Gap Filler 1000SR (Two-Part) September 2011 PRODUCT DESCRIPTION Thermally Conductive, Liquid Gap Filler Material FEATURES AND BENEFITS • Thermal Conductivity: 1.0 W/m-K TYPICAL PROPERTIES OF GAP FILLER 1000SR PROPERTY Color / Part A IMPERIAL VALUE Violet METRIC VALUE Violet Color / Part B TEST METHOD Visual White White Visual Viscosity, High Shear (Pa-s) (1) 20 20 ASTM D5099 • Excellent slump resistance (stays in place) Density (g/cc) 2.0 2.0 ASTM D792 • Ultra-conforming, with excellent wet-out for low stress interface applications Mix Ratio 1:1 1:1 — Shelf Life @ 25°C (months) 6 6 — • 100% solids - no cure by-products PROPERTY AS CURED Color Violet Violet Visual Hardness (Shore 00) (2) 75 75 ASTM D2240 • Excellent low and high temperature mechanical and chemical stability Heat Capacity (J/g-K) 1.0 1.0 ASTM D1269 -76 to 347 -60 to 175 — ELECTRICAL AS CURED Dielectric Strength (V/mil) 500 500 ASTM D149 Dielectric Constant (1000 Hz) 5.1 5.1 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL AS CURED Thermal Conductivity (W/m-K) 1.0 1.0 ASTM D5470 CURE SCHEDULE Pot Life @ 25°C (min) (3) 60 60 - Cure @ 25°C (hrs) (4) 20 20 - Cure @ 100°C (min) (4) 10 10 - Continuous Use Temp (°F) / (°C) Gap Filler 1000SR is a two-part, thermally conductive, liquid gap filling material that features superior slump resistance. The mixed system will cure at room temperature and can be accelerated with the addition of heat. Unlike cured thermal pad materials, a liquid approach offers infinite thickness variations with little or no stress to sensitive components during assembly. As cured, Gap Filler 1000SR provides a soft, thermally conductive, form-in-place elastomer that is ideal for fragile assemblies or for filling unique and intricate air voids and gaps. 1) Capillary Viscosity, Initial, 4500 sec-1. Part A and B measured separately. 2) Thirty second delay value Shore 00 hardness scale. 3) ARES Parallel Plate Rheometer - Working life as liquid, time for modulus to double. 4) ARES Parallel Plate Rheometer - Estimated time to read 90% cure. TYPICAL APPLICATIONS INCLUDE • Automotive electronics • Computer and peripherals • Between any heat-generating semiconductor and a heat sink • Telecommunications CONFIGURATIONS AVAILABLE • Supplied in cartridge or kit form Gap Filler 1000SR exhibits low level natural tack characteristics and is intended for use in applications where a strong structural bond is not required. PDS_GF_1000SR_0911 TDS Gap Filler 1000SR, September 2011 Disclaimer Note: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. The product can have a variety of different applications as well as differing application and working conditions in your environment that are beyond our control. Henkel is, therefore, not liable for the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liability in respect of the information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except if otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. In case products are delivered by Henkel Belgium NV, Henkel Electronic Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and Henkel France SA please additionally note the following: In case Henkel would be nevertheless held liable, on whatever legal ground, Henkel’s liability will in no event exceed the amount of the concerned delivery. In case products are delivered by Henkel Colombiana, S.A.S. the following disclaimer is applicable: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. Henkel is, therefore, not liable for the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liability in respect of the information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except if otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. In case products are delivered by Henkel Corporation, Resin Technology Group, Inc., or Henkel Canada Corporation, the following disclaimer is applicable: The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications. 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