STMicroelectronics BAL-CC25-01D3 Low amplitude imbalance Datasheet

BAL-CC25-01D3
50 ohm, conjugate match to CC253x, CC254x, CC257x, CC852x,
CC853x, transformer balun
Datasheet  production data
Description
STMicroelectronics BAL-CC25-01D3 is an ultra
miniature balun which integrates a matching
network in a monolithic glass substrate. This has
been customized for the CC25xx and CC85xx RF
transceivers.
It’s a design using STMicroelectronics IPD
(integrated passive device) technology on nonconductive glass substrate to optimize RF
performance.
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Figure 1. Pin configuration (top view)
Features
 2.45 GHz balun with integrated matching
network
 Matching optimized for following chip-sets:
– CC2530, CC2531, CC2533
– CC2540
– CC2543, CC2544, CC2545
– CC2570, CC2571
– CC8520, CC8521
– CC8530, CC82531
 Low insertion loss
 Low amplitude imbalance
RF_N
SE
RF_P
GND
Figure 2. Application schematic (top view)
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 Low phase imbalance
 Coated Flip-Chip on glass
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 Small footprint: < 0.88 mm²
Benefits
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 High RF performance
 PCB space saving versus discrete solution
 BOM count reduction
 Efficient manufacturability
November 2015
This is information on a product in full production.
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Characteristics
1
BAL-CC25-01D3
Characteristics
Table 1. Absolute maximum rating (limiting values)
Value
Symbol
Parameter
Unit
Min.
PPEAK
Input power RFIN
Typ.
Max.
20
dBm
ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5 kair discharge) 2000
VESD
TOP
ESD ratings machine model (MM: C = 200 pF, R = 25L = 500 nH)
500
ESD ratings charged device model (CDM, JESD22-C101D)
500
Operating temperature
-40
V
+125
ºC
Table 2. Electrical characteristics - RF performance (Tamb = 25 °C)
Value
Symbol
Parameter
Unit
Min.
ZOUT
Max.
Nominal input impedance
Conjugate match to CC25xx,
CC85xx
F
Frequency range (bandwidth)
2379
IL
Insertion loss in bandwidth
ZIN

2507
0.66
dB
Single ended return loss in bandwidth
19
dB
Differential ended return loss in bandwidth
19
dB
imb
Phase imbalance
14
°
Aimb
Amplitude imbalance
0.3
dB
RL_SE
RL_DIFF
2/10
Nominal differential output impedance
Typ.
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BAL-CC25-01D3
Characteristics
Figure 3. Insertion loss (Tamb = 25 °C)
-0.5
IL (dB)
-0.6
-0.7
-0.8
-0.9
F (GHz)
-1.0
2.38
2.40
2.42
2.44
2.46
2.48
2.50
2.52
Figure 4. Return loss (Tamb = 25 °C)
RL_SE (dB)
-10
-12.5
-15
-17.5
-20
-22.5
-25
-27.5
F (GHz)
-30
2.38
2.40
2.42
2.44
2.46
2.48
2.50
2.52
Figure 5. Return loss (Tamb = 25 °C)
RL_DIFF (dB)
-10
-12.5
-15
-17.5
-20
-22.5
-25
-27.5
F (GHz)
-30
2.38
2.40
2.42
2.44
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2.46
2.48
2.50
2.52
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Characteristics
BAL-CC25-01D3
Figure 6. Amplitude imbalance (Tamb = 25 °C)
AMPL(dB)
0.5
0.4
0.3
0.2
0.1
F (GHz)
0.0
2.38
2.40
2.42
2.44
2.46
2.48
2.50
2.52
Figure 7. Phase imbalance (Tamb = 25 °C)
PHASE(deg)
20.0
17.5
15
12.5
10
7.5
5
2.5
F (GHz)
0.0
2.38
4/10
2.40
2.42
2.44
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2.46
2.48
2.50
2.52
BAL-CC25-01D3
2
Package information
Package information

Epoxy meets UL94, V0

Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Flip-Chip package information
Figure 8. Flip-Chip package outline
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Table 3. Flip-Chip package mechanical data
Description
Parameter
Min.
Typ.
Max.
Unit
A
Bump height + substrate thickness
0.570
0.630
0.690
mm
A1
Bump height
0.155
0.205
0.255
mm
A2
Substrate thickness
0.400
mm
b
Bump diameter
0.215
0.255
0.295
mm
D
Y dimension of the die
0.890
0.940
0.990
mm
D1
Y pitch
0.500
E
X dimension of the die
E1
X pitch
SE
0.890
0.940
mm
0.990
mm
0.500
mm
0.250
mm
fD
Distance from bump to edge of die on Y
axis
0.220
mm
fE
Distance from bump to edge of die on X
axis
0.220
mm
ccc
0.05
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0.025
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mm
mm
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Package information
BAL-CC25-01D3
Figure 9. Footprint
PP
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PP
PP
#
Figure 10. Footprint - 3 mils stencil -non solder
mask defined
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Figure 12. Footprint - 5 mils stencil -non solder
mask defined
6/10
Figure 11. Footprint - 3 mils stencil - solder
mask defined
Figure 13. Footprint - 5 mils stencil - solder
mask defined
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BAL-CC25-01D3
Package information
Figure 14. PCB layout recommendation
Pad diameter 250µm
850 µm
280 µm
850 µm
127 µm
GND aperture 100 µm
250 µm
Figure 15. Marking
Dot, ST logo
ECOPACK grade
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
Note:
x x z
y ww
More information is available in the STMicroelectronics Application note:
AN2348 Flip-Chip: “Package description and recommendations for use”
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Package information
BAL-CC25-01D3
2.0 ± 0.05
Ø 1.55 ± 0.10
4.0 ± 0.1
1.0 ± 0.05
8.0 ± 0.3
0.20 ± 0.015
ST
ST
ST
ST
ST
ST
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xxz
yww
xxz
yww
xxz
yww
xxz
yww
xxz
yww
xxz
yww
xxz
yww
2.0 ± 0.05
1.0 ± 0.05
0.73 ± 0.05
All dimensions are typical values in mm
Note:
User direction of unreeling
More information is available in the application note:
AN2348: “Flip Chip: package description and recommendations for use”
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3.5 ± 0.05
Dot identifying Pin A1 location
1.75 ± 0.1
Figure 16. Flip Chip tape and reel specifications
BAL-CC25-01D3
3
Ordering information
Ordering information
Table 4. Ordering information
4
Order code
Marking
Package
Weight
Base qty
Delivery mode
BAL-CC25-01D3
SL
Flip Chip
1.07 mg
5000
Tape and reel (7”)
Revision history
Table 5. Document revision history
Date
Revision
Changes
23-May-2013
1
Initial release
11-Jul-2013
2
Updated Figure 14.
04-Sep-2015
3
Updated Figure 8. Added Figure 10, Figure 11, Figure 12, Figure 13
and Table 3.
12-Nov-2015
4
Updated Table 1.
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BAL-CC25-01D3
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