Infineon IKB20N65EH5 Trenchstoptm 5 high speed switching igbt copacked with full rated current rapid 1 anti parallel diode Datasheet

IKB20N65EH5
Highspeedswitchingseries5thgeneration
TRENCHSTOPTM5highspeedswitchingIGBTcopackedwithfullrated
currentRAPID1antiparalleldiode
FeaturesandBenefits:
C
HighspeedH5technologyoffering
•Best-in-Classefficiencyinhardswitchingandresonant
topologies
•650Vbreakdownvoltage
•LowQG
•IGBTcopackedwithfullratedcurrentRAPID1fastantiparallel
diode
•Maximumjunctiontemperature175°C
•Pb-freeleadplating;RoHScompliant
•CompleteproductspectrumandPSpiceModels:
http://www.infineon.com/igbt/
G
E
C
PotentialApplications:
•EnergyGeneration
-SolarStringInverter
-SolarMicroInverter
•IndustrialPowerSupplies
-IndustrialSMPS
-IndustrialUPS
•MetalTreatment
-Welding
•EnergyDistribution
-EnergyStorage
•Infrastructure–Charge
-Charger
G
E
ProductValidation:
Qualifiedforindustrialapplicationsaccordingtotherelevanttests
ofJEDEC47/20/22
KeyPerformanceandPackageParameters
Type
IKB20N65EH5
Datasheet
www.infineon.com
VCE
IC
VCEsat,Tvj=25°C
Tvjmax
Marking
Package
650V
20A
1.65V
175°C
K20EEH5
PG-TO263-3
PleasereadtheImportantNoticeandWarningsattheendofthisdocument
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IKB20N65EH5
Highspeedswitchingseries5thgeneration
TableofContents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Electrical Characteristics Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Package Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Testing Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Datasheet
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Highspeedswitchingseries5thgeneration
MaximumRatings
Foroptimumlifetimeandreliability,Infineonrecommendsoperatingconditionsthatdonotexceed80%ofthemaximumratingsstatedinthisdatasheet.
Parameter
Symbol
Value
Unit
Collector-emittervoltage,Tvj≥25°C
VCE
650
V
DCcollectorcurrent,limitedbyTvjmax
Tc=25°C
Tc=100°C
IC
38.0
25.0
A
Pulsedcollectorcurrent,tplimitedbyTvjmax
ICpuls
60.0
A
Turn off safe operating area
VCE≤650V,Tvj≤175°C,tp=1µs
-
60.0
A
Diodeforwardcurrent,limitedbyTvjmax
Tc=25°Cvaluelimitedbybondwire
Tc=100°C
IF
40.0
27.0
A
Diodepulsedcurrent,tplimitedbyTvjmax
IFpuls
60.0
A
Gate-emitter voltage
TransientGate-emittervoltage(tp≤10µs,D<0.010)
VGE
±20
±30
V
PowerdissipationTc=25°C
PowerdissipationTc=100°C
Ptot
125.0
62.5
W
Operating junction temperature
Tvj
-40...+175
°C
Storage temperature
Tstg
-55...+150
°C
Soldering temperature,
reflow soldering (MSL1 according to JEDEC J-STA-020)
°C
260
ThermalResistance
Parameter
Symbol Conditions
Value
min.
typ.
max.
Unit
RthCharacteristics
IGBT thermal resistance,
junction - case
Rth(j-c)
-
-
1.20
K/W
Diode thermal resistance,
junction - case
Rth(j-c)
-
-
1.50
K/W
Thermal resistance, min. footprint
junction - ambient
Rth(j-a)
-
-
65
K/W
Thermal resistance, 6cm² Cu on
PCB
junction - ambient
Rth(j-a)
-
-
40
K/W
Datasheet
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Highspeedswitchingseries5thgeneration
ElectricalCharacteristic,atTvj=25°C,unlessotherwisespecified
Parameter
Symbol Conditions
Value
Unit
min.
typ.
max.
650
-
-
VGE=15.0V,IC=20.0A
Tvj=25°C
Tvj=125°C
Tvj=175°C
-
1.65
1.85
1.95
2.10
-
-
1.45
1.42
1.39
1.70
-
3.2
4.0
4.8
V
StaticCharacteristic
Collector-emitter breakdown voltage V(BR)CES VGE=0V,IC=0.20mA
Collector-emitter saturation voltage VCEsat
V
V
Diode forward voltage
VF
VGE=0V,IF=20.0A
Tvj=25°C
Tvj=125°C
Tvj=175°C
Gate-emitter threshold voltage
VGE(th)
IC=0.20mA,VCE=VGE
Zero gate voltage collector current
ICES
VCE=650V,VGE=0V
Tvj=25°C
Tvj=175°C
-
1400
50
-
µA
Gate-emitter leakage current
IGES
VCE=0V,VGE=20V
-
-
100
nA
Transconductance
gfs
VCE=20V,IC=20.0A
-
24.0
-
S
V
ElectricalCharacteristic,atTvj=25°C,unlessotherwisespecified
Parameter
Symbol Conditions
Value
Unit
min.
typ.
max.
-
1200
-
-
30
-
-
5
-
-
48.0
-
nC
-
7.0
-
nH
DynamicCharacteristic
Input capacitance
Cies
Output capacitance
Coes
Reverse transfer capacitance
Cres
Gate charge
QG
Internal emitter inductance
measured 5mm (0.197 in.) from
case
LE
VCE=25V,VGE=0V,f=1MHz
VCC=520V,IC=20.0A,
VGE=15V
pF
SwitchingCharacteristic,InductiveLoad
Parameter
Symbol Conditions
Value
Unit
min.
typ.
max.
-
19
-
ns
-
21
-
ns
-
160
-
ns
-
23
-
ns
-
0.56
-
mJ
-
0.13
-
mJ
-
0.69
-
mJ
IGBTCharacteristic,atTvj=25°C
Turn-on delay time
td(on)
Rise time
tr
Turn-off delay time
td(off)
Fall time
tf
Turn-on energy
Eon
Turn-off energy
Eoff
Total switching energy
Ets
Datasheet
Tvj=25°C,
VCC=400V,IC=20.0A,
VGE=0.0/15.0V,
RG(on)=32.0Ω,RG(off)=32.0Ω,
Lσ=30nH,Cσ=30pF
Lσ,CσfromFig.E
Energy losses include “tail” and
diode reverse recovery.
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Turn-on delay time
td(on)
Rise time
tr
Turn-off delay time
td(off)
Fall time
tf
Turn-on energy
Eon
Turn-off energy
Eoff
Total switching energy
Ets
Tvj=25°C,
VCC=400V,IC=10.0A,
VGE=0.0/15.0V,
RG(on)=32.0Ω,RG(off)=32.0Ω,
Lσ=30nH,Cσ=30pF
Lσ,CσfromFig.E
Energy losses include “tail” and
diode reverse recovery.
-
17
-
ns
-
11
-
ns
-
160
-
ns
-
27
-
ns
-
0.23
-
mJ
-
0.05
-
mJ
-
0.28
-
mJ
-
80
-
ns
-
0.50
-
µC
-
8.5
-
A
-
-750
-
A/µs
-
56
-
ns
-
0.36
-
µC
-
10.0
-
A
-
-500
-
A/µs
DiodeCharacteristic,atTvj=25°C
Diode reverse recovery time
trr
Diode reverse recovery charge
Qrr
Diode peak reverse recovery current Irrm
Diode peak rate of fall of reverse
recoverycurrentduringtb
dirr/dt
Diode reverse recovery time
trr
Diode reverse recovery charge
Qrr
Diode peak reverse recovery current Irrm
Diode peak rate of fall of reverse
recoverycurrentduringtb
Tvj=25°C,
VR=400V,
IF=20.0A,
diF/dt=800A/µs
Tvj=25°C,
VR=400V,
IF=10.0A,
diF/dt=860A/µs
dirr/dt
SwitchingCharacteristic,InductiveLoad
Parameter
Symbol Conditions
Value
Unit
min.
typ.
max.
-
19
-
ns
-
22
-
ns
-
180
-
ns
-
19
-
ns
-
0.70
-
mJ
-
0.15
-
mJ
-
0.85
-
mJ
-
17
-
ns
-
12
-
ns
-
180
-
ns
-
23
-
ns
-
0.34
-
mJ
-
0.06
-
mJ
-
0.40
-
mJ
IGBTCharacteristic,atTvj=150°C
Turn-on delay time
td(on)
Rise time
tr
Turn-off delay time
td(off)
Fall time
tf
Turn-on energy
Eon
Turn-off energy
Eoff
Total switching energy
Ets
Turn-on delay time
td(on)
Rise time
tr
Turn-off delay time
td(off)
Fall time
tf
Turn-on energy
Eon
Turn-off energy
Eoff
Total switching energy
Ets
Datasheet
Tvj=150°C,
VCC=400V,IC=20.0A,
VGE=0.0/15.0V,
RG(on)=32.0Ω,RG(off)=32.0Ω,
Lσ=30nH,Cσ=30pF
Lσ,CσfromFig.E
Energy losses include “tail” and
diode reverse recovery.
Tvj=150°C,
VCC=400V,IC=10.0A,
VGE=0.0/15.0V,
RG(on)=32.0Ω,RG(off)=32.0Ω,
Lσ=30nH,Cσ=30pF
Lσ,CσfromFig.E
Energy losses include “tail” and
diode reverse recovery.
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Highspeedswitchingseries5thgeneration
DiodeCharacteristic,atTvj=150°C
Diode reverse recovery time
trr
Diode reverse recovery charge
Qrr
Diode peak reverse recovery current Irrm
Diode peak rate of fall of reverse
recoverycurrentduringtb
dirr/dt
Diode reverse recovery time
trr
Diode reverse recovery charge
Qrr
Diode peak reverse recovery current Irrm
Diode peak rate of fall of reverse
recoverycurrentduringtb
Datasheet
Tvj=150°C,
VR=400V,
IF=20.0A,
diF/dt=800A/µs
Tvj=150°C,
VR=400V,
IF=10.0A,
diF/dt=750A/µs
dirr/dt
6
-
108
-
ns
-
1.08
-
µC
-
13.5
-
A
-
-620
-
A/µs
-
80
-
ns
-
0.77
-
µC
-
13.0
-
A
-
-650
-
A/µs
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Highspeedswitchingseries5thgeneration
130
40
120
35
110
30
IC,COLLECTORCURRENT[A]
Ptot,POWERDISSIPATION[W]
100
90
80
70
60
50
40
25
20
15
10
30
20
5
10
0
25
50
75
100
125
150
0
175
25
TC,CASETEMPERATURE[°C]
100
125
150
175
Figure 2. Collectorcurrentasafunctionofcase
temperature
(VGE≥15V,Tvj≤175°C)
60
60
55
55
50
50
VGE=18V
45
15V
40
12V
35
10V
30
8V
25
7V
6V
20
5V
15
15V
40
10V
30
8V
25
7V
5V
15
5
5
2
3
4
0
5
VCE,COLLECTOR-EMITTERVOLTAGE[V]
Figure 3. Typicaloutputcharacteristic
(Tvj=25°C)
Datasheet
6V
20
10
1
12V
35
10
0
VGE=18V
45
IC,COLLECTORCURRENT[A]
IC,COLLECTORCURRENT[A]
75
TC,CASETEMPERATURE[°C]
Figure 1. Powerdissipationasafunctionofcase
temperature
(Tvj≤175°C)
0
50
4V
0
1
2
3
4
5
VCE,COLLECTOR-EMITTERVOLTAGE[V]
Figure 4. Typicaloutputcharacteristic
(Tvj=150°C)
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Highspeedswitchingseries5thgeneration
60
2.00
Tj=25°C
Tj=150°C
VCEsat,COLLECTOR-EMITTERSATURATION[V]
55
IC,COLLECTORCURRENT[A]
50
45
40
35
30
25
20
15
10
IC=5A
IC=10A
IC=20A
1.75
1.50
1.25
1.00
0.75
5
0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
0.50
8.5
25
VGE,GATE-EMITTERVOLTAGE[V]
Figure 5. Typicaltransfercharacteristic
(VCE=20V)
50
75
100
125
150
175
Tvj,JUNCTIONTEMPERATURE[°C]
Figure 6. Typicalcollector-emittersaturationvoltageas
afunctionofjunctiontemperature
(VGE=15V)
1000
td(off)
tf
td(on)
tr
td(off)
tf
td(on)
tr
t,SWITCHINGTIMES[ns]
t,SWITCHINGTIMES[ns]
100
10
1
0
5
100
10
1
10 15 20 25 30 35 40 45 50 55 60
IC,COLLECTORCURRENT[A]
Figure 7. Typicalswitchingtimesasafunctionof
collectorcurrent
(inductiveload,Tvj=150°C,VCE=400V,
VGE=0/15V,RG=32Ω,Dynamictestcircuitin
Figure E)
Datasheet
10
20
30
40
50
60
70
80
90
100
RG,GATERESISTOR[Ω]
Figure 8. Typicalswitchingtimesasafunctionofgate
resistor
(inductiveload,Tvj=150°C,VCE=400V,
VGE=0/15V,IC=20A,Dynamictestcircuitin
Figure E)
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Highspeedswitchingseries5thgeneration
6.0
typ.
t,SWITCHINGTIMES[ns]
VGE(th),GATE-EMITTERTHRESHOLDVOLTAGE[V]
td(off)
tf
td(on)
tr
100
10
1
25
50
5.5
75
100
125
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
150
25
Tvj,JUNCTIONTEMPERATURE[°C]
Figure 9. Typicalswitchingtimesasafunctionof
junctiontemperature
(inductiveload,VCE=400V,VGE=0/15V,
IC=20A,RG=32Ω,Dynamictestcircuitin
Figure E)
100
125
150
1.6
Eoff
Eon
Ets
2.5
2.0
1.5
1.0
Eoff
Eon
Ets
1.4
E,SWITCHINGENERGYLOSSES[mJ]
3.0
E,SWITCHINGENERGYLOSSES[mJ]
75
Figure 10. Gate-emitterthresholdvoltageasafunction
ofjunctiontemperature
(IC=0.2mA)
3.5
1.2
1.0
0.8
0.6
0.4
0.5
0.0
50
Tvj,JUNCTIONTEMPERATURE[°C]
0.2
0
5
0.0
10 15 20 25 30 35 40 45 50 55 60
IC,COLLECTORCURRENT[A]
Figure 11. Typicalswitchingenergylossesasa
functionofcollectorcurrent
(inductiveload,Tvj=150°C,VCE=400V,
VGE=0/15V,RG=32Ω,Dynamictestcircuitin
Figure E)
Datasheet
10
20
30
40
50
60
70
80
90
100
RG,GATERESISTOR[Ω]
Figure 12. Typicalswitchingenergylossesasa
functionofgateresistor
(inductiveload,Tvj=150°C,VCE=400V,
VGE=0/15V,IC=20A,Dynamictestcircuitin
Figure E)
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Highspeedswitchingseries5thgeneration
1.2
1.2
Eoff
Eon
Ets
Eoff
Eon
Ets
1.0
E,SWITCHINGENERGYLOSSES[mJ]
E,SWITCHINGENERGYLOSSES[mJ]
1.0
0.8
0.6
0.4
0.8
0.6
0.4
0.2
0.0
0.2
25
50
75
100
125
0.0
200
150
Tvj,JUNCTIONTEMPERATURE[°C]
Figure 13. Typicalswitchingenergylossesasa
functionofjunctiontemperature
(inductiveload,VCE=400V,VGE=0/15V,
IC=20A,RG=32Ω,Dynamictestcircuitin
Figure E)
300
350
400
450
500
Figure 14. Typicalswitchingenergylossesasa
functionofcollectoremittervoltage
(inductiveload,Tvj=150°C,VGE=0/15V,
IC=20A,RG=32Ω,Dynamictestcircuitin
Figure E)
16
1E+4
130V
520V
Cies
Coes
Cres
14
12
1000
C,CAPACITANCE[pF]
VGE,GATE-EMITTERVOLTAGE[V]
250
VCE,COLLECTOR-EMITTERVOLTAGE[V]
10
8
6
100
4
10
2
0
0
5
10
15
20
25
30
35
40
45
1
50
QGE,GATECHARGE[nC]
Figure 15. Typicalgatecharge
(IC=20A)
Datasheet
0
5
10
15
20
25
30
VCE,COLLECTOR-EMITTERVOLTAGE[V]
Figure 16. Typicalcapacitanceasafunctionof
collector-emittervoltage
(VGE=0V,f=1MHz)
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1
Zth(j-c),TRANSIENTTHERMALIMPEDANCE[K/W]
Zth(j-c),TRANSIENTTHERMALIMPEDANCE[K/W]
1
D=0.5
0.2
0.1
0.05
0.1
0.02
0.01
single pulse
0.01
D=0.5
0.2
0.1
0.02
0.01
single pulse
0.01
i:
1
2
3
4
5
6
ri[K/W]: 0.014628 0.379807 0.573028 0.211451 0.018267 2.3E-3
τi[s]:
1.5E-5
3.4E-4
2.4E-3
0.013923 0.197253 2.48511
0.001
1E-7
1E-6
1E-5
1E-4
0.001
0.01
0.05
0.1
i:
1
2
3
4
5
6
ri[K/W]: 0.024075 0.499909 0.710519 0.239699 0.020917 2.5E-3
τi[s]:
1.6E-5
3.4E-4
2.3E-3
0.014107 0.195819 2.379491
0.1
0.001
1E-7
1E-6
tp,PULSEWIDTH[s]
Figure 17. IGBTtransientthermalimpedance
(D=tp/T)
0.01
0.1
Tj=25°C, IF = 20A
Tj=150°C, IF = 20A
120
1.2
Qrr,REVERSERECOVERYCHARGE[µC]
trr,REVERSERECOVERYTIME[ns]
0.001
1.4
Tj=25°C, IF = 20A
Tj=150°C, IF = 20A
110
100
90
80
70
1.0
0.8
0.6
0.4
0.2
60
700
900
1100
1300
0.0
500
1500
diF/dt,DIODECURRENTSLOPE[A/µs]
Figure 19. Typicalreverserecoverytimeasafunction
ofdiodecurrentslope
(VR=400V)
Datasheet
1E-4
Figure 18. Diodetransientthermalimpedanceasa
functionofpulsewidth
(D=tp/T)
130
50
500
1E-5
tp,PULSEWIDTH[s]
700
900
1100
1300
1500
diF/dt,DIODECURRENTSLOPE[A/µs]
Figure 20. Typicalreverserecoverychargeasa
functionofdiodecurrentslope
(VR=400V)
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18
0
Tj=25°C, IF = 20A
Tj=150°C, IF = 20A
dIrr/dt,diodepeakrateoffallofIrr[A/µs]
Irrm,REVERSERECOVERYCURRENT[A]
16
Tj=25°C, IF = 20A
Tj=150°C, IF = 20A
-100
14
12
10
8
6
4
2
-200
-300
-400
-500
-600
-700
-800
-900
0
500
700
900
1100
1300
1500
-1000
500
diF/dt,DIODECURRENTSLOPE[A/µs]
700
900
1100
1300
1500
diF/dt,DIODECURRENTSLOPE[A/µs]
Figure 21. Typicalpeakreverserecoverycurrentasa
functionofdiodecurrentslope
(VR=400V)
Figure 22. Typicaldiodepeakrateoffallofreverse
recoverycurrentasafunctionofdiode
currentslope
(VR=400V)
60
2.00
Tj=25°C
Tj=150°C
1.75
VF,FORWARDVOLTAGE[V]
IF,FORWARDCURRENT[A]
50
40
30
20
1.50
1.25
1.00
10
0
IF=10A
IF=20A
IF=40A
0.0
0.5
1.0
1.5
2.0
2.5
0.75
VF,FORWARDVOLTAGE[V]
Figure 23. Typicaldiodeforwardcurrentasafunction
offorwardvoltage
Datasheet
25
50
75
100
125
150
175
Tvj,JUNCTIONTEMPERATURE[°C]
Figure 24. Typicaldiodeforwardvoltageasafunction
ofjunctiontemperature
12
V2.1
2018-01-11
IKB20N65EH5
Highspeedswitchingseries5thgeneration
Package Drawing PG-TO263-3
MAX
4.57
0.25
0.85
1.15
0.65
1.40
9.45
7.90
10.31
8.60
MIN
4.30
0.00
0.65
0.95
0.33
1.17
8.51
7.10
9.80
6.50
2.54
5.08
2
14.61
2.29
0.70
1.00
16.05
9.30
4.50
10.70
3.65
1.25
Datasheet
MAX
0.180
0.010
0.033
0.045
0.026
0.055
0.372
0.311
0.406
0.339
MIN
0.169
0.000
0.026
0.037
0.013
0.046
0.335
0.280
0.386
0.256
Z8B00003324
0
0
5 5
0.100
0.200
2
15.88
3.00
1.60
1.78
16.25
9.50
4.70
10.90
3.85
1.45
0.575
0.090
0.028
0.039
0.632
0.366
0.177
0.421
0.144
0.049
13
7.5mm
0.625
0.118
0.063
0.070
0.640
0.374
0.185
0.429
0.152
0.057
30-08-2007
01
V2.1
2018-01-11
IKB20N65EH5
Highspeedswitchingseries5thgeneration
Testing Conditions
VGE(t)
I,V
90% VGE
t rr = t a + t b
Q rr = Q a + Q b
dIF/dt
a
10% VGE
b
t
Qa
IC(t)
Qb
dI
90% IC
90% IC
10% IC
10% IC
Figure C. Definition of diode switching
characteristics
t
VCE(t)
t
td(off)
tf
td(on)
t
tr
Figure A.
VGE(t)
90% VGE
Figure D.
10% VGE
t
IC(t)
CC
2% IC
t
Figure E. Dynamic test circuit
Parasitic inductance Ls,
parasitic capacitor Cs,
relief capacitor Cr,
(only for ZVT switching)
VCE(t)
t2
E
off
=
t4
VCE x IC x dt
E
t1
t1
on
=
VCE x IC x d t
2% VCE
t3
t2
t3
t4
t
Figure B.
Datasheet
14
V2.1
2018-01-11
IKB20N65EH5
Highspeedswitchingseries5thgeneration
RevisionHistory
IKB20N65EH5
Revision:2018-01-11,Rev.2.1
Previous Revision
Revision
Date
Subjects (major changes since last revision)
2.1
2018-01-11
Final data sheet
Datasheet
15
V2.1
2018-01-11
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InfineonTechnologiesAG
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