Material Content Data Sheet Sales Product Name IPW90R1K0C3 MA# MA000468418 Package PG-TO247-3-41 Issued 29. August 2013 Weight* 6046.46 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal non noble metal noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel antimony silver tin 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7440-36-0 7440-22-4 7440-31-5 5.558 0.09 3.972 0.07 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.09 919 919 657 1.192 0.02 3967.074 65.62 65.71 656098 197 656952 0.713 0.01 0.01 118 118 20.040 0.33 3314 380.759 6.30 1603.198 26.51 33.14 265147 62972 331433 31.874 0.53 0.53 5272 5272 29.065 0.48 0.48 4807 4807 0.302 0.00 0.754 0.01 1.961 0.03 50 125 0.04 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 324 499 1000000