CYStech Electronics Corp. 1.0Amp. Surface Mount Schottky Barrier Diodes Spec. No. : C292SH Issued Date : 2011.06.29 Revised Date : 2011.09.09 Page No. : 1/1 SOD-123 CSOD1200SH Features • For surface mounted applications. • For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications • Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 • Low leakage current • High surge capability • High temperature soldering: 250°C/10 seconds at terminals • Exceeds environmental standards of MIL-S-19500/228 • Pb-free lead plating and halogen-free package Mechanical Data • Case: Molded plastic, JEDEC SOD-123. • Terminals: Pure tin plated, solderable per MIL-STD-202 method 208 • Polarity: Indicated by cathode band. • Weight: 0.04 gram approximately Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified.) Parameter Repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum instantaneous forward voltage, IF=1A (Note 1) Average forward rectified current Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) Maximum DC reverse current VR=200V,TJ=25℃(Note 1) VR=200V,TJ=125℃(Note 1) Maximum thermal resistance, Junction to ambient Diode junction capacitance @ f=1MHz and applied 5V reverse voltage Storage temperature range Operating temperature range Symbol VRRM VRMS VR VF IO Limits 200 140 200 0.95 1 Units V V V V A IFSM 10 A IR mA Rth,JA 0.01 10 250(typ) ℃/W CD 17(typ) pF Tstg TJ -65 ~ +175 -50 ~ +150 ℃ ℃ Notes : 1.Pulse test, pulse width=300μsec, 2% duty cycle CSOD1200SH CYStek Product Specification Spec. No. : C292SH Issued Date : 2011.06.29 Revised Date : 2011.09.09 Page No. : 2/2 CYStech Electronics Corp. Characteristic Curves Fig. 2 Maximum Non-repetitive Peak Forward Surge Current Fig. 1 Forward Current Derating Curve 12 Peak Forward Surge Current---IFSM (A) Average Forward Current---Io(A) 1.2 1 0.8 0.6 0.4 resistive or inductive load 0.375"(9.5mm) lead length 0.2 10 8 6 4 2 0 0 0 25 50 75 100 125 150 175 1 200 10 Case Temperature---TC(℃) Fig 3. Forward Characteristics Fig. 4 Typical Reverse Characteristics 10 Reverse Leakage Current---I R(μA) Instantaneous Forward Current---IF(mA) 10000 Tj=125°C 1000 Tj=75°C 100 Tj=25°C 10 Pulse width=300μs, 1% Duty cycle 1 Tj=125℃ 1 Tj=75℃ 0.1 0.01 Tj=25℃ 0.001 0 0.2 0.4 0.6 0.8 1 1.2 Forward Voltage---VF(V) 1.4 0 50 100 150 200 Reverse Voltage---VR (V) Fig. 6 Typical Transient Thermal Impedance Fig. 5 Typical Junction Capacitance 100 100 Transient Thermal Impedance(℃/W) Junction Capacitance---CJ(pF) 100 Number of cycles at 60Hz 10 Tj=25℃, f=1.0MHz Vsig=50mVp-p 1 10 1 0.1 0.1 1 10 Reverse Voltage---VR (V) CSOD1200SH 100 0.01 0.1 1 10 100 Pulse Duration---t(s) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C292SH Issued Date : 2011.06.29 Revised Date : 2011.09.09 Page No. : 3/3 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. CSOD1200SH CYStek Product Specification CYStech Electronics Corp. Spec. No. : C292SH Issued Date : 2011.06.29 Revised Date : 2011.09.09 Page No. : 4/4 Reel Dimension Carrier Tape Dimension CSOD1200SH CYStek Product Specification CYStech Electronics Corp. Spec. No. : C292SH Issued Date : 2011.06.29 Revised Date : 2011.09.09 Page No. : 5/5 SOD-123 Dimension Marking: S4 2-Lead SOD-123 Plastic Surface Mounted Package CYStek Package Code: SH Inches Min. Max. 0.102 0.110 0.059 0.067 0.041 0.049 DIM A B C Millimeters Min. Max. 2.600 2.800 1.500 1.700 1.050 1.250 Style: Pin 1.Cathode 2.Anode DIM D E Inches Min. Max. 0.018 0.026 0.140 0.152 Millimeters Min. Max. 0.450 0.650 3.550 3.850 Notes: 1.Controlling dimension : millimeters. 2.Lead thickness specified per L/F drawing with solder plating. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. CSOD1200SH CYStek Product Specification