Foshan MBRP20200CT Schottky barrier diode in a to-3p plastic package Datasheet

MBRP20200CT
Rev.F Mar.-2016
描述
/
DATA SHEET
Descriptions
TO-3P 塑封封装 肖特基二极管。
Schottky Barrier Diode in a TO-3P Plastic Package.
特征
/ Features
损耗低,效率高。
Low power loss, high efficiency.
用途
/
Applications
用于高频、低压、大电流整流二极管,续流二极管,保护二极管。
For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications.
内部等效电路
引脚排列
/ Equivalent Circuit
/ Pinning
PIN1:Anode
放大及印章代码
PIN 2:Cathode
PIN 3:Anode
/ hFE Classifications & Marking
见印章说明。See Marking Instructions.
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MBRP20200CT
Rev.F Mar.-2016
极限参数
/
DATA SHEET
Absolute Maximum Ratings(Ta=25℃)
参数
Parameter
符号
Symbol
数值
Rating
单位
Unit
Peak Repetitive Reverse Voltage
VRRM
200
V
Working Peak Reverse Voltage
VRWM
200
V
Peak Repetitive Forward Current
IFRM
20
A
IF(AV)
10
A
IF(AV)(total)
20
A
Non Repetitive Peak Surge Current
IFSM
150
A
Peak Repetitive Reverse Surge Current
IRRM
1.0
A
Thermal Resistance Junction to Case
RθJc
1.25
℃/W
Junction Temperature Range
Tj
150
℃
Storage Temperature Range
Tstg
-65~150
℃
Average Rectified Forward Current
电性能参数
/ Electrical Characteristics(Ta=25℃)
参数
Parameter
Forward Voltage
Instantaneous Reverse Current
Voltage Rate of Change
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符号
Symbol
VF
IR
dv/dt
测试条件
Test Conditions
最小值 典型值 最大值
Min
Typ
Max
单位
Unit
IF =10A(Tj=25℃)
0.8
0.9
V
IF =10A(Tj=125℃)
0.66
0.8
V
IF =20A(Tj=25℃)
0.89
1.0
V
IF =20A(Tj=125℃)
0.76
0.9
V
1.0
mA
50
mA
10000
V/μs
VR=200V(Tj=25℃)
VR=200V(Tj=125℃)
0.4
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MBRP20200CT
Rev.F Mar.-2016
电参数曲线图
DATA SHEET
/ Electrical Characteristic Curve
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MBRP20200CT
Rev.F Mar.-2016
外形尺寸图
DATA SHEET
/ Package Dimensions
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MBRP20200CT
Rev.F Mar.-2016
印章说明
/
DATA SHEET
Marking Instructions
BR
MBR20200
CT
****

说明:
BR:
为公司代码
MBR20200: 
为产品型号
CT:  

为内部结构
****:

为生产批号代码,随生产批号变化。

Company Code
Note:
BR:  
MBR20200:
Product Type.
CT:

Internal Structure
****:

Lot No. Code, code change with Lot No.
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MBRP20200CT
Rev.F Mar.-2016
DATA SHEET
波峰焊温度曲线图(无铅)
/
Temperature Profile for Dip Soldering(Pb-Free)
说明:
Note:
1、预热温度 25~150℃,时间 60~90sec;
1.Preheating:25~150℃, Time:60~90sec.
2、峰值温度 255±5℃,时间持续为 5±0.5sec;
2.Peak Temp.:255±5℃, Duration:5±0.5sec.
3、焊接制程冷却速度为 2~10℃/sec.
3. Cooling Speed: 2~10℃/sec.
耐焊接热试验条件
/
Resistance to Soldering Heat Test Conditions
温度:270±5℃
包装规格
Package Type
封装形式
使用说明
Temp.:270±5℃
Time:10±1 sec
/ Packaging SPEC.
套管包装
TO-3P
时间:10±1 sec.
/ TUBE
Units 包装数量
Dimension
包装尺寸
3
(unit:mm )
Units/Tube
只/套管
Tubes/Inner Box
套管/盒
Units/Inner Box
只/盒
Inner Boxes/Outer Box
盒/箱
Units/Outer Box
只/箱
Tube 套管
Inner Box 盒
Outer Box 箱
30
15
450
5
2250
497.5×46×8
555×164×50
575×290×180
/ Notices
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