AVAILABLE PART NUMBERS
Part Number
Product Description
Orderable Product Attribute Description
MT9M034I12STC−DPBR1
1.2 MP 1/3” CIS
Dry Pack with Protective Film, Double Side BBAR Glass
MT9M034I12STC−DRBR1
1.2 MP 1/3” CIS
Dry Pack without Protective Film, Double Side BBAR Glass
MT9M034I12STM−DPBR1
1.2 MP 1/3” CIS
Dry Pack with Protective Film, Double Side BBAR Glass
MT9M034I12STM−DRBR
1.2 MP 1/3” CIS
Dry Pack without Protective Film, Double Side BBAR Glass
GENERAL DESCRIPTION
The ON Semiconductor MT9M034 is a 1/3−inch CMOS
digital image sensor with an active−pixel array of 1280 (H)
× 960 (V). It captures images in either linear or high dynamic
range modes, with a rolling−shutter readout. It includes
sophisticated camera functions such as auto exposure
control, windowing, and both video and single frame modes.
It is designed for both low light and high dynamic range
scene performance. It is programmable through a simple
two−wire serial interface. The MT9M034 produces
extraordinarily clear, sharp digital pictures, and its ability to
capture both continuous video and single frames makes it the
perfect choice for a wide range of applications, including
surveillance and HD video.
The ON Semiconductor MT9M034 can be operated in its
default mode or programmed for frame size, exposure, gain,
and other parameters. The default mode output is a
960p−resolution image at 45 frames per second (fps). In
linear mode, it outputs 12−bit raw data. In high dynamic
range mode, it outputs 12−bit compressed data using parallel
output. The device may be operated in video (master) mode
or in single frame trigger mode.
FRAME_VALID and LINE_VALID signals are output on
dedicated pins, along with a synchronized pixel clock in
parallel mode.
The MT9M034 includes additional features to allow
application−specific tuning: windowing and offset,
adjustable auto−exposure control, auto black level
correction, and on−board temperature sensor. Optional
register information and histogram statistic information can
be embedded in first and last 2 lines of the image frame.
The sensor is designed to operate in a wide temperature
range (–30°C to +70°C).
FUNCTIONAL OVERVIEW
The MT9M034 is a progressive−scan sensor that
generates a stream of pixel data at a constant frame rate. It
uses an on−chip, phase−locked loop (PLL) that can be
optionally enabled to generate all internal clocks from a
single master input clock running between 6 and 50 MHz
The maximum output pixel rate is 74.25 Mp/s,
corresponding to a clock rate of 74.25 MHz. Figure 1 shows
a block diagram of the sensor.
OTPM
Memory
Active Pixel Sensor
PLL
External
Clock
(APS)
Array
Power
Timing and Control
(Sequencer)
Auto Exposure
and Stats Engine
Pixel Data Path
(Signal Processing)
Analog Processing and
A/D Conversion
Trigger
Two−Wire
Serial
Interface
Control Registers
Figure 1. Block Diagram
www.onsemi.com
2
Parallel
Output
MT9M034
analog−to−digital converter (ADC). The output from the
ADC is a 12−bit value for each pixel in the array. The ADC
output passes through a digital processing signal chain
(which provides further data path corrections and applies
digital gain). The sensor also offers a high dynamic range
mode of operation where multiple images are combined
on−chip to produce a single image at 20−bit per pixel value.
A compressing mode is further offered to allow this 20−bit
pixel value to be transmitted to the host system as a 12−bit
value with close to zero loss in image quality. The pixel data
are output at a rate of up to 74.25 Mp/s, in parallel to frame
and line synchronization signals.
User interaction with the sensor is through the two−wire
serial bus, which communicates with the array control,
analog signal chain, and digital signal chain. The core of the
sensor is a 1.2 Mp Active− Pixel Sensor array. The timing
and control circuitry sequences through the rows of the
array, resetting and then reading each row in turn. In the time
interval between resetting a row and reading that row, the
pixels in the row integrate incident light. The exposure is
controlled by varying the time interval between reset and
readout. Once a row has been read, the data from the
columns is sequenced through an analog signal chain
(providing offset correction and gain), and then through an
Master clock
(6–50 MHz)
PLL
Analog Analog
Power1 Power1 Power1
VDD_PLL VAA VAA_PIX
VDD_IO VDD
1.5kΩ2,3
1.5kΩ2
Digital
Digital I/0 Core
Power1 Power1
DOUT [11:0]
EXTCLK
PIXCLK
LINE_VALID
FRAME_VALID
SADDR
SDATA
SCLK
TRIGGER
OE_BAR
STANDBY
RESET_BAR
From
Controller
To
Controller
TEST
DGND
VDD_IO
VDD
VDD_PLL
VAA
VAA_PIX
Digital
ground
Notes:
AGND
Analog
ground
1.
2.
3.
4.
All power supplies should be adequately decoupled.
ON Semiconductor recommends a resistor value of 1.5 kΩ, but a greater value may be used for slower two-wire speed.
The serial interface output pads and VDDSLVS can be left unconnected if the parallel output interface is used.
ON Semiconductor recommends that 0.1 μF and 10 μF decoupling capacitors for each power supply are mounted as
close as possible to the pad. Actual values and results may vary depending on layout and design considerations.
Check the demo headboard schematics for circuit recommendations.
5. ON Semiconductor recommends that analog power planes are placed in a manner such that coupling with the digital
power planes is minimized.
6. I/O signals voltage must be configured to match VDD_IO voltage to minimize any leakage currents.
7. The serial interface output pads and VDDSLVS can be left unconnected if the parallel output interface is used.
Figure 2. Typical Configuration: Parallel Pixel Data Interface
www.onsemi.com
3
5
4
3
2
1
48
47
46
45
44
EXTCLK
VDD_PLL
DOUT6
DOUT5
DOUT4
DOUT3
DOUT2
DOUT1
DOUT0
DGND
43
NC
6
DGND
MT9M034
10
DOUT10
AGND
39
11
DOUT11
VAA_PIX
38
12
VDD_IO
VAA_PIX
37
13
PIXCLK
VAA
36
14
VDD
AGND
35
15
SCLK
VAA
34
16
SDATA
Reserved
33
17
RESET_BAR
Reserved
32
18
VDD_IO
Reserved
31
DGND
40
LINE_VALID
VAA
FRAME_VALID
DOUT9
TRIGGER
9
FLASH
41
TEST
NC
SADDR
DOUT8
OE_BAR
8
STANDBY
42
NC
NC
NC
DOUT7
VDD
7
19
20
21
22
23
24
25
26
27
28
29
30
Figure 3. 48 iLCC Package, Parallel Output
www.onsemi.com
4
MT9M034
Table 3. PIN DESCRIPTION
Pin Number
Name
Type
1
DOUT4
Output
Parallel pixel data output
Description
2
DOUT5
Output
Parallel pixel data output
3
DOUT6
Output
Parallel pixel data output
4
VDD_PLL
Power
PLL power
5
EXTCLK
Input
6
DGND
Power
External input clock
Digital ground
7
DOUT7
Output
Parallel pixel data output
8
DOUT8
Output
Parallel pixel data output
9
DOUT9
Output
Parallel pixel data output
10
DOUT10
Output
Parallel pixel data output
11
DOUT11
Output
Parallel pixel data output (MSB)
12
VDD_IO
Power
I/O supply power
13
PIXCLK
Output
Pixel clock out. DOUT is valid on rising edge of this clock
14
VDD
Power
Digital power
15
SCLK
Input
16
SDATA
I/O
17
RESET_BAR
Input
18
VDD_IO
Power
I/O supply power
19
VDD
Power
Digital power
20
NC
21
NC
22
STANDBY
Input
Standby−mode enable pin (active HIGH)
23
OE_BAR
Input
Output enable (active LOW)
24
SADDR
Input
Two−Wire Serial address select
25
TEST
Input
Manufacturing test enable pin (connect to DGND)
26
FLASH
Output
27
TRIGGER
Input
28
FRAME_VALID
Output
Asserted when DOUT frame data is valid
29
LINE_VALID
Output
Asserted when DOUT line data is valid
30
DGND
Power
Digital ground
31
Reserved
NC
32
Reserved
NC
33
Reserved
NC
34
VAA
Power
Analog power
35
AGND
Power
Analog ground
36
VAA
Power
Analog power
37
VAA_PIX
Power
Pixel power
38
VAA_PIX
Power
Pixel power
39
AGND
Power
Analog ground
Two−Wire Serial clock input
Two−Wire Serial data I/O
Asynchronous reset (active LOW). All settings are restored to
factory default
Flash output control
Exposure synchronization input
www.onsemi.com
5
MT9M034
Table 3. PIN DESCRIPTION (continued)
Pin Number
Name
Type
Description
40
VAA
Power
Analog power
41
NC
42
NC
43
NC
44
DGND
Power
Digital ground
45
DOUT0
Output
Parallel pixel data output (LSB)
46
DOUT1
Output
Parallel pixel data output
47
DOUT2
Output
Parallel pixel data output
48
DOUT3
Output
Parallel pixel data output
www.onsemi.com
6
MT9M034
PIXEL DATA FORMAT
Pixel Array Structure
active rows are included for use when horizontal or vertical
mirrored readout is enabled, to allow readout to start on the
same pixel. The pixel adjustment is always performed for
monochrome or color versions. The active area is
surrounded with optically transparent dummy pixels to
improve image uniformity within the active area. Not all
dummy pixels or barrier pixels can be read out.
The MT9M034 pixel array is configured as 1412 columns
by 1028 rows, (see Figure 4). The dark pixels are optically
black and are used internally to monitor black level. Of the
right 100 columns, 64 are dark pixels used for row noise
correction. Of the top 24 rows of pixels, 12 of the dark rows
are used for black level correction. There are 1296 columns
by 976 rows of optically active pixels. While the sensor’s
format is 1280 × 960, the additional active columns and
1412
2 light dummy + 4 barrier + 24 dark + 4 barrier + 6 dark dummy
1028
1296 x 976 (1288 x 968 active)
4.86 x 3.66 mm2 (4.83 x 3.63 mm2)
2 light dummy + 4 barrier + 100 dark + 4 barrier
2 light dummy + 4 barrier
2 light dummy + 4 barrier + 6 dark dummy
Dark pixel
Light dummy
Barrier pixel
pixel
Figure 4. Pixel Array Description
www.onsemi.com
7
Active pixel
MT9M034
Column Readout Direction
Row Readout Direction
Active Pixel (0, 0)
Physical Pixel (122, 44)
R G R G R
G R G
G B G B G
B G B
R G R G R
G R G
G B G B G
B G B
R G R G R
G R G
G B G B G
B G B
Figure 5. Pixel Color Pattern Detail (Top Right Corner)
Default Readout Order
When the sensor is imaging, the active surface of the
sensor faces the scene as shown in Figure 6. When the image
is read out of the sensor, it is read one row at a time, with the
rows and columns sequenced as shown in Figure 6.
By convention, the sensor core pixel array is shown with
pixel (0,0) in the top right corner (see Figure 5). This reflects
the actual layout of the array on the die. Also, the first pixel
data read out of the sensor in default condition is that of pixel
(112, 44).
Lens
Scene
Sensor (rear view)
Row
Readout
Order
Column Readout Order
Pixel (0,0)
Figure 6. Imaging a Scene
Digital Gain Control
gain control of the MT9M034 is dependent on the
configuration of the x_addr_start register. Table 4 illustrates
how the digital gains are applied when x_addr_start is even
or odd number.
MT9M034 supports four digital gains for the color
channels: Red, Green1 (green pixels on the red rows),
Green2 (green pixels on the blue rows), and Blue. Digital
Table 4. DIGITAL GAIN CONTROL FOR ODD AND EVEN X_ADDR_START (R0X3004)
Pixels
x_addr_start
Gain
Register
Red
Even
red_gain
R0x305A
Odd
green1_gain
R0x3056
Green1 (on Red rows)
Even
green1_gain
R0x3056
Odd
red_gain
R0x305A
Even
green2_gain
R0x305C
Odd
blue_gain
R0x3058
Even
blue_gain
R0x3058
Odd
green2_gain
R0x305C
Green2 (on Blue rows)
Blue
www.onsemi.com
8
MT9M034
OUTPUT DATA FORMAT
The MT9M034 image data is read out in a progressive
scan. Valid image data is surrounded by horizontal and
vertical blanking (see Figure 7). The amount of horizontal
row time (in clocks) is programmable through R0x300C.
The amount of vertical frame time (in rows) is
programmable through R0x300A. Line_Valid (LV) is HIGH
during the shaded region of Figure 7. Optional Embedded
Register setup information and Histogram statistic
information are available in first 2 and last row of image
data.
P 0,0 P 0,1 P 0,2 .....................................P 0,n−1 P0,n
P 1,0 P 1,1 P 1,2 .....................................P 1,n−1 P1,n
00 00 00 .................. 00 00 00
00 00 00 .................. 00 00 00
HORIZONTAL
VALID IMAGE
BLANKING
Pm−1,0 Pm−1,1 .....................................Pm−1,n−1 Pm−1,n
Pm,0 Pm,1 .....................................P
P
m,n−1
m,n
00 00 00 ..................................... 00 00 00
00 00 00 ..................................... 00 00 00
00 00 00 .................. 00 00 00
00 00 00 .................. 00 00 00
00 00 00 .................. 00 00 00
00 00 00 .................. 00 00 00
VERTICAL/HORIZONTAL
VERTICAL BLANKING
BLANKING
00 00 00 ..................................... 00 00 00
00 00 00 ..................................... 00 00 00
00 00 00 .................. 00 00 00
00 00 00 .................. 00 00 00
Figure 7. Spatial Illustration of Image Readout
Readout Sequence
dark regions of the array, but if this is done, consideration
must be given to how the sensor reads the dark regions for
its own purposes.
Typically, the readout window is set to a region including
only active pixels. The user has the option of reading out
www.onsemi.com
9
MT9M034
Parallel Output Data Timing
data. For each PIXCLK cycle, with respect to the falling
edge, one 12−bit pixel datum outputs on the DOUT pins.
When both FV and LV are asserted, the pixel is valid.
PIXCLK cycles that occur when FV is de−asserted are called
vertical blanking. PIXCLK cycles that occur when only LV
is de−asserted are called horizontal blanking.
The output images are divided into frames, which are
further divided into lines. By default, the sensor produces
968 rows of 1284 columns each. The FV and LV signals
indicate the boundaries between frames and lines,
respectively. PIXCLK can be used as a clock to latch the
PIXCLK
FV
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
LV
D OUT [11:0]
P0
Vertical Blanking
Horiz Blanking
P1
P2
P3
P4
Valid Image Data
Pn
Horiz Blanking
Vertical Blanking
Figure 8. Default Pixel Output Timing
LV and FV
of FV by 6 PIXCLKs. Normally, LV will only be asserted if
FV is asserted; this is configurable as described below.
The timing of the FV and LV outputs is closely related to
the row time and the frame time.
FV will be asserted for an integral number of row times,
which will normally be equal to the height of the output
image.
LV will be asserted during the valid pixels of each row.
The leading edge of LV will be offset from the leading edge
LV Format Options
The default situation is for LV to be de−asserted when FV
is de−asserted. By configuring R0x306E[1:0], the LV signal
can take two different output formats. The formats for
reading out four lines and two vertical blanking lines are
shown in Figure 9.
FV
Default
LV
FV
Continuous LV
LV
FV
XOR LV
LV
Figure 9. LV Format Options
The timing of an entire frame is shown in Figure 10: “Line
Timing and FRAME_VALID/LINE_VALID Signals”.
www.onsemi.com
10
MT9M034
(tROW) is the period from the first pixel output in a row to
the first pixel output in the next row. The row time and frame
time are defined by equations in Table 5.
Frame Time
The pixel clock (PIXCLK) represents the time needed to
sample 1 pixel from the array. The sensor outputs data at the
maximum rate of 1 pixel per PIXCLK. One row time
...
FRAME_VALID
...
LINE_VALID
...
Number of master clocks
P1
A
Q
A
Q
A
P2
Figure 10. Line Timing and FRAME_VALID/LINE_VALID Signals
Table 5. FRAME TIME (EXAMPLE BASED ON 1280 X 960, 45 FRAMES PER SECOND)
Parameters
Name
Equation
Default Timing
at 74.25 MHz
A
Active Data Time
Context A: R0x3008 − R0x3004 + 1
Context B: R0x308E − R0x308A + 1
1280 pixel clocks
= 17.23 μs
P1
Frame Start Blanking
6 (fixed)
6 pixel clocks
= 0.08 μs
P2
Frame End Blanking
6 (fixed)
6 pixel clocks
= 0.08 μs
Q
Horizontal Blanking
R0x300C − A
370 pixel clocks
= 4.98 μs
A + Q (tROW)
Line (Row) Time
R0x300C
1650 pixel clocks
= 22.22 μs
V
Vertical Blanking
Context A: (R0x300A−(R0x3006−R0x3002+1)) x (A + Q)
Context B: ((R0x30AA−(R0x3090−R0x308C+1)) x (A + Q)
49,500 pixel clocks
= 666.66 μs
Nrows × (A + Q)
Frame Valid Time
Context A: ((R0x3006−R0x3002+1) × (A+Q))−Q+P1+P2
Context B: ((R0x3090−R0x308C+1) × (A+Q))−Q+P1+P2
1,584,000 pixel clocks
= 21.33 ms
F
Total Frame Time
V + (Nrows × (A + Q))
1,633,500 pixel clocks
= 22.22 ms
control is programmed with 2000 rows and the fine shutter
width total is zero.
For Master mode, if the integration time registers exceed
the total readout time, then the vertical blanking time is
internally extended automatically to adjust for the additional
integration time required. This extended value is not written
back to the frame_length_lines register. The
frame_length_lines register can be used to adjust
frame−to−frame readout time. This register does not affect
the exposure time but it may extend the readout time.
Sensor timing is shown in terms of pixel clock cycles (see
Figure 7). The recommended pixel clock frequency is 74.25
MHz. The vertical blanking and the total frame time
equations assume that the integration time (coarse
integration time plus fine integration time) is less than the
number of active lines plus the blanking lines:
Window Height ) Vertical Blanking
(eq. 1)
If this is not the case, the number of integration lines must
be used instead to determine the frame time, (see Table 6).
In this example, it is assumed that the coarse integration time
www.onsemi.com
11
MT9M034
Table 6. FRAME TIME: LONG INTEGRATION TIME
Parameters
Name
Equation (Number of Pixel Clock Cycles)
F’
Total Frame Time
(Long Integration Time)
Context A: (R0x3012 x (A + Q)) + R0x3014 + P1 + P2
Context B: (R0x3016 x (A + Q)) + V R0x3018 + P1 + P2
Default Timing
at 74.25 MHz
3,300,012 pixel
clocks
= 44.44 ms
1. The MT9M034 uses column parallel analog−digital converters; thus short line timing is not possible. The minimum total line time is 1650
columns (horizontal width + horizontal blanking) for HDR mode and 1400 for linear mode. The minimum horizontal blanking is 370.
Exposure
Total
integration
time
is
the
result
of
Coarse_Integration_Time and Fine_Integration_Time
registers, and depends also on whether manual or automatic
exposure is selected.
The actual total integration time, tINT is defined as:
t INT + t INTCoarse * 410 * t INTFine
−
−
(eq. 2)
Context A: the number of pixels of integration
equals the value in R0x3014
Context B: the number of pixels of integration
equals the value in R0x3018. Maximum value for
tINTFine is line length pixel clocks − 611
Typically, the value of the Coarse_Integration_Time
register is limited to the number of lines per frame (which
includes vertical blanking lines), such that the frame rate is
not affected by the integration time. For more information
on coarse and fine integration time settings limits, please
refer to the Register Reference document.
NOTE: In HDR mode, there are specific limitations on
coarse_integration_time due to the number of
line buffers available. Please refer to the section
called “HDR Specific Exposure Settings”.
= (number of lines of integration x line time) − (410 pixel
clocks of conversion time overhead) − (number of pixels of
integration x pixel time)
where:
♦ Number of Lines of Integration (Auto Exposure
Control: Enabled)
When automatic exposure control (AEC) is enabled,
the number of lines of integration may vary from
frame to frame, with the limits controlled by
R0x311E (minimum auto exposure time) and
R0x311C (maximum auto exposure time)
♦ Number of Lines of Integration (Auto Exposure
Control: Disabled)
If AEC is disabled, the number of lines of
integration equals the value in R0x3012 (context A)
or R0x3016 (context B)
♦ Number of Pixels of Integration
The number of fine shutter width pixels is
independent of AEC mode (enabled or disabled):
For best image quality, it is recommended that the
integration time be set to two rows or greater for the shortest
exposure, particularly for monochrome sensors. For linear
mode, this would be the coarse integration time (R0x3012).
For HDR mode, the integration time should be set such that
the T3 exposure is 2 rows or greater. Setting the exposure
time to 1 row may result in non−uniformity between rows.
www.onsemi.com
12
MT9M034
HIGH DYNAMIC RANGE MODE
By default, the sensor powers up in Linear Mode,
however, the MT9M034 can be configured to run in HDR
mode. The HDR scheme used is multi−exposure HDR. This
allows the sensor to handle 120 dB of dynamic range. The
sensor also features a linear mode. In HDR mode, the sensor
sequentially captures three exposures by maintaining 3
separate read and reset pointers that are interleaved within
the rolling shutter readout. The intermediate pixel values are
stored in line buffers while waiting for the 3 exposures
values to be present. As soon as a pixel’s 3 exposure values
are available, they are combined to create a linearized 20−bit
value for each pixel’s response. This 20−bit value is then
optionally compressed back to a 12− or 14−bit value for
output. For 14−bit mode, the compressing is lossless. In
12−bit mode, there is minimal data loss. Figure 11 shows the
HDR data compression:
Digital output
code
Decompressed linear
output
ADC max code
K2 = knee point 2
K1 = knee point 1
Piece−wise Compressed
Signal Output From
Sensor
Pout = P
Signal Response to Light Intensity
Figure 11. HDR Data Compression
knee−points (Figure 11). Aligning the capture knee−points
on top of the compression knee−points, can avoid code
losses (SNR loss) in the compression. Table 7 and Table 8
below show the knee points for the different modes.
Alternatively, the sensor automatically reports the knee
points and can be read directly from registers R0x319A and
R0x319C.
The HDR mode is selected when Operation_Mode_Ctrl,
R0x3082[1:0] = 0. Further controls on exposure time limits
and compressing are controlled by R0x3082[5:2], and
R0x31D0. More details can be found in the MT9M034
Register Reference.
In HDR mode, when compression is used, there are two
types of knee−points: (i) T1/T2 and T2/T3 capture
knee−points and (ii) POUT and POUT2 compression
www.onsemi.com
13
MT9M034
Table 7. KNEE POINTS FOR COMPRESSION TO 14 BITS
T1/T2
Exposure
Ratio (R1)
R0x3082[3:2]
P1
4x
212
8x
16x
212
212
POUT1 = P1
P2
POUT2 =
(P2 − P1) / R1 + POUT1
4096
214
7168
4096
4096
215
T2/T3
Exposure
Ratio (R2)
R0x3082[5:4]
PMAX
POUTMAX
= (PMAX − P2) /
(R1 R2) + POUT2
4x
216
10240
8x
217
10752
16x
218
11008
4x
217
10752
8x
218
11264
16x
219
11520
4x
218
11008
8x
219
11520
16x
220
11776
T2/T3
Exposure
Ratio (R2)
R0x3082[5:4]
PMAX
POUTMAX
= (PMAX − P2) /
(R1 R2) + POUT2
8x
217
3840
16x
218
3904
4x
217
3776
8x
218
3904
16x
219
3968
4x
218
3808
8x
219
3936
16x
220
4000
7680
216
7936
Table 8. KNEE POINTS FOR COMPRESSION TO 12 BITS
T1/T2
Exposure
Ratio (R1)
R0x3082[3:2]
P1
POUT1 = P1
P2
POUT2 =
(P2 − P1) / R1 + POUT1
4x
211
2048
214
2944
8x
16x
211
211
2048
2048
215
3008
216
3040
HDR Specific Exposure Settings
follow the programmed ratio. For example if the T1 / T2
ratio was programmed to 16x but coarse integration was
increased beyond 672 than one would still use the 16x
relinearization formulas.
An additional limitation is the maximum number of
exposure lines in relation to the frame_length_lines register.
In Linear mode, maximum coarse_integration_time =
frame_length_lines − 1. However in HDR mode, since the
coarse integration time register controls T1, the max
coarse_integration time is frame_length_lines − 45.
Putting the two criteria listed above together, it can be
summarized as follows:
In HDR mode, pixel values are stored in line buffers while
waiting for all 3 exposures to be available for final pixel data
combination. There are 42 line buffers used to store
intermediate T1 data. Due to this limitation, the maximum
coarse integration time possible is equal to 42 × T1 / T2 lines.
For example, if R0x3082[3:2] = 2, the sensor is set to have
T1/T2 ratio = 16x. Therefore the maximum number of
integration lines is 42 × 16 = 672 lines.
If coarse integration time is greater than this, the T2
integration time will stay at 42. The sensor will calculate the
ratio internally,enabling the linearization to be performed.
If companding is being than relinearization would still
maximum coarse_integration_time + minimum(42
In HDR mode, subline integration is not utilized. As such,
fine integration time register changes will have no effect on
the image.
T1ńT2, frame_length_lines * 45)
(eq. 3)
There is also a limitation of the minimum number of
exposure lines that can be used. This is summarized in the
following formula:
minimumcoarse_integration_time + (0.5)
www.onsemi.com
14
(T1ńT2)
(T2ńT3)
(eq. 4)
MT9M034
Due to limitation on the internal floating point calculation,
the exact ratio specified by the RATIO_T2_T3
(R0x3082[5:4]) may not be achievable.
When using companded output in combination with
certain exposure ratios (other than T1 / T2 = 16x and T2 / T3
= 16x), digital gain needs to be set to a fixed value. Table
below provides the proper digital gain settings for each
T1 / T2 and T2 / T3 ratio.
Table 9. DIGITAL GAIN SETTING FOR EACH T1 / T2 AND T2 / T3 RATIO
T1 / T2 Ratio
T2 / T3 Ratio
Setting for Digital Gain Register
(0x305E Context A or 0x30C4 Context B)
4
4
0x02h
4
8
0x04h
4
16
0x08h
8
4
0x04h
8
8
0x08h
8
16
0x10h
16
4
0x08h
16
8
0x10h
16
16
Any Legal Value
Motion Compensation
R0x318C[14] = 1. Additional parameters are available to
control the extent of motion detection and correction as per
the requirements of the specific application. These can be set
in R0x318C–R0x3190. The other is using the DLO method
of HDR combination. When using DLO, R0x318C[14] is
ignored. DLO is enabled by setting R0x3190[13] = 1. Noise
filtering is enabled by setting R0x3190[14] = 1. For more
information, please refer to the MT9M034 Register
Reference document.
In typical multi−exposure HDR systems, motion artifacts
can be created when objects move during the T1, T2 or T3
integration time. When this happens, edge artifacts can
potentially be visible and might look like a ghosting effect.
To correct this feature, the MT9M034 has special 2D
motion compensation circuitry that detects motion artifacts
and corrects the image accordingly.
There are two motion compensation options available.
One using the default HDR motion compensation by setting
www.onsemi.com
15
MT9M034
REAL−TIME CONTEXT SWITCHING
In the MT9M034, the user may switch between two full
register sets (listed in Table 10) by writing to a context
switch change bit in R0x30B0[13]. This context switch will
change all registers (no shadowing) at the frame start time
and have the new values apply to the immediate next
exposure and readout time.
Table 10. REAL−TIME CONTEXT−SWITCH REGISTERS
Register Number
Context A
Context B
Y_Addr_Start
R0x3002
R0x308C
X_Addr_Start
R0x3004
R0x308A
Y_Addr_End
R0x3006
R0x3090
X_Addr_End
R0x3008
R0x308E
Coarse_Integration_Time
R0x3012
R0x3016
Fine_Integration_Time
R0x3014
R0x3018
Y_Odd_Inc
R0x30A6
R0x30A8
R0x30B0[5:4]
R0x30B0[9:8]
Green1_Gain (GreenR)
R0x3056
R0x30BC
Blue_Gain
R0x3058
R0x30BE
Red_Gain
R0x305A
R0x30C0
Green2_Gain (GreenB)
R0x305C
R0x30C2
Global_Gain
R0x305E
R0x30C4
Frame_Length_Lines
R0x300A
R0x30AA
R0x3032[1:0]
R0x3032[5:4]
0x3082
0x3084
Register Description
Column Gain
Digital_Binning
Operation_Mode_Ctrl
www.onsemi.com
16
MT9M034
FEATURES
See the MT9M034 Register Reference for additional
details.
new frame. This bit is a self−resetting bit and also returns to
“0” during two−wire serial interface reads.
Reset
Clocks
The MT9M034 may be reset by using RESET_BAR
(active LOW) or the reset register.
The MT9M034 requires one clock input (EXTCLK).
PLL−Generated Master Clock
The PLL contains a prescaler to divide the input clock
applied on EXTCLK, a VCO to multiply the prescaler
output, and two divider stages to generate the output clock.
The clocking structure is shown in Figure 12. PLL control
registers can be programmed to generate desired master
clock frequency.
NOTE: The PLL control registers must be programmed
while the sensor is in the software Standby state.
The effect of programming the PLL divisors
while the sensor is in the streaming state is
undefined.
Hard Reset of Logic
The RESET_BAR pin can be connected to an external RC
circuit for simplicity. The recommended RC circuit uses a
10 kΩ resistor and a 0.1 μF capacitor. The rise time for the
RC circuit is 1 μs maximum.
Soft Reset of Logic
Soft reset of logic is controlled by the R0x301A Reset
register. Bit 0 is used to reset the digital logic of the sensor
while preserving the existing two−wire serial interface
configuration. Furthermore, by asserting the soft reset, the
sensor aborts the current frame it is processing and starts a
PLL Input
Clock
EXTCLK
PLL Output
Clock
Pre PLL
Div
(PFD)
PLL
Multiplier
(VCO)
Pre_pll_clk_div
pll_multiplier
SYSCLK
PLL Output
Div1
vt_sys_clk_div
PLL Output
Div2
PIXCLK
vt_pix_clk_div
Figure 12. PLL−Generated Master Clock PLL Setup
NOTES:
1. The PLL can be bypassed at any time (sensor will
run directly off EXTCLK) by setting
R0x30B0[14] = 1. The PLL is always bypassed in
software standby mode. To disable the PLL, the
sensor must be in standby mode (R0x301A[2] = 0)
2. The following restrictions apply to the PLL tuning
parameters:
32 M 255
1 N 63
1 P1 16(P1 = 1, 2, 3, 4, 6, 8, 10, 12, 14, 16)
4 P2 16
3. The VCO frequency, defined as fVCO = fEXTCLK ×
M / N must be within 384−768 MHz.
4. When PLL_Multiplier is odd, 2 MHz <= fEXTCLK
/ N <= 24 MHz
The PLL is enabled by default on the MT9M034. To
configure and use the PLL:
1. Bring the MT9M034 up as normal; make sure that
fEXTCLK is between 6 and 50 MHz and ensure
the sensor is in software standby (R0x301A−B[2]
= 0). PLL control registers must be set in software
standby.
2. Set pll_multiplier, pre_pll_clk_div, vt_sys_clk_siv,
and vt_pix_clk_div based on the desired input
(fEXTCLK) and output (fPIXCLK ) frequencies.
Determine the M, N, P1, and P2 values to achieve
the desired fPIXCLK using this formula:
fPIXCLK= (fEXTCLK × M) / (N × P1 x P2)
where
M = PLL_Multiplier
N = Pre_PLL_Clk_Div
P1 = Vt_Sys_Clk_Div
P2 = Vt_PIX_Clk_Div
3. Wait 1 ms to ensure that the VCO has locked.
4. Set R0x301A[2] = 1 to enable streaming and to
switch from EXTCLK to the PLL−generated
clock.
The user can utilize the Register Wizard tool
accompanying DevWare to generate PLL settings given a
supplied input clock and desired output frequency.
www.onsemi.com
17
MT9M034
Window Control
Spread−Spectrum Clocking
To facilitate improved EMI performance, the external
clock input allows for spread spectrum sources, with no
impact on image quality. Limits of the spread spectrum input
clock are:
• 5% maximum clock modulation
• 35 KHz maximum modulation frequency
• Accepts triangle wave modulation, as well as sine or
modified triangle modulations.
Registers x_addr_start, x_addr_end, y_addr_start, and
y_addr_end control the size and starting coordinates of the
image window.
The exact window height and width out of the sensor is
determined by the difference between the Y address start and
end registers or the X address start and end registers,
respectively.
The MT9M034 allows different window sizes for context
A and context B.
Stream/Standby Control
Blanking Control
The sensor supports two standby modes: Hard Standby
and Soft Standby. In both modes, external clock can be
optionally disabled to further minimize power consumption.
If this is done, then the “Power−Up Sequence” must be
followed.
Horizontal blank and vertical blank times are controlled
by the line_length_pck and frame_length_lines registers,
respectively.
• Horizontal blanking is specified in terms of pixel
clocks. It is calculated by subtracting the X window
size from the line_length_pck register. The minimum
horizontal blanking is 370 pixel clocks.
• Vertical blanking is specified in terms of numbers of
lines. It is calculated by subtracting the Y window size
from the frame_length_lines register. The minimum
vertical blanking is 26 lines.
Soft Standby
Soft Standby is a low power state that is controlled
through register R0x301A[2]. Depending on the value of
R0x301A[4], the sensor will go to standby after completion
of the current frame readout (default behavior) or after the
completion of the current row readout. When the sensor
comes back from Soft Standby, previously written register
settings are still maintained. Soft standby will not occur if
the TRIGGER pin is held high.
A specific sequence needs to be followed to enter and exit
from Soft Standby.
Entering Soft Standby:
1. Set R0x301A[2] = 0 and drive the TRIGGER pin
LOW
2. External clock can be turned off to further
minimize power consumption (Optional)
The actual imager timing can be calculated using Table 5
and Table 6, which describe the Line Timing and FV/LV
signals.
When in HDR mode, the maximum size is 1280 × 960.
Readout Modes
Digital Binning
By default, the resolution of the output image is the full
width and height of the FOV as defined above. The output
resolution can be reduced by digital binning. For RGB and
monochrome mode, this is set by the register R0x3032. For
Context A, use bits [1:0], for Context B, use bits [5:4].
Available settings are:
00 = No binning
01 = Horizontal binning
10 = Horizontal and vertical binning
Exiting Soft Standby:
1. Enable external clock if it was turned off
2. R0x301A[2] = 1 or drive the TRIGGER pin HIGH
Hard Standby
Hard Standby puts the sensor in lower power state;
previously written register settings are still maintained.
A specific sequence needs to be followed to enter and exit
from Hard Standby.
Binning gives the advantage of reducing noise at the cost
of reduced resolution. When both horizontal and vertical
binning are used, a 2x improvement in SNR is achieved,
therefore improving low light performance. Binning results
in a smaller resolution image, but the FOVs between the
binned and unbinned images are the same.
Entering Hard Standby:
1. R0x301A[8] = 1
2. Assert STANDBY pin
3. External clock can be turned off to further
minimize power consumption (Optional)
Bayer Space Resampling
All of the pixels in the FOV contribute to the output image
in digital binning mode. This can result in a more pleasing
output image with reduced subsampling artifacts. It also
improves low−light performance. For RGB mode,
resampling can be enabled by setting of register 0x306E[4]
= 1.
Exiting Hard Standby:
1. Enable external clock if it was turned off
2. De−assert STANDBY pin
3. Set R0x301A[8] = 0
www.onsemi.com
18
MT9M034
Mirror
When using horizontal mirror mode, the user must
retrigger column correction. Please refer to the column
correction section to see the procedure for column
correction retriggering. Bayer resampling must be enabled,
by setting bit 4 of register 0x306E[4] = 1.
Column Mirror Image
By setting R0x3040[14] = 1, the readout order of the
columns is reversed, as shown in Figure 13. The starting
Bayer color pixel is maintained in this mode by a 1−pixel
shift in the imaging array.
LV
Normal readout
DOUT [11:0]
G0[11:0]
R0[11:0] G1[11:0] R1[11:0] G2[11:0] R2[11:0] G3[11:0] R3[11:0]
Reverse readout
DOUT [11:0]
G3[11:0] R3[11:0] G2[11:0] R2[11:0] G1[11:0] R1[11:0] G0[11:0] R0[11:0]
Figure 13. Eight Pixels in Normal and Column Mirror Readout Modes
imaging array. When using horizontal mirror mode, the user
must retrigger column correction. Please refer to the column
correction section to see the procedure for column
correction retriggering.
Row Mirror Image
By setting R0x3040[15] = 1, the readout order of the rows
is reversed as shown in Figure 14. The starting Bayer color
pixel is maintained in this mode by a 1−pixel shift in the
FV
Normal readout
Row0[11:0] Row1[11:0] Row2[11:0] Row3[11:0] Row4[11:0] Row5[11:0]
D OUT [11:0]
Reverse readout
D OUT [11:0]
Row5[11:0] Row4[11:0] Row3[11:0] Row2[11:0] Row1[11:0] Row0[11:0]
Figure 14. Six Rows in Normal and Row Mirror Readout Modes
•
•
•
•
•
Maintaining a Constant Frame Rate
Maintaining a constant frame rate while continuing to
have the ability to adjust certain parameters is the desired
scenario. This is not always possible, however, because
register updates are synchronized to the read pointer, and the
shutter pointer for a frame is usually active during the
readout of the previous frame. Therefore, any register
changes that could affect the row time or the set of rows
sampled causes the shutter pointer to start over at the
beginning of the next frame.
By default, the following register fields cause a “bubble”
in the output rate (that is, the vertical blank increases for one
frame) if they are written in video mode, even if the new
value would not change the resulting frame rate. The
following list shows only a few examples of such registers;
a full listing can be seen in the MT9M034 Register
Reference.
• x_addr_start
• x_addr_end
• y_addr_start
• y_addr_end
frame_length_lines
line_length_pclk
coarse_integration_time
fine_integration_time
read_mode
The size of this bubble is (Integration_Time × tROW),
calculating the row time according to the new settings.
The Coarse_Integration_Time and Fine_Integration
_Time fields may be written to without causing a bubble in
the output rate under certain circumstances. Because the
shutter sequence for the next frame often is active during the
output of the current frame, this would not be possible
without special provisions in the hardware. Writes to these
registers take effect two frames after the frame they are
written, which allows the integration time to increase
without interrupting the output or producing a corrupt frame
(as long as the change in integration time does not affect the
frame time).
www.onsemi.com
19
MT9M034
Synchronizing Register Writes to Frame Boundaries
cycles. If the trigger signal is applied to multiple sensors at
the same time, the single frame output of the sensors will be
synchronized to within 1 PIXCLK if is PLL disabled or 2
PIXCLKs if PLL is enabled.
During integration time of single−frame mode and video
mode, the FLASH output pin is at high.
Changes to most register fields that affect the size or
brightness of an image take effect on two frames after the
one during which they are written. These fields are noted as
“synchronized to frame boundaries” in the MT9M034
Register Reference. To ensure that a register update takes
effect on the next frame, the write operation must be
completed after the leading edge of FV and before the
trailing edge of FV.
Fields not identified as being frame−synchronized are
updated immediately after the register write is completed.
The effect of these registers on the next frame can be difficult
to predict if they affect the shutter pointer.
Continuous Trigger
In certain applications, multiple sensors need to have their
video streams synchronized (E.g. surround view or
panorama view applications). The TRIGGER pin can also
be used to synchronize output of multiple image sensors
together and still get a video stream. This is called
continuous trigger mode. Continuous trigger is enabled by
holding the TRIGGER pin high. Alternatively, the
TRIGGER pin can be held high until the stream bit is
enabled (R0x301A[2] = 1) then can be released for
continuous synchronized video streaming.
If the TRIGGER pins for all connected MT9M034 sensors
are connected to the same control signal, all sensors will
receive the trigger pulse at the same time. If they are
configured to have the same frame timing, then the usage of
the TRIGGER pin guarantees that all sensors will be
synchronized within 1 PIXCLK cycle if PLL is disabled, or
2 PIXCLK cycles if PLL is enabled.
With continuous trigger mode, the application can now
make use of the video streaming mode while guaranteeing
that all sensor outputs are synchronized. As long as the initial
trigger for the sensors takes place at the same time, all
subsequent video streams will be synchronous.
Restart
To restart the MT9M034 at any time during the operation
of the sensor, write a “1” to the Restart register (R0x301A[1]
= 1). This has two effects: first, the current frame is
interrupted immediately. Second, any writes to
frame−synchronized registers and the shutter width registers
take effect immediately, and a new frame starts (in video
mode). The current row completes before the new frame is
started, so the time between issuing the Restart and the
beginning of the next frame can vary by about tROW.
Image Acquisition Modes
The MT9M034 supports two image acquisition modes:
video(master) and single frame.
Video
The video mode takes pictures by scanning the rows of the
sensor twice. On the first scan, each row is released from
reset, starting the exposure. On the second scan, the row is
sampled, processed, and returned to the reset state. The
exposure for any row is therefore the time between the first
and second scans. Each row is exposed for the same
duration, but at slightly different point in time, which can
cause a shear in moving subjects as is typical with electronic
rolling shutter sensors.
Temperature Sensor
The MT9M034 sensor has a built−in PTAT−based
temperature sensor, accessible through registers, that is
capable of measuring die junction temperature.
The temperature sensor can be enabled by writing
R0x30B4[0] = 1 and R0x30B4[4] = 1. After this, the
temperature sensor output value can be read from
R0x30B2[10:0].
The value read out from the temperature sensor register is
an ADC output value that needs to be converted downstream
to a final temperature value in degrees Celsius. Since the
PTAT device characteristic response is quite linear in the
temperature range of operation required, a simple linear
function in the format of listed in the equation below can be
used to convert the ADC output value to the final
temperature in degrees Celsius.
Single Frame
The single−frame mode operates similar to the video
mode. It also scans the rows of the sensor twice, first to reset
the rows and second to read the rows. Unlike video mode
where a continuous stream of images are output from the
image sensor, the single−frame mode outputs a single frame
in response to a high state placed on the TRIGGER input pin.
As long as the TRIGGER pin is held in a high state, new
images will be read out. After the TRIGGER pin is returned
to a low state, the image sensor will not output any new
images and will wait for the next high state on the TRIGGER
pin.
The TRIGGER pin state is detected during the vertical
blanking period (i.e. the FV signal is low). The pin is level
sensitive rather than edge sensitive. As such, image
integration will only begin when the sensor detects that the
TRIGGER pin has been held high for 3 consecutive clock
Temperature + slope
R0x30B2[10 : 0] ) T 0 (eq. 5)
For this conversion, a minimum of 2 known points are
needed to construct the line formula by identifying the slope
and y−intercept “T0”. These calibration values can be read
from registers R0x30C6 and R0x30C8 which correspond to
value read at 70°C and 55°C respectively. Once read, the
slope and y−intercept values can be calculated and used in
the above equation.
www.onsemi.com
20
MT9M034
pixels are used, regardless of color or mono mode. In HDR
mode, the coarse and fine integration time is the longest
integration time of the three integration, the other two
shorter integration are generated automatically base on the
pre−defined exposure ratios. When using non−default HDR
exposure ratios, auto_dg_en should not be enabled
(R0x3100[4] = 0) due to required digital gains as
documented in Table 9, “Digital Gain Setting for Each T1 /
T2 and T2 / T3 Ratio”.
For more information on the temperature sensor registers,
refer to the MT9M034 Register Reference.
Automatic Exposure Control
The integrated automatic exposure control (AEC) is
responsible for ensuring that optimal settings of exposure
and gain are computed and updated every other frame. AEC
can be enabled or disabled by R0x3100[0].
When AEC is disabled (R0x3100[0] = 0), the sensor uses
the manual exposure value in coarse and fine shutter width
registers and the manual gain value in the gain registers.
When AEC is enabled (R0x3100[0] = 1), the target luma
value in linear mode is set by R0x3102. For the MT9M034
this target luma has a default value of 0x0800 or about half
scale. For HDR mode, the luma target maximum auto
exposure value is limited by R0x311C; the minimum auto
exposure is limited by R0x311E. These values are in units of
line−times.
The exposure control measures current scene luminosity
by accumulating a histogram of pixel values while reading
out a frame. It then compares the current luminosity to the
desired output luminosity. Finally, the appropriate
adjustments are made to the exposure time and gain. All
Embedded Data and Statistics
The MT9M034 has the capability to output image data
and statistics embedded within the frame timing. There are
2 types of information embedded within the frame readout:
1. Embedded Data: If enabled, these are displayed on
the 2 rows immediately before the first active pixel
row is displayed
2. Embedded Statistics: If enabled, these are
displayed on the 2 rows immediately after the last
active pixel row is displayed
NOTE: Embedded data and embedded statistics must be
enabled or disabled together.
Register Data
HBlank
Image
Status & Statistics Data
VBlank
Figure 15. Frame Format with Embedded Data Lines Enabled
In parallel mode, since the pixel word depth is
12−bits/pixel, the sensor 16−bit register data will be
transferred over 2 pixels where the register data will be
broken up into 8msb and 8lsb. The alignment of the 8bit data
will be on the 8MSB bits of the 12−bit pixel word. For
example, if a register value of 0x1234 is to be transmitted,
it will be transmitted over 2, 12−bit pixels as follows: 0x120,
0x340.
The first pixel of each line in the embedded data is a tag
value of 0x0A0. This signifies that all subsequent data is 8
bit data aligned to the MSB of the 12−bit pixel.
The figure below summarizes how the embedded data
transmission looks like. It should be noted that data, as
shown in Figure 16, is aligned to the MSB of each word:
Embedded Data
The embedded data contains the configuration of the
image being displayed. This includes all register settings
used to capture the current frame. The registers embedded
in these rows are as follows:
Line 1:
Registers R0x3000 to R0x312F
Line 2:
Registers R0x3136 to R0x31BF, R0x31D0 to R0x31FF
NOTE: All non−defined registers will have a value of 0.
www.onsemi.com
21
MT9M034
data_format_
code =8’h0A
8’hAA
{register_
address_MSB}
8’hA5
{register_
value_LSB}
8’h5A
{register_
address_LSB}
8’h5A
{register_
value_MSB}
8’h5A
Data line 1
data_format_
code =8’h0A
8’hAA
{register_
address_MSB}
8’hA5
{register_
value_LSB}
8’h5A
{register_
address_LSB}
8’h5A
{register_
value_MSB}
8’h5A
Data line 2
Figure 16. Format of Embedded Data Output within a Frame
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
The data embedded in these rows are as follows:
0x0A0 − identifier
0xAA0
Register Address MSB of the first register
0xA50
Register Address LSB of the first register
0x5A0
Register Value MSB of the first register addressed
0x5A0
Register Value LSB of the first register addressed
0x5A0
Register Value MSB of the register at first address + 2
0x5A0
Register Value LSB of the register at first address + 2
0x5A0
etc.
Embedded Statistics
The embedded statistics contain frame identifiers and
histogram information of the image in the frame. This can be
used by downstream auto−exposure algorithm blocks to
make decisions about exposure adjustment.
This histogram is divided into 244 bins with a bin spacing
of 64 evenly spaced bins for digital code values 0 to 212, 120
evenly spaced bins for values 212 to 216, 60 evenly spaced
bins for values 216 to 220. In HDR with a 16x exposure ratio,
this approximately corresponds to the T1, T2, T3 exposures
respectively.
The first pixel of each line in the embedded statistics is a
tag value of 0x0B0. This signifies that all subsequent
statistics data is 10 bit data aligned to the MSB of the 12−bit
pixel.
The figure below summarizes how the embedded
statistics transmission looks like. It should be noted that
data, as shown in Figure 17, is aligned to the msb of each
word:
statsline1
data_format_
code=8’h0B
#words=
10’h1EC
{2’b00,frame {2’b00,frame {2’b00,frame
_countLSB}
_IDMSB}
_IDLSB}
histogram
bin0[19:10]
histogram
bin0[9:0]
histogram
bin243 [19:0]
histogram
bin243 [9:0]
8’h07
histBegin
[9:0]
histEnd
[19:10]
histEnd
[9:0]
histogram
bin1 [19:0]
histogram
bin1[9:0]
mean
[19:10]
mean
[9:0]
8’h07
statsline2
data_format_
code=8’h0B
#words=
10’h00C
histBegin
[19:10]
lowEndMean lowEndMean perc_lowEnd perc_lowEnd norm_abs_
[19:10]
[9:0]
[19:10]
[9:0]
dev[19:10]
norm_abs_
dev[9:0]
Figure 17. Format of Embedded Statistics Output within a Frame
www.onsemi.com
22
8’h07
MT9M034
threshold. If the average is lower than the minimum
acceptable level, the offset correction value is increased by
a predetermined amount. If it is above the maximum level,
the offset correction value is decreased by a predetermined
amount. The high and low thresholds have been calculated
to avoid oscillation of the black level from below to above
the targeted black level.
The statistics embedded in these rows are as follows:
Line 1:
0x0B0 − (identifier)
Register 0x303A − frame_count
Register 0x31D2 − frame ID
Histogram data − histogram bins 0−243
•
•
•
•
Row−wise Noise Correction
Line 2:
• 0x0B0 (identifier)
• Mean
• Histogram Begin
• Histogram End
• Low End Histogram Mean
• Percentage of Pixels Below Low End Mean
• Normal Absolute Deviation
Row (Line)−wise Noise Correction is handled
automatically by the image sensor. No adjustments are
provided except to enable or disable this feature. Clearing
R0x3044[10] disables the row noise correction. Default
setting is for row noise correction to be enabled.
Row−wise noise correction is performed by calculating an
average from a set of optically black pixels at the start of
each line and then applying each average to all the active
pixels of the line.
Gain
Column Correction
The MT9M034 uses column parallel readout architecture
to achieve fast frame rate. Without any corrections, the
consequence of this architecture is that different column
signal paths have slightly different offsets that might show
up on the final image as structured fixed pattern noise.
MT9M034 has column correction circuitry that measures
this offset and removes it from the image before output. This
is done by sampling dark rows containing tied pixels and
measuring an offset coefficient per column to be corrected
later in the signal path.
Column correction can be enabled/disabled via
R0x30D4[15]. Additionally, the number of rows used for
this offset coefficient measurement is set in R0x30D4[3:0].
By default this register is set to 0x7, which means that 8 rows
are used. This is the recommended value. Other control
features regarding column correction can be viewed in the
MT9M034 Register reference. Any changes to column
correction settings need to be done when the sensor
streaming is disabled and the appropriate triggering
sequence must be followed as described below.
Digital Gain
Digital gain can be controlled globally by R0x305E
(Context A) or R0x30C4 (Context B). There are also
registers that allow individual control over each Bayer color
(GreenR, GreenB, Red, Blue).
The format for digital gain setting is xxx.yyyyy where
0b00100000 represents a 1x gain setting and 0b00110000
represents a 1.5x gain setting. The step size for yyyyy is
0.03125 while the step size for xxx is 1. Therefore to set a
gain of 2.09375 one would set digital gain to 01000011.
Analog Gain
The MT9M034 has a column parallel architecture and
therefore has an Analog gain stage per column.
There are 2 stages of analog gain, the first stage can be set
to 1x, 2x, 4x or 8x. This can be set in R0x30B0[5:4] (Context
A) or R0x30B0[9:8] (Context B). The second stage is
capable of setting an additional 1x or 1.25x gain which can
be set in R0x3EE4[9:8].
This allows the maximum possible analog gain to be set
to 10x.
Column Correction Triggering
Column correction requires a special procedure to trigger
depending on which state the sensor is in.
Black Level Correction
Black level correction is handled automatically by the
image sensor. No adjustments are provided except to enable
or disable this feature. Setting R0x30EA[15] disables the
automatic black level correction. Default setting is for
automatic black level calibration to be enabled.
The automatic black level correction measures the
average value of pixels from a set of optically black lines in
the image sensor. The pixels are averaged as if they were
light−sensitive and passed through the appropriate gain.
This line average is then digitally low−pass filtered over
many frames to remove temporal noise and random
instabilities associated with this measurement. The new
filtered average is then compared to a minimum acceptable
level, low threshold, and a maximum acceptable level, high
Column Triggering on Startup
When streaming the sensor for the first time after
powerup, a special sequence needs to be followed to make
sure that the column correction coefficients are internally
calculated properly.
1. Follow proper power up sequence for power
supplies and clocks
2. Apply sequencer settings if needed
(Linear or HDR mode)
3. Apply frame timing and PLL settings as required
by application
www.onsemi.com
23
MT9M034
Defective Pixel Correction
4. Set analog gain to 1x and low conversion gain
(R0x30B0 = 0x1300)
5. Enable column correction and settings
(R0x30D4 = 0xE007)
6. Disable auto re−trigger for change in conversion
gain or col_gain, and enable column correction
always (R0x30BA = 0x0008)
7. Enable streaming (R0x301A[2] = 1) or drive the
TRIGGER pin HIGH
8. Wait 9 frames to settle (First frame after coming
up from standby is internally column correction
disabled)
9. Disable streaming (R0x301A[2] = 0)
Defective Pixel Correction is intended to compensate for
defective pixels by replacing their value with a value based
on the surrounding pixels, making the defect less noticeable
to the human eye. The defect pixel correction feature
supports up to 200 defects. The locations of defective pixels
are stored in a table on chip during the manufacturing
process; this table is accessible through the two−wire serial
interface. There is no provision for later augmenting the
defect table entries.
The DPC algorithm is one−dimensional, calculating the
resulting averaged pixel value based on nearby pixels within
a row. The algorithm distinguishes between color and
monochrome parts; for color parts, the algorithm uses
nearest neighbor in the same color plane.
At high gain, long exposure, and high temperature
conditions, the performance of this function can degrade.
After this, the sensor has calculated the proper column
correction coefficients and the sensor is ready for streaming.
Any other settings (including gain, integration time and
conversion gain etc.) can be done afterwards without
affecting column correction.
Test Patterns
The MT9M034 has the capability of injecting a number of
test patterns into the top of the datapath to debug the digital
logic. With one of the test patterns activated, any of the
datapath functions can be enabled to exercise it in a
deterministic fashion. Test patterns are selected by
Test_Pattern_Mode register (R0x3070). Only one of the test
patterns can be enabled at a given point in time by setting the
Test_Pattern_Mode register according to Table 11. When
test patterns are enabled the active area will receive the value
specified by the selected test pattern and the dark pixels will
receive the value in Test_Pattern_Green (R0x3074 and
R0x3078) for green pixels, Test_Pattern_Blue (R0x3076)
for blue pixels, and Test_Pattern_Red (R0x3072) for red
pixels.
NOTE: Turn off black level calibration (BLC) when
Test Pattern is enabled.
Column Correction Retriggering Due to Mode Change
Since column offsets is sensitive to changes in the analog
signal path, such changes require column correction
circuitry to be retriggered for the new path. Examples of
such mode changes include: horizontal mirror, vertical
mirror, changes to column correction settings.
When such changes take place, the following sequence
needs to take place:
1. Disable streaming (R0x301A[2] = 0) or drive the
TRIGGER pin LOW
2. Enable streaming (R0x301A[2] = 1) or drive the
TRIGGER pin HIGH
3. Wait 9 frames to settle
NOTE: The above steps are not needed if the sensor is
being reset (soft or hard reset) upon the mode
change.
Table 11. TEST PATTERN MODES
Test_Pattern_Mode
Test Pattern Output
0
No test pattern (normal operation)
1
Solid color test pattern
2
100% color bar test pattern
3
Fade−to−gray color bar test pattern
256
Walking 1s test pattern (12−bit)
Vertical Color Bars
When the vertical color bars mode is selected, a typical
color bar pattern will be sent through the digital pipeline.
Color Field
When the color field mode is selected, the value for each
pixel is determined by its color. Green pixels will receive the
value in Test_Pattern_Green, red pixels will receive the
value in Test_Pattern_Red, and blue pixels will receive the
value in Test_Pattern_Blue.
Walking 1s
When the walking 1s mode is selected, a walking 1s
pattern will be sent through the digital pipeline. The first
value in each row is 1.
www.onsemi.com
24
MT9M034
TWO−WIRE SERIAL REGISTER INTERFACE
The two−wire serial interface bus enables read/write
access to control and status registers within the MT9M034.
The interface protocol uses a master/slave model in which
a master controls one or more slave devices. The sensor acts
as a slave device. The master generates a clock (SCLK) that
is an input to the sensor and is used to synchronize transfers.
Data is transferred between the master and the slave on a
bidirectional signal (SDATA). SDATA is pulled up to VDD_IO
off−chip by a 1.5 kΩ resistor. Either the slave or master
device can drive SDATA LOW−the interface protocol
determines which device is allowed to drive SDATA at any
given time.
The protocols described in the two−wire serial interface
specification allow the slave device to drive SCLKLOW; the
MT9M034 uses SCLK as an input only and therefore never
drives it LOW.
(write address) and 0x21 (read address) in accordance with
the specification. Alternate slave addresses of 0x30 (write
address) and 0x31 (read address) can be selected by enabling
and asserting the SADDR input.
An alternate slave address can also be programmed
through R0x31FC.
Message Byte
Message bytes are used for sending register addresses and
register write data to the slave device and for retrieving
register read data.
Acknowledge Bit
Each 8−bit data transfer is followed by an acknowledge bit
or a no−acknowledge bit in the SCLK clock period following
the data transfer. The transmitter (which is the master when
writing, or the slave when reading) releases SDATA. The
receiver indicates an acknowledge bit by driving SDATA
LOW. As for data transfers, SDATA can change when SCLK
is LOW and must be stable while SCLK is HIGH.
Protocol
Data transfers on the two−wire serial interface bus are
performed by a sequence of low−level protocol elements:
1. a (repeated) start condition
2. a slave address/data direction byte
3. an (a no) acknowledge bit
4. a message byte
5. a stop condition
No−Acknowledge Bit
The no−acknowledge bit is generated when the receiver
does not drive SDATA LOW during the SCLK clock period
following a data transfer. A no−acknowledge bit is used to
terminate a read sequence.
The bus is idle when both SCLK and SDATA are HIGH.
Control of the bus is initiated with a start condition, and the
bus is released with a stop condition. Only the master can
generate the start and stop conditions.
Typical Sequence
A typical READ or WRITE sequence begins by the
master generating a start condition on the bus. After the start
condition, the master sends the 8−bit slave address/data
direction byte. The last bit indicates whether the request is
for a read or a write, where a “0” indicates a write and a “1”
indicates a read. If the address matches the address of the
slave device, the slave device acknowledges receipt of the
address by generating an acknowledge bit on the bus.
If the request was a WRITE, the master then transfers the
16−bit register address to which the WRITE should take
place. This transfer takes place as two 8−bit sequences and
the slave sends an acknowledge bit after each sequence to
indicate that the byte has been received. The master then
transfers the data as an 8−bit sequence; the slave sends an
acknowledge bit at the end of the sequence. The master stops
writing by generating a (re)start or stop condition.
If the request was a READ, the master sends the 8−bit
write slave address/data direction byte and 16−bit register
address, the same way as with a WRITE request. The master
then generates a (re)start condition and the 8−bit read slave
address/data direction byte, and clocks out the register data,
eight bits at a time. The master generates an acknowledge bit
after each 8−bit transfer. The slave’s internal register address
is automatically incremented after every 8 bits are
transferred. The data transfer is stopped when the master
sends a no−acknowledge bit.
Start Condition
A start condition is defined as a HIGH−to−LOW
transition on SDATA while SCLK is HIGH. At the end of a
transfer, the master can generate a start condition without
previously generating a stop condition; this is known as a
“repeated start” or “restart” condition.
Stop Condition
A stop condition is defined as a LOW−to−HIGH transition
on SDATA while SCLK is HIGH.
Data Transfer
Data is transferred serially, 8 bits at a time, with the MSB
transmitted first. Each byte of data is followed by an
acknowledge bit or a no−acknowledge bit. This data transfer
mechanism is used for the slave address/data direction byte
and for message bytes.
One data bit is transferred during each SCLK clock period.
SDATA can change when SCLK is LOW and must be stable
while SCLK is HIGH.
Slave Address/Data Direction Byte
Bits [7:1] of this byte represent the device slave address
and bit [0] indicates the data transfer direction. A “0” in bit
[0] indicates a WRITE, and a “1” indicates a READ. The
default slave addresses used by the MT9M034 are 0x20
www.onsemi.com
25
MT9M034
Single READ from Random Location
register data. The master terminates the READ by
generating a no−acknowledge bit followed by a stop
condition. Figure 18 shows how the internal register address
maintained by the MT9M034 is loaded and incremented as
the sequence proceeds.
This sequence (Figure 18) starts with a dummy WRITE to
the 16−bit address that is to be used for the READ. The
master terminates the WRITE by generating a restart
condition. The master then sends the 8−bit read slave
address/data direction byte and clocks out one byte of
Previous Reg Address, N
Slave
Address
S
0 A
Reg
Address[15:8]
S = Start Condition
P = Stop Condition
Sr = Restart Condition
A = Acknowledge
A = No-acknowledge
Reg Address, M
Reg
Address[7:0]
A
A Sr
Slave Address
1 A
M+1
Read Data
A
P
Slave to Master
Master to Slave
Figure 18. Single READ from Random Location
Single READ From Current Location
master terminates the READ by generating a
no−acknowledge bit followed by a stop condition. The
figure shows two independent READ sequences.
This sequence (Figure 19) performs a read using the
current value of the MT9M034 internal register address. The
Previous Reg Address, N
S
1 A
Slave Address
Reg Address, N + 1
Read Data
A P
S
N+2
1 A Read Data
Slave Address
A P
Figure 19. Single READ from Current Location
Sequential READ, Start From Random Location
has been transferred, the master generates an acknowledge
bit and continues to perform byte READs until “L” bytes
have been read.
This sequence (Figure 20) starts in the same way as the
single READ from random location (Figure 18). Instead of
generating a no−acknowledge bit after the first byte of data
Previous Reg Address, N
S
Slave Address
0 A Reg Address[15:8]
M+1
Read Data
A Reg Address[7:0]
M+2
A
Read Data
Reg Address, M
M+3
A Sr
Slave Address
M+L−2
A
Read Data
1 A
M+L−1
A
Read Data
Figure 20. Sequential READ, Start from Random Location
www.onsemi.com
26
M+1
Read Data
M+L
A P
A
MT9M034
Sequential READ, Start From Current Location
has been transferred, the master generates an acknowledge
bit and continues to perform byte READs until “L” bytes
have been read.
This sequence (Figure 21) starts in the same way as the
single READ from current location (Figure 19). Instead of
generating a no−acknowledge bit after the first byte of data
Previous Reg Address, N
S Slave Address 1 A
N+1
Read Data
A
N+2
Read Data
A
N+L−1
Read Data
A
Read Data
N+L
A
P
Figure 21. Sequential READ, Start from Current Location
Single WRITE to Random Location
then LOW bytes of the register address that is to be written.
The master follows this with the byte of write data. The
WRITE is terminated by the master generating a stop
condition.
This sequence (Figure 22) begins with the master
generating a start condition. The slave address/data
direction byte signals a WRITE and is followed by the HIGH
Previous Reg Address, N
S
Slave Address
0 A
Reg Address[15:8]
A
Reg Address, M
Reg Address[7:0]
A
Write Data
M+1
A P
A
Figure 22. Single WRITE to Random Location
Sequential WRITE, Start at Random Location
has been transferred, the master generates an acknowledge
bit and continues to perform byte WRITEs until “L” bytes
have been written. The WRITE is terminated by the master
generating a stop condition.
This sequence (Figure 23) starts in the same way as the
single WRITE to random location (Figure 22). Instead of
generating a no−acknowledge bit after the first byte of data
Previous Reg Address, N
S
Slave Address
0 A
M+1
Write Data
Reg Address[15:8]
A
M+2
A
Write Data
Reg Address, M
Reg Address[7:0]
M+3
A
Write Data
M+L−2
A
Write Data
27
A
M+L−1
A
Figure 23. Sequential WRITE, Start at Random Location
www.onsemi.com
M+1
Write Data
M+L
A
A
P
MT9M034
SPECTRAL CHARACTERISTICS
70
60
red
green
blue
Quantum Efficiency (%)
50
40
30
20
10
0
350 400
450 500
550 600 650 700
750 800 850 900
950 1000 1050
Wavelength (nm)
Figure 24. Quantum Efficiency − Color Sensor
Figure 25. Estimated Quantum Efficiency – Monochrome Sensor
www.onsemi.com
28
MT9M034
Electrical Specifications
Unless otherwise stated, the following specifications
apply to the following conditions:
VDD = 1.8 V – 0.10 / +0.15; VDD_IO = VDD_PLL = VAA
= VAA_PIX = 2.8 V ±0.3V ;
TA = −30°C to +70°C; output load = 10 pF; frequency =
74.25 MHz.
Two-Wire Serial Register Interface
The electrical characteristics of the two−wire serial
register interface (SCLK, SDATA) are shown in Figure 26 and
Table 12.
SDATA
tLOW
tf
tSU;DAT
tr
tf
tHD;STA
tr
tBUF
SCLK
S
tHD;STA
tHD;DAT
tHIGH
tSU;STA
tSU;STO
Sr
P
S
Note: Read sequence: For an 8-bit READ, read waveforms start after WRITE command and register address are issued.
Figure 26. Two-Wire Serial Bus Timing Parameters
Table 12. TWO-WIRE SERIAL BUS CHARACTERISTICS
fEXTCLK
= 27 MHz; VDD = 1.8 V; VDD_IO = 2.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; VDD_DAC = 2.8 V; TA = 25°C
Standard−Mode
Fast−Mode
Symbol
Min
Max
Min
Max
Unit
fSCL
0
100
0
400
KHz
tHD;STA
4.0
−
0.6
−
μS
LOW Period of the SCLK Clock
tLOW
4.7
−
1.3
−
μS
HIGH Period of the SCLK Clock
tHIGH
4.0
−
0.6
−
μS
tSU;STA
4.7
−
0.6
−
μS
tHD;DAT
0
(Note 4)
3.45
(Note 5)
0
(Note 6)
0.9
(Note 5)
μS
tSU;DAT
250
−
1006
−
nS
tr
−
1000
20 + 0.1Cb
(Note 7)
300
nS
tf
−
300
20 + 0.1Cb
(Note 7)
300
nS
tSU;STO
4.0
−
0.6
−
μS
tBUF
4.7
−
1.3
−
μS
Cb
−
400
−
400
pF
CIN_SI
−
3.3
−
3.3
pF
Parameter
SCLK Clock Frequency
Hold Time (Repeated) START Condition
After this Period, the First Clock Pulse is Generated
Set−up Time for a Repeated START Condition
Data Hold Time
Data Set−up Time
Rise Time of Both SDATA and SCLK Signals
Fall Time of Both SDATA and SCLK Signals
Set−up Time for STOP Condition
Bus Free Time between a STOP and START Condition
Capacitive Load for Each Bus Line
Serial Interface Input pin Capacitance
SDATA Max Load Capacitance
SDATA Pull−up Resistor
CLOAD_SD
−
30
−
30
pF
RSD
1.5
4.7
1.5
4.7
KΩ
This table is based on I2C standard (v2.1 January 2000). On Semiconductor.
Two−wire control is I2C−compatible.
All values referred to VIHmin = 0.9 VDD and VILmax = 0.1 VDD levels. Sensor EXCLK = 27 MHz.
A device must internally provide a hold time of at least 300 ns for the SDATA signal to bridge the undefined region of the falling edge of SCLK.
The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW) of the SCLK signal.
A Fast−mode I2C−bus device can be used in a Standard−mode I2C−bus system, but the requirement tSU;DAT 250 ns must then be met.
This will automatically be the case if the device does not stretch the LOW period of the SCLK signal. If such a device does stretch the LOW
period of the SCLK signal, it must output the next data bit to the SDATA line tr max + tSU;DAT = 1000 + 250 = 1250 ns (according to the
Standard−mode I2C−bus specification) before the SCLK line is released.
7. Cb = total capacitance of one bus line in pF.
1.
2.
3.
4.
5.
6.
www.onsemi.com
29
MT9M034
I/O Timing
See Figure 27 and Table 13 for I/O timing (AC)
characteristics.
By default, the MT9M034 launches pixel data, FV, and LV
with the falling edge of PIXCLK. The expectation is that the
user captures DOUT[11:0], FV, and LV using the rising edge
of PIXCLK. This can be changed using register R0x3028.
tR
t RP
tF
t FP
90 %
10 %
90 %
10 %
t EXTCLK
EXTCLK
PIXCLK
t
PD
Pxl _ 0
Data[11:0]
FRAME_VALID/
LINE_VALID
Pxl _ 1
Pxl _ 2
Pxl _ n
t PFH
t PLH
t PFL
t PLL
FRAME_VALID leads LINE_VALID by 6 PIXCLKs.
FRAME_VALID trails
LINE_VALID by 6 PIXCLKs.
Figure 27. I/O Timing Diagram
Table 13. I/O TIMING CHARACTERISTICS (2.8 V VDD_IO) (Note 1)
Symbol
Min
Typ
Input Clock Frequency
6
Input Clock Period
20
tR
Input Clock Rise Time
tF
Input Clock Fall Time
tJITTER
Input Clock Jitter
tRP
Pixclk Rise Time
PCLK slew rate = 6
tFP
Pixclk Fall Time
PCLK slew rate = 6
fEXTCLK
tEXTCLK
Definition
Condition
Max
Unit
–
50
MHz
–
166
ns
–
3
–
ns
–
3
–
ns
–
–
600
ps
1.2
–
2.9
ns
1.2
–
2.9
ns
Pixclk Duty Cycle
45
50
55
%
fPIXCLK
PIXCLK Frequency (Note 2)
6
–
74.25
MHz
tPD
PIXCLK to Data Valid
PCLK slew rate = 6,
Parallel slew rate = 7
–2
–
2.5
ns
tPFH
PIXCLK to FV HIGH
PCLK slew rate = 6,
Parallel slew rate = 7
–2
–
2.5
ns
tPLH
PIXCLK to LV HIGH
PCLK slew rate = 6,
Parallel slew rate = 7
–2
–
2.5
ns
tPFL
PIXCLK to FV LOW
PCLK slew rate = 6,
Parallel slew rate = 7
–2
–
2.5
ns
tPLL
PIXCLK to LV LOW
PCLK slew rate = 6,
Parallel slew rate = 7
–2
–
2.5
ns
1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C at 2.5 V, and −30°C at 3.1 V. All values
are taken at the 50% transition point. The loading used is 10 pF.
2. Jitter from PIXCLK is already taken into account as the data of all the output parameters.
Table 14. I/O TIMING CHARACTERISTICS (1.8 V VDD_IO) (Note 1)
Symbol
Definition
Condition
Min
Typ
Max
Unit
fEXTCLK
Input Clock Frequency
6
−
50
MHz
tEXTCLK
Input Clock Period
20
−
166
ns
tR
Input Clock Rise Time
−
3
−
ns
www.onsemi.com
30
MT9M034
Table 14. I/O TIMING CHARACTERISTICS (1.8 V VDD_IO) (Note 1) (continued)
Symbol
Definition
Condition
Min
Typ
Max
Unit
tF
Input Clock Fall Time
−
3
−
ns
tJITTER
Input Clock Jitter
–
–
600
ps
tRP
Pixel Rise Time
PCLK slew rate = 6
1.8
−
4.8
ns
tFP
Pixel Fall Time
PCLK slew rate = 6
1.7
−
4.5
ns
50
Pixel Duty Cycle
45
fPIXCLK
PIXCLK Frequency (Note 2)
6
55
%
74.25
MHz
tPD
PIXCLK to Data Valid
PCLK slew rate = 6,
Parallel slew rate = 7
–2.5
–
2
ns
tPFH
PIXCLK to FV HIGH
PCLK slew rate = 6,
Parallel slew rate = 7
–2.5
–
2
ns
tPLH
PIXCLK to LV HIGH
PCLK slew rate = 6,
Parallel slew rate = 7
–2.5
–
2
ns
tPFL
PIXCLK to FV LOW
PCLK slew rate = 6,
Parallel slew rate = 7
–2.5
–
2
ns
tPLL
PIXCLK to LV LOW
PCLK slew rate = 6,
Parallel slew rate = 7
–2.5
–
2
ns
1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C at 1.7 V, and −30°C at 1.95 V. All values
are taken at the 50% transition point. The loading used is 10 pF.
2. Jitter from PIXCLK is already taken into account as the data of all the output parameters.
Table 15. I/O RISE SLEW RATE (2.8 V VDD_IO) (Note 1)
Parallel Slew Rate
(R0x306E[15:13])
Conditions
Min
Typ
Max
Units
7
Default
1.08
1.77
2.72
V/ns
6
Default
0.77
1.26
1.94
V/ns
5
Default
0.58
0.95
1.46
V/ns
4
Default
0.44
0.70
1.08
V/ns
3
Default
0.32
0.51
0.78
V/ns
2
Default
0.23
0.37
0.56
V/ns
1
Default
0.16
0.25
0.38
V/ns
0
Default
0.10
0.15
0.22
V/ns
1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C at 2.5 V, and −30°C at 3.1 V. The loading
used is 10 pF.
Table 16. I/O FALL SLEW RATE (2.8 V VDD_IO) (Note 1)
Parallel Slew Rate
(R0x306E[15:13])
Conditions
Min
Typ
Max
Units
7
Default
1.00
1.62
2.41
V/ns
6
Default
0.76
1.24
1.88
V/ns
5
Default
0.60
0.98
1.50
V/ns
4
Default
0.46
0.75
1.16
V/ns
3
Default
0.35
0.56
0.86
V/ns
2
Default
0.25
0.40
0.61
V/ns
1
Default
0.17
0.27
0.41
V/ns
0
Default
0.11
0.16
0.24
V/ns
1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C at 2.5 V, and −30°C at 3.1 V. The loading
used is 10 pF.
www.onsemi.com
31
MT9M034
Table 17. I/O RISE SLEW RATE (1.8 V VDD_IO) (Note 1)
Parallel Slew Rate
(R0x306E[15:13])
Conditions
Min
Typ
Max
Units
7
Default
0.41
0.65
1.10
V/ns
6
Default
0.30
0.47
0.79
V/ns
5
Default
0.24
0.37
0.61
V/ns
4
Default
0.19
0.28
0.46
V/ns
3
Default
0.14
0.21
0.34
V/ns
2
Default
0.10
0.15
0.24
V/ns
1
Default
0.07
0.10
0.16
V/ns
0
Default
0.04
0.06
0.10
V/ns
1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C at 1.7 V, and −30°C at 1.95 V. The loading
used is 10 pF.
Table 18. I/O FALL SLEW RATE (1.8 V VDD_IO) (Note 1)
Parallel Slew Rate
(R0x306E[15:13])
Conditions
Min
Typ
7
Default
0.42
6
Default
0.32
5
Default
4
3
Max
Units
0.68
1.11
V/ns
0.51
0.84
V/ns
0.26
0.41
0.67
V/ns
Default
0.20
0.32
0.52
V/ns
Default
0.16
0.24
0.39
V/ns
2
Default
0.12
0.18
0.28
V/ns
1
Default
0.08
0.12
0.19
V/ns
0
Default
0.05
0.07
0.11
V/ns
1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C at 1.7 V, and −30°C at 1.95 V. The loading
used is 10 pF.
www.onsemi.com
32
MT9M034
DC ELECTRICAL CHARACTERISTICS
The DC electrical characteristics are shown in the tables
below.
Table 19. DC ELECTRICAL CHARACTERISTICS
Definition
Min
Typ
Max
1.7
1.8
1.95
1.7 / 2.5
1.8 / 2.8
1.9 / 3.1
2.5
2.8
3.1
Pixel Supply Voltage
2.5
2.8
3.1
VDD_PLL
PLL Supply Voltage
2.5
2.8
3.1
VDD_SLVS
HiSPi Supply Voltage for SLVS Mode
0.3
0.4
0.6
VDD_SLVS
HiSPi Supply Voltage for HiVcm Mode
1.7
1.8
1.95
VIH
Input HIGH Voltage
VDD_IO × 0.7
–
–
VIL
Input LOW Voltage
–
–
VDD_IO × 0.3
IIN
Input Leakage Current
–
–
20
VOH
Output HIGH Voltage
VDD_IO − 0.3
–
–
VOL
Output LOW Voltage
–
–
0.4
IOH
Output HIGH Current
At specified VOH
−22
–
–
IOL
Output LOW Current
At specified VOL
–
–
22
Symbol
VDD
Core Digital Voltage
VDD_IO
I/O Digital Voltage
VAA
Analog Voltage
VAA_PIX
Condition
No pull−up resistor;
VIN = VDD_IO or DGND
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
CAUTION: Stresses greater than those listed in Table 14 may
cause permanent damage to the device. This is a stress
rating only, and functional operation of the device at
these or any other conditions above those indicated in
the operational sections of this specification is not
implied.
Table 20. ABSOLUTE MAXIMUM RATINGS
Symbol
Definition
Condition
Min
Max
Unit
–0.3
4.5
V
VSUPPLY
VSUPPLY
Power Supply Voltage (All Supplies)
ISUPPLY
Total Power Supply Current
–
200
mA
ISUPPLY
IGND
Total Ground Current
–
200
mA
IGND
VIN
DC Input Voltage
–0.3
VDD_IO + 0.3
V
VIN
VOUT
DC Output Voltage
–0.3
VDD_IO + 0.3
V
VOUT
TSTG (Note 1)
Storage Temperature
–40
+150
°C
TSTG (Note 1)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2. To keep dark current and shot noise artifacts from impacting image quality, keep operating temperature at a minimum.
Table 21. OPERATING CURRENT CONSUMPTION IN PARALLEL OUTPUT AND LINEAR MODE
Symbol
Min
Typ
Max
Unit
Digital Operating Current
Definition
Streaming, 1280x960 45 fps
Condition
IDD1
–
63
90
mA
I/O Digital Operating Current
Streaming, 1280x960 45 fps
IDD_IO
–
35
40
mA
Analog Operating Current
Streaming, 1280x960 45 fps
IAA
–
30
45
mA
10
15
mA
Pixel Supply Current
Streaming, 1280x960 45 fps
IAA_PIX
–
PLL Supply Current
Streaming, 1280x960 45 fps
IDD_PLL
–
7
15
mA
Digital Operating Current
Streaming, 720p 60 fps
IDD1
–
63
90
mA
www.onsemi.com
33
MT9M034
Table 21. OPERATING CURRENT CONSUMPTION IN PARALLEL OUTPUT AND LINEAR MODE (continued)
Definition
Condition
Symbol
Min
Typ
Max
Unit
I/O Digital Operating Current
Streaming, 720p 60 fps
IDD_IO
−
35
40
mA
Analog Operating Current
Streaming, 720p 60 fps
IAA
–
30
45
mA
Pixel Supply Current
Streaming, 720p 60 fps
IAA_PIX
–
10
15
mA
PLL Supply Current
Streaming, 720p 60f ps
IDD_PLL
–
7
15
mA
1. Operating currents are measured at the following conditions:
− VAA = VAA_PIX = VDD_IO = VDD_PLL = 2.8 V
− VDD =1.8 V
− PLL Enabled and PIXCLK = 74.25 MHz
− TA = 25°C
− CLOAD = 10 pF Measured in dark
Table 22. OPERATING CURRENT CONSUMPTION IN PARALLEL OUTPUT AND HDR MODE
Definition
Condition
Symbol
Min
Typ
Max
Unit
Digital Operating Current
Streaming, 1280x960 45 fps
IDD1
–
63
90
mA
Digital Operating Current
Streaming, 1280x960 45 fps
IDD
–
95
115
mA
I/O Digital Operating Current
Streaming, 1280x960 45 fps
IDD_IO
–
35
40
mA
Analog Operating Current
Streaming, 1280x960 45 fps
IAA
–
65
75
mA
Pixel Supply Current
Streaming, 1280x960 45 fps
IAA_PIX
–
15
20
mA
PLL Supply Current
Streaming, 1280x960 45 fps
IDD_PLL
–
7
15
mA
Digital Operating Current
Streaming, 720p 60 fps
IDD
–
95
115
mA
I/O Digital Operating Current
Streaming, 720p 60 fps
IDD_IO
–
35
40
mA
Analog Operating Current
Streaming, 720p 60 fps
IAA
–
61
75
mA
Pixel Supply Current
Streaming, 720p 60 fps
IAA_PIX
–
15
20
mA
PLL Supply Current
Streaming, 720p 60 fps
IDD_PLL
–
7
15
mA
Condition
Symbol
Min
Typ
Max
Unit
Hard Standby (Clock Off)
Analog, 2.8 V
–
–
30
100
μA
Digital, 1.8 V
–
–
85
2500
μA
Hard Standby (Clock On)
Analog, 2.8 V
–
–
30
100
μA
Digital, 1.8 V
–
–
1.55
4
mA
Soft Standby (Clock Off)
Analog, 2.8 V
–
–
85
100
μA
Digital, 1.8 V
–
–
85
2500
μA
Analog, 2.8 V
–
–
30
100
μA
Digital, 1.8 V
–
–
1.55
4
mA
1. Operating currents are measured at the following conditions:
− VAA = VAA_PIX = VDD_IO = VDD_PLL = 2.8 V
− VDD =1.8 V
− PLL Enabled and PIXCLK = 74.25 MHz
− TA = 25°C
− CLOAD = 10 pF Measured in dark
Table 23. STANDBY CURRENT CONSUMPTION
Definition
Soft Standby (Clock On)
1. Analog – VAA + VAA_PIX + VDD_PLL
2. Digital – VDD + VDD_IO
www.onsemi.com
34
MT9M034
Power Supply Rejection Ratio
70
PSRR (dB)
60
50
40
30
20
10
0
1000
10000
100000
Frequency (Hz)
Figure 28. Power Supply Rejection Ratio
www.onsemi.com
35
1000000
MT9M034
POWER−ON RESET AND STANDBY TIMING
Power−Up Sequence
5. Assert RESET_BAR for at least 1 ms
6. Wait 850000 EXTCLKs (for internal initialization
into software standby)
7. Configure PLL, output, and image settings to
desired values
8. Wait 1ms for the PLL to lock
9. Set streaming mode (R0x301A[2] = 1)
The recommended power−up sequence for the MT9M034
is shown in Figure 29. The available power supplies
(VDD_IO, VDD, VDD_PLL, VAA, VAA_PIX) must have the
separation specified below.
1. Turn on VDD_PLL power supply
2. After 0–10 μs, turn on VAA and VAA_PIX power
supply
3. After 0–10 μs, turn on VDD_IO power supply
4. After the last power supply is stable, enable
EXTCLK
V DD _PLL (2.8)
t0
V AA _PIX
V AA (2.8)
t1
V DD _IO (1.8/2.8)
t2
V DD(1.8)
t3
EXTCLK
t4
RESET_BAR
tx
t5
Hard Reset
t6
Internal
Initialization
Software
Standby
PLL Lock
Streaming
Figure 29. Power Up
Table 24. POWER−UP SEQUENCE
Definition
Symbol
Minimum
Typical
Maximum
Unit
VDD_PLL to VAA/VAA_PIX (Note 3)
t0
0
10
–
μs
VAA/VAA_PIX to VDD_IO
t1
0
10
–
μs
VDD_IO to VDD
t2
0
10
–
μs
Xtal Settle Time
tx
–
30 (Note 1)
–
ms
Hard Reset
t4
1 (Note 2)
–
–
ms
Internal Initialization
t5
850000
–
–
EXTCLKS
PLL Lock Time
t6
1
–
–
ms
1. Xtal settling time is component−dependent, usually taking about 10–100 ms.
2. Hard reset time is the minimum time required after power rails are settled. In a circuit where Hard reset is held down by RC circuit, then the
RC time must include the all power rail settle time and Xtal settle time.
3. It is critical that VDD_PLL is not powered up after the other power supplies. It must be powered before or at least at the same time as the
others. If the case happens that VDD_PLL is powered after other supplies then sensor may have functionality issues and will experience high
current draw on this supply.
www.onsemi.com
36
MT9M034
Power−Down Sequence
3. Turn off VDD
4. Turn off VDD_IO
5. Turn off VAA/VAA_PIX
6. Turn off VDD_PLL
The recommended power−down sequence for the
MT9M034 is shown in Figure 30. The available power
supplies (VDD_IO, VDD, VDD_PLL, VAA, VAA_PIX) must
have the separation specified below. Power may be removed
from all supplies simultaneously, and a sudden loss of power
on all rails does not cause damage or affect the lifetime of the
device.
1. Disable streaming if output is active by setting
standby R0x301A[2] = 0
2. The soft standby state is reached after the current
row or frame, depending on configuration, has
ended
t0
VDD (1.8)
t1
VDD_IO (1.8/2.8)
t2
VAA _PIX
VAA(2.8)
t3
VDD _PLL (2.8)
EXTCLK
t4
Power Down until next Power up cycle
Figure 30. Power Down
Table 25. POWER−DOWN SEQUENCE
Definition
Symbol
Minimum
Typical
Maximum
Unit
VDD to VDD_IO
t1
0
–
–
μs
VDD_IO to VAA/VAA_PIX
t2
0
–
–
μs
VAA/VAA_PIX to VDD_PLL
t3
0
–
–
μs
PwrDn until Next PwrUp Time
t4
100
–
–
ms
1. t4 is required between power down and next power up time; all decoupling caps from regulators must be completely discharged.
www.onsemi.com
37
MT9M034
ILCC48 10x10
CASE 847AD
ISSUE O
www.onsemi.com
38
MT9M034
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
◊
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
www.onsemi.com
39
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MT9M034/D
Similar pages