MA-COM MSWSH-040-30 Pin diode shunt switch element Datasheet

MSWSH-040-30
PIN Diode Shunt Switch Element
Rev. V1
Features
 Supports up to 40 W Power
 Low Insertion Loss:
0.10 dB to 2.7 GHz
0.25 dB to 6.0 GHz
 High Isolation:
25 dB to 6.0 GHz
 RoHS* Compliant
Description
A broadband, high linearity, medium power shunt
switch element in a 1.9 x 1.1 mm DFN package.
This device is designed for wireless
telecommunications infrastructure and test
instrument applications. It is also suited for other
applications in 0.05 ~ 6 GHz.
Pin Out / Schematic
Ordering Information
Part Number
Package
MSWSH-040-30
3000 piece reel
Electrical Specifications: TA = +25°C
1
Parameter
Test Conditions
Units
Min.
Typ.
Max.
Breakdown Voltage (VB)
IR = 10 µA
V
500
—
—
Total Capacitance (CT)
VR = -50 V, 1 MHz
pF
—
0.42
—
Series Resistance (RS)
IF = 100 mA, 500 MHz
Ω
—
0.36
—
I-Region (W)
I-Layer
mm
—
40
—
Insertion Loss (IL)
VR = 10 V
2.7 GHz
<6.0 GHz
dB
—
0.10
0.30
0.30
0.50
Isolation (ISO)
IF = 100 mA
2.7 GHz
<6.0 GHz
dB
29
24
32
36
—
Input / Output Return Loss (RL)
VR = 10 V
2.7 GHz
<6.0 GHz
dB
18
13
22
15
—
Minority Carrier Lifetime (TL)
IF = 10 mA, IR = 6 mA, @ 50%
ns
—
600
—
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MSWSH-040-30
PIN Diode Shunt Switch Element
Rev. V1
Absolute Maximum Ratings
Parameter
Absolute Maximum
Breakdown Voltage
500 V
Forward Current
500 mA
Thermal Resistance
10°C/W
Junction Temperature
+175°C
Storage Temperature
-65°C to +150°C
Assembly Temperature
+260°C
Per JEDEC STD-J-20C
Junction Temperature vs. Power
Mounted on Heatsink, +25°C, 1.3 GHz
Insertion Loss
Isolation
Input Return Loss
Series Resistance vs. Bias, 500 MHz
2
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MSWSH-040-30
PIN Diode Shunt Switch Element
Rev. V1
Printed Circuit Board Layout
NOTE: If possible, use copper filled vias underneath
pin 3 for better thermals; otherwise, use vias that are
plated through, filled and plated over.
Solder mask should provide a 60 um clearance
between copper pad and soldermask. Rounded pkg
pads should have matching rounded solder mask
openings.
Use circles or squares for the thermal land stencil
such that only get 50% to 80% solder paste
coverage.
Outline (2012)
3
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MSWSH-040-30
PIN Diode Shunt Switch Element
Rev. V1
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4
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
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