Datasheet
Piezoelectric Actuator Driver
BU64562GWZ
●Key Specifications
PMOS ON Resistance:
NMOS ON Resistance:
Standby current consumption:
High precision 15MHz Oscillator:
Operating temperature range:
●General Description
The BU64562GWZ is designed to drive Piezo motors for
camera auto focus.
It has an integrated D/A converter for setting the output
voltage.
This lens driver includes the slope sequence to reduce
the driving noise of Piezo actuator.
The functional lens system can be controlled through
2
2-wire serial interface (I C BUS compatible).
●Package
UCSP30L1
0.70 Ω (Typ.)
0.70 Ω (Typ.)
0 µA (Typ.)
± 3%
- 25 to + 85 °C
W(Typ.) x D(Typ.) x H(Max.)
1.90 mm x 0.77 mm x 0.33 mm
●Features
Ultra-small chip size package
Low ON-Resistance Power CMOS output
Built-in 15 MHz Oscillator (OSC)
2-wire serial interface (I2C BUS compatible)
1.8 V can be put into each control input terminal
Slew rate control function of output voltage
Standby current consumption 0 µA (Typ.)
●Applications
Auto focus of cell phone
Auto focus of Digital still camera
Camera Modules
Lens Auto focus
Web, Tablet and PC Cameras
●Typical Application Circuit
VCC
SDA
2-wire
Slope
DAC
Control
serial
SCL
0.1 to 10 µF
2.0 to 10 µF
VM
Interface
OUTA
Pre
Driver
PS
Controller
OUTB
15 MHz
OSC
GND
Figure 1. Typical Application Circuit
○Product structure：Silicon monolithic integrated circuit
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TSZ22111・14・001
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TSZ02201-0H2H0B600450-1-2
9.Oct.2012 Rev.001
Datasheet
BD64562GWZ
●Pin Configuration
1
2
3
4
A
SCL
SDA
OUTA
GND
B
PS
VCC
VM
OUTB
Figure 2. Pin configuration (TOP VIEW)
●Pin Description
Ball No.
Ball Name
Function
A1
SCL
2-wire serial interface clock input
A2
SDA
2-wire serial interface data input
A3
OUTA
Actuator terminal
A4
GND
Ground
B1
PS
B2
VCC
B3
VM
VM output voltage
B4
OUTB
Actuator terminal
Power save input
Power supply voltage
●Block Diagram
VCC
SDA
2-wire
serial
Interface
Slope
Control
DAC
VM
SCL
OUTA
Pre
Driver
PS
OUTB
Controller
15 MHz
OSC
GND
Figure 3. Block Diagram
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TSZ02201-0H2H0B600450-1-2
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Datasheet
BD64562GWZ
●Absolute Maximum Ratings
Parameter
Symbol
Limit
Unit
Power supply voltage
VCC
- 0.3 to + 5.5
V
Power save input voltage
VPS
- 0.3 to VCC + 0.3
V
Control input voltage (SCL, SDA)
VIN
- 0.3 to VCC + 0.3
V
Power dissipation
Pd
Operating temperature range
Junction temperature
Storage temperature range
*1
mW
440
Topr
- 25 to + 85
°C
Tjmax
125
°C
Tstg
- 55 to + 125
°C
Iout
- 500 to + 500
*2
mA
- 850 to + 850*3
mA
H-bridge output current
Iout(peak)
*1
*2
*3
Conditions: mounted on a glass epoxy board (50 mm × 58 mm × 1.75 mm; 8 layers).
Must not exceed Pd, ASO, or Tjmax of 125 °C.
Must not exceed pulse width = 5 ms and Duty = 50 %.
In case of Ta > 25 °C, reduced by 4.4 mW / °C.
●Recommended Operating Ratings
Parameter
Symbol
Min.
Typ.
Max.
Unit
Power supply voltage
VCC
2.3
3.0
4.8
V
Power save input voltage
VPS
0
-
4.8
V
Control input voltage (SCL, SDA)
VIN
0
-
4.8
V
2-wire serial interface transmission rate
SCL
-
-
400
kHz
IOUT
-
-
± 400
*4
mA
Iout(peak)
-
-
± 750*5
mA
H-bridge output current
*4
*5
Must not exceed Pd, ASO.
Must not exceed pulse width = 5 ms and Duty = 50 %.
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Datasheet
BD64562GWZ
●Electrical Characteristics ( Unless otherwise specified Ta = 25 °C, VCC = 3.0 V )
Limit
Parameter
Symbol
Unit
Min.
Typ.
Conditions
Max.
Overall
Circuit current
during standby operation
ICCST
-
0
1
µA
PS = L
ICC
-
1.8
3.0
mA
PS = H, SCL = 400 kHz, 15 MHz OSC active
VUVLO
1.8
-
2.2
V
High level input voltage
VPSH
1.5
-
VCC
V
Low level input voltage
VPSL
0
-
0.5
V
High level input current
IPSH
15
30
60
µA
VINH = 3.0 V, pull down resister 100 kΩ
Low level input current
IPSL
-
0
1
µA
VINL = 0 V
High level input voltage
VINH
1.5
-
VCC
V
Low level input voltage
VINL
0
-
0.5
V
Low level output voltage1
VOL1
-
-
0.4
V
IIN = 3.0 mA (SDA)
Low level output voltage2
VOL2
-
-
0.2
V
IIN = 0.7 mA (SDA)
High level input current
IINH
- 10
-
10
µA
Input voltage = VCC
Low level input current
IINL
- 10
-
10
µA
Input voltage = GND
RONP
-
0.7
0.85
Ω
RONN
-
0.7
0.85
Ω
Cycle length of
Sequence drive
TMIN
10.35
10.67
11.00
µs
*6
Built in CLK 160 count, no load
Output rise time
Tr
-
0.1
0.8
µs
*7
No load
*7
No load
Circuit current
UVLO
UVLO voltage
Power save input
Control input(SDA,SCL)
H Bridge Drive
Output ON-Resistance
Output fall time
Tf
-
0.02
0.4
µs
VM voltage (VM2=0x00)
VM00
- 10
0
100
mV
VM voltage (VM2=0x8F)
VM8F
2.6
2.7
2.8
V
VM voltage INL
VMINL
-4
0
4
DAC_code = 0x20 to 0xFF, VCC = 4.8 V
VM voltage DNL
VMDNL
-1
0
1
DAC_code = 0x20 to 0xFF, VCC = 4.8 V
VMR
-
0.7
0.85
VM voltage
VM ON-Resistance
*6
*7
Ω
The time that 1 cycle of sequence drive at the below setting of 2-wire serial data
ta[7:0] = 0x13, brake1[7:0] = 0x03, tb[7:0] = 0x1E, brake2[7:0] = 0x6B, osc[2:0] = 0x0
Output switching wave
90 %
90 %
100 %
Output voltage
10 %
10 %
Tf
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0%
Tr
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Datasheet
BD64562GWZ
●Typical Performance Curves
3.0
3.0
Output current = 100 mA
VM2 = 0xFF
2.5
VM ON-Resistance (Ω)
Output ON-Resistance (Ω)
2.5
2.0
Ta = + 25 ℃
Output current = 100 mA
VM2 = 0xFF
Ta = + 85 ℃
1.5
1.0
2.0
1.5
Ta = + 25 ℃
1.0
Ta = + 85 ℃
Ta = - 25 ℃
0.5
0.5
0.0
0.0
Ta = - 25 ℃
2
2.5
3
3.5
4
4.5
2
5
2.5
3
11.0
2.78
10.9
Cycle length of sequence drive (µs)
2.80
2.76
VCC = 4.8 V
VCC = 3.0 V
VM voltage (V)
4.5
5
Figure 5. VM ON-Resistance
Figure 4. Output ON-Resistance (RONP + RONN)
2.72
2.70
2.68
4
VCC (V)
VCC (V)
2.74
3.5
VCC = 2.7 V
2.66
2.64
2.62
Ta = + 25 ℃
10.8
Ta = - 25 ℃
10.7
10.6
10.5
Ta = + 85 ℃
10.4
10.3
10.2
ta[7:0] = 0x13, brake1[7:0] = 0x03,
tb[7:0] = 0x1E, brake2[7:0] = 0x6B,
osc[2:0] = 0x0, no load
10.1
2.60
10.0
-30 -20 -10 0 10 20 30 40 50 60 70 80 90
Ta (℃)
2.5
3
3.5
4
4.5
5
VCC (V)
Figure 6. VM voltage (VM2 = 0x8F)
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Figure 7. Cycle length of sequence drive
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Datasheet
BD64562GWZ
●2-wire Serial Interface Register detail
Write mode :
Read mode :
S
0
S
0
0
0
0
0
S=Start condition
P=Stop condition
Register name
1
1
1
1
0
0
0
0
0 A
↑
Write
0
A
PS T2 T1 T0 W3 W2 W1 W0
A
PS T2 T1 T0 W3 W2 W1 W0
↑
Write
A=Acknowledge
PS=Power save
ｎA=not Acknowledge T2～T0=Test bit
D7 D6 D5 D4 D3 D2 D1 D0
A
S
0
0
0
1
1
0
A P
↑
Up date
0
1
A
Master is output
Slave is output
D7 D6 D5 D4 D3 D2 D1 D0 nA
P
↑
Read
W3～W0=Resister address
D7～D0=Data
Setting item
Description
PS
Serial power save
0 = Driver in standby mode, 1 = Driver in operating mode
T[2:0]
Test register
address
Test register = 000b
W[3:0]
Register address
Setting Register address
D[9:0]
Data bits
Setting Register data
●Register Map
Address
W3
W2
W1
W0
D7
D6
D5
D4
D3
D2
D1
D0
0x0
0
0
0
0
HiZE
0
0
0
0
START
MODE
dir
0x1
0
0
0
1
ta[7]
ta[6]
ta[5]
ta[4]
ta[3]
ta[2]
ta[1]
ta[0]
0x2
0
0
1
0
brake1[7]
brake1[6]
brake1[5]
brake1[4]
brake1[3]
brake1[2]
brake1[1]
brake1[0]
0x3
0
0
1
1
tb[7]
tb[6]
tb[5]
tb[4]
tb[3]
tb[2]
tb[1]
tb[0]
0x4
0
1
0
0
brake2[7]
brake2[6]
brake2[5]
brake2[4]
brake2[3]
brake2[2]
brake2[1]
brake2[0]
0x5
0
1
0
1
cnt[7]
cnt[6]
cnt[5]
cnt[4]
cnt[3]
cnt[2]
cnt[1]
cnt[0]
0x6
0
1
1
0
cnt[15]
cnt[14]
cnt[13]
cnt[12]
cnt[11]
cnt[10]
cnt[9]
cnt[8]
0x7
0
1
1
1
pa
pb
osc[2]
osc[1]
osc[0]
cntck[2]
cntck[1]
cntck[0]
0x8
1
0
0
0
V1[7]
V1[6]
V1[5]
V1[4]
V1[3]
V1[2]
V1[1]
V1[0]
0x9
1
0
0
1
V2[7]
V2[6]
V2[5]
V2[4]
V2[3]
V2[2]
V2[1]
V2[0]
0xA
1
0
1
0
step2[4]
step2[3]
step2[2]
step2[1]
step2[0]
step1[2]
step1[1]
step1[0]
0xB
1
0
1
1
TEST
TEST
TEST
TEST
TEST
TEST
EXT
TEST
0xC
1
1
0
0
TEST
TEST
TEST
TEST
TEST
TEST
TEST
TEST
0xD
1
1
0
1
TEST
TEST
TEST
TEST
TEST
TEST
TEST
TEST
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Datasheet
BD64562GWZ
●Register catalogue
Bit
Bit Name
Description
Reset
Address : 0x0
D[7]
HiZE
Dead time setting (Reference 13 page)
(Lo: 1 cycle of osc[2:0] setting, Hi: Internal CLK 1 cycle (Typ. 66.67 ns))
0x0
D[6:3]
TEST
Set ‘0x0’
0x0
D[2]
START
Start setting for sequence (Reference 14 page)
0x0
D[1]
MODE
Mode of brake1 / brake2 setting for sequence (Reference 13 page)
0x0
D[0]
dir
Output direction setting while sequence (Reference 14 page)
0x0
Drive waveform setting[7:0] (Reference 10 page)
0x00
Drive waveform setting[7:0] (Reference 10 page)
0x00
Drive waveform setting[7:0] (Reference 10 page)
0x00
Drive waveform setting[7:0] (Reference 10 page)
0x00
Drive time count setting[7:0]
0x00
Address : 0x1
D[7:0]
ta[7:0]
Address : 0x2
D[7:0]
brake1[7:0]
Address : 0x3
D[7:0]
tb[7:0]
Address : 0x4
D[7:0]
brake2[7:0]
Address : 0x5
D[7:0]
cnt[7:0]
(Reference 12 page)
Address : 0x6
D[7:0]
cnt[15:8]
Drive time count setting[15:8]
(Reference 12 page)
0x00
Address : 0x7
D[7]
pa
Output logic setting a (Reference 13 page)
0x0
D[6]
pb
Output logic setting b (Reference 13 page)
0x0
Internal CLK basic cycle setting [2:0] (Reference 11 page)
0x0
Drive time basic cycle setting[2:0] (It is possible to use Normal function only)
(Reference 12 page)
0x0
For setting VM voltageBit [7:0] (Reference 16, 17 page)
0x00
For setting VM voltageBit [7:0] (Reference 16, 17 page)
0x00
D[5:3]
osc[2:0]
D[2:0]
cntck[2:0]
Address : 0x8
D[7:0]
V1[7:0]
Address : 0x9
D[7:0]
V2[7:0]
Address : 0xA
D[7:3]
step2[4:0]
For setting slope of VM voltageBit [4:0] (Reference 16, 17 page)
0x00
D[2:0]
step1[2:0]
For setting slope of VM voltageBit [2:0] (Reference 16, 17 page)
0x0
Set ‘0x0’
0x00
Hi output while sequence, Low output at the stop mode
(Reference 14 page)
0x0
Set ‘0x0’
0x0
Set ‘0x00’
0x00
Address : 0xB
D[7:2]
TEST
D[1]
EXT
D[0]
TEST
Address : 0xC
D[7:0]
TEST
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Datasheet
BD64562GWZ
●2-wire Serial Interface Data timing
tHIGH
SCL
SCL
tSU : STA
tSU : DAT
tHD : STA
tHD : DAT
tLOW
tSU : STO
tHD : STA
SDA
SDA
STOP BIT
START BIT
tBUF
Figure 8. Serial data timing
Figure 9. Start, Stop bit timing
Timing Characteristics (Unless otherwise specified, Ta = 25 °C, VCC = 2.3 to 4.8 V)
*8
FAST-MODE
Parameter
Symbol
Min.
Typ.
Max.
STANDARD-MODE*8
Min.
Typ.
Max.
Unit
SCL clock frequency
fSCL
-
-
400
-
-
100
kHz
High period of the SCL clock
tHIGH
0.6
-
-
4.0
-
-
µs
Low period of the SCL clock
tLOW
1.3
-
-
4.7
-
-
µs
Hold time (repeated) START condition
tHD:STA
0.6
-
-
4.0
-
-
µs
Set-up time (repeated) START condition
tSU:STA
0.6
-
-
4.7
-
-
µs
Data hold time
tHD:DAT
0
-
0.9
0
-
3.45
µs
Data set-up time
tSU:DAT
100
-
-
250
-
-
ns
Set-up time for STOP condition
tSU:STO
0.6
-
-
4.0
-
-
µs
Bus free time between a STOP and START
condition
tBUF
1.3
-
-
4.7
-
-
µs
Pulse width of spikes which must be
suppressed by the input filter
tI
0
-
50
0
-
50
ns
*8
Standard-mode and Fast-mode 2-wire serial interface devices must be able to transmit or receive at that speed
The maximum bit transfer rates of 100 kHz for Standard-mode devices and 400 kHz for Fast-mode devices.
This transfer rates is provided the maximum transfer rates, for example it is able to drive 100 kHz of clocks with Fast-mode.
●Recommend to power supply turning on operation timing
50 %
50 %
VCC
50 %
50 %
PS
50 %
50 %
2-wire serial input
tPS
tI2C
tPS
tI2C
Serial data
Figure 10. Sequence of data input timing to power supply
Parameter
Symbol
Recommendation limit
Min.
Typ.
Max.
Unit
PS input High voltage set-up time
tPS1
50
-
-
µs
2-wire serial interface input data set-up time
tI2C1
50
-
-
µs
PS input Low voltage set-up time
tPS2
0
-
-
µs
2-wire serial interface input data set-up time
tI2C2
0
-
-
µs
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Datasheet
BD64562GWZ
Power Dissipation Pd (W)
●Power Dissipation
0.44 W
Ambient Temperature: Ta (°C)
(This value is not guaranteed value.)
Figure 11. Power dissipation Pd (W)
●I/O equivalence circuits
VCC
SCL
SDA
VCC
VCC
VCC
SDA
SCL
GND
PS
VM, OUTA, OUTB
VCC
VCC
VM
PS
OUTA
OUTB
GND
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Datasheet
BD64562GWZ
●Description of Functions
1) The structure of the driving wave for Piezo actuator
1cycle = (ta + 1) + brake1 + tb + brake2 + (4 x osc)
Ⅰ
Ⅲ Ⅳ Ⅴ
Ⅱ
1osc
1osc
Ⅵ
Ⅶ
1osc
Ⅰ
Ⅷ
1osc
Ⅱ
Ⅲ
1osc
1osc
Output①
Output②
ta +1
tb
brake1
Forward
Ⅱ
(Reverse)
Ⅷ Short brake
*9
*9
Ⅴ HiZ
Ⅲ HiZ
Forward
Ⅱ (Reverse)
* 10
Ⅵ Reverse
(Forward)
*9
*9
Ⅰ HiZ
ta
brake2
*9
Ⅶ HiZ
Ⅳ Short brake
Ⅰ HiZ
*9
Ⅲ HiZ
*10
*9 The state at osc = 0x0 or osc ≠ 0x0 and HiZE = 0x0 is HiZ.
*10 At mode = 0, the output logic is a setting of a short brake.
dir (Address: 0x0, Data: D[0])
Output①
Output②
Note
0
OUTA
OUTB
Move to the direction of Macro
1
OUTB
OUTA
Move to the direction of infinity
Driving wave is set by the 4 parameters of ta / brake1 / tb / brake2.
OSC period is set by the OSC (Internal clock basic cycle setting).
ta
brake1
tb
brake2
: On section is ( ta + 1 - 1) = ta counts for Forward (Reverse) state.
: On section is (brake1 - 1) count for short brake state.
: On section is (tb1 - 1) count for Reverse (Forward) state.
: On section is (brake2 - 1) count for short brake state.
(Ex.) In case of setting 1 cycle = 10.67 µs, ta = 1.27 µs, brake1 = 0.13 µs, tb = 1.93 µs, brake2 = 7.07 µs.
osc[2:0]( = Basic cycle setting ) = 0x0 （ = Basic cycle = 66.67 ns）, and ta / brake1 / tb / brake2 setting below;
ta[7:0]
brake1[7:0]
tb[7:0]
brake2[7:0]
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TSZ22111・15・001
= 0x13
= 0x03
= 0x1E
= 0x6B
= 19 count
= 3 count
= 30 count
= 107 count
10/20
→
→
→
→
ON section = 19 + 1 – 1 = 19 count
ON section = 2 count
ON section = 29 count
ON section = 106 count
TSZ02201-0H2H0B600450-1-2
9.Oct.2012 Rev.001
Datasheet
BD64562GWZ
Table 1. Basic cycle setting [osc] Internal clock 1cycle = 66.67 ns (Typ.)
Internal
Internal
osc[2:0]
clock cycle
osc[2:0]
osc[2:0]
clock cycle
number
number
0x0
1
0x2
3
0x4
0x1
2
0x3
4
0x5
Table 2. Driving waveform setting [ta]
OSC
ta[7:0]
Cycle
ta[7:0]
number
0x00
1
0x40
0x01
1
0x41
0x02
2
0x42
0x03
3
0x43
…
…
…
0x3D
61
0x7D
0x3E
62
0x7E
0x3F
63
0x7F
OSC
Cycle
number
64
65
66
67
…
125
126
127
Table 3. Driving waveform setting [brake1]
OSC
brake1[7:0]
Cycle
brake1[7:0]
number
0x00
1
0x40
0x01
1
0x41
0x02
2
0x42
0x03
3
0x43
…
…
…
0x3D
61
0x7D
0x3E
62
0x7E
0x3F
63
0x7F
OSC
Cycle
number
64
65
66
67
…
125
126
127
Table 4. Driving waveform setting [tb]
OSC
tb[7:0]
Cycle
tb[7:0]
number
0x00
1
0x40
0x01
1
0x41
0x02
2
0x42
0x03
3
0x43
…
…
…
0x3D
61
0x7D
0x3E
62
0x7E
0x3F
63
0x7F
OSC
Cycle
number
64
65
66
67
…
125
126
127
Table 5. Driving waveform setting [brake2]
OSC
brake2[7:0]
Cycle
brake2[7:0]
number
0x00
1
0x40
0x01
1
0x41
0x02
2
0x42
0x03
3
0x43
…
…
…
0x3D
61
0x7D
0x3E
62
0x7E
0x3F
63
0x7F
OSC
Cycle
number
64
65
66
67
…
125
126
127
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ta[7:0]
0x80
0x81
0x82
0x83
…
0xBD
0xBE
0xBF
brake1[7:0]
0x80
0x81
0x82
0x83
…
0xBD
0xBE
0xBF
tb[7:0]
0x80
0x81
0x82
0x83
…
0xBD
0xBE
0xBF
brake2[7:0]
0x80
0x81
0x82
0x83
…
0xBD
0xBE
0xBF
Internal
clock cycle
number
5
6
OSC
Cycle
number
128
129
130
131
…
189
190
191
OSC
Cycle
number
128
129
130
131
…
189
190
191
OSC
Cycle
number
128
129
130
131
…
189
190
191
OSC
Cycle
number
128
129
130
131
…
189
190
191
0x6
Internal
clock cycle
number
7
0x7
8
osc[2:0]
ta[7:0]
0xC0
0xC1
0xC2
0xC3
…
0xFD
0xFE
0xFF
brake1[7:0]
0xC0
0xC1
0xC2
0xC3
…
0xFD
0xFE
0xFF
tb[7:0]
0xC0
0xC1
0xC2
0xC3
…
0xFD
0xFE
0xFF
brake2[7:0]
0xC0
0xC1
0xC2
0xC3
…
0xFD
0xFE
0xFF
OSC
Cycle
number
192
193
194
195
…
253
254
255
OSC
Cycle
number
192
193
194
195
…
253
254
255
OSC
Cycle
number
192
193
194
195
…
253
254
255
OSC
Cycle
number
192
193
194
195
…
253
254
255
TSZ02201-0H2H0B600450-1-2
9.Oct.2012 Rev.001
Datasheet
BD64562GWZ
Table 6. Driving waveform basic cycle setting [cntck] (Normal sequence only)
Cycle
Cycle
cntck[2:0]
cntck[2:0]
cntck[2:0]
number
number
0x0
1
0x2
4
0x4
0x1
2
0x3
8
0x5
Cycle
number
15
32
Table 7. Driving waveform count setting [cnt]
count
cnt[15:0]
cycle
cnt[15:0]
number
0x0000
0x4000
0x0001
0x4001
0x0002
2
0x4002
0x0003
3
0x4003
…
…
…
0x3FFD
16381
0x7FFD
0x3FFE
16382
0x7FFE
0x3FFF
16383
0x7FFF
count
cycle
number
32768
32769
32770
32771
…
49149
49150
49151
count
cycle
number
16384
16385
16386
16387
…
32765
32766
32767
cnt[15:0]
0x8000
0x8001
0x8002
0x8003
…
0xBFFD
0xBFFE
0xBFFF
cntck[2:0]
0x6
0x7
cnt[15:0]
0xC000
0xC001
0xC002
0xC003
…
0xFFFD
0xFFFE
0xFFFF
Cycle
number
64
127
count
cycle
number
49152
49153
49154
49155
…
65533
65534
65535
Total Drive count number = (cntck[2:0]) x (cnt[15:0]) (cntck[2:0] is valid for Normal sequence.)
(Ex.) In case, setting cntck[2:0] = 0x1, cnt[15:0] = 0x8000
cntck[2:0] x cnt[15:0] = 2 x 32768
=65536 count
=851.968 ms (In case of Driving waveform setting a cycle = 13 µs)
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Datasheet
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2) Driver function table
Sequence setting
mode = 0, osc = 0x0 or osc ≠ 0x0 and HiZE = 0
Ⅰ
Ⅱ
Ⅲ
Ⅳ
Ⅴ
Ⅵ
Ⅶ
Ⅷ
Output①
HiZ
H
HiZ
L
L
L
L
L
Output②
L
L
L
L
HiZ
H
HiZ
L
State
HiZ
Forward
HiZ
Short
brake
HiZ
Reverse
HiZ
Short
brake
Ⅲ
Ⅳ
Ⅴ
Ⅵ
Ⅶ
Ⅷ
L
mode = 0, osc ≠ 0x0 and HiZE = 1
Ⅰ
Ⅱ
Output①
HiZ(66.67ns)
→H
H
HiZ(66.67ns)
→L
L
L
L
L
Output②
L
L
L
L
HiZ(66.67ns)
→H
H
HiZ
State
HiZ(66.67ns)
→Forward
Forward
HiZ(66.67ns)
→Short
brake
Short
brake
HiZ(66.67ns)
→Reverse
Reverse
HiZ
*11
*11
*11
L
Short
brake
The output ② status of Ⅶ doesn’t become from HiZ (66.67 ns) to Low. It is outputted HiZ.
mode = 1, osc = 0x0 or osc ≠ 0x0 and HiZE = 0
Ⅰ
Ⅱ
Ⅲ
Ⅳ
Ⅴ
Ⅵ
Ⅶ
Ⅷ
Output①
HiZ
H
HiZ
HiZ
L
L
L
HiZ
Output②
L
L
L
HiZ
HiZ
H
HiZ
HiZ
State
HiZ
Forward
HiZ
HiZ
HiZ
Reverse
HiZ
HiZ
Ⅲ
Ⅳ
Ⅴ
Ⅵ
Ⅶ
Ⅷ
mode = 1, osc ≠ 0x0 and HiZE = 1
Ⅰ
Ⅱ
Output①
HiZ(66.67ns)
→H
H
HiZ
HiZ
L
L
L
*12
HiZ
Output②
L
L
L(66.67ns)
→HiZ
HiZ
HiZ(66.67ns)
→H
H
HiZ
HiZ
State
HiZ(66.67ns)
→Forward
Forward
HiZ
HiZ
HiZ(66.67ns)
→Reverse
Reverse
HiZ
HiZ
*12
The output ① status of Ⅶ doesn’t become from Low (66.67 ns) to HiZ. It is outputted Low.
Truth table of pa and pb
sequence
pa
pb
OUTA
OUTB
Function mode
OFF
0
0
HiZ
HiZ
STOP
OFF
0
1
L
H
Reverse
OFF
1
0
H
L
Forward
OFF
1
1
L
L
Short brake
ON
x
x
-
-
Follow with the sequence
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Datasheet
BD64562GWZ
3) Normal sequence
Setting ta[7:0], brake1[7:0], tb[7:0], brake2[7:0], osc[2:0], HiZE, pa, pb, cntck[2:0], cnt[15:0], V2[7:0]
(When START bit is High, it is impossible to update. When Start bit is Low, it is possible to update.)
START ＝ Hi → Lo while normal sequenc e, stop the sequenc e
input data
START
Macro direction select
infinity direction select
input data
dir
1cycle
OUTA
OUTB
output data
EXT
Internal Counter
Count up
*1 3
Count
set
Reset
stop value
Coun t
Count up
stop
Reset
*1 3
STOP sequence
Reference 15 page
Normal sequence
Set output logic by
Normal sequence
Set output logic by
Move to Macro direction (movement at set cycle)
pa, pb
Move to infinity direction
pa, pb
In the case of dir = Lo → Hi or Hi → Lo input while
START = Hi,reset setting cycle,and start normal sequence
input data
START
Macro direction select
Infinity direction select
input data
dir
1cycle
OUTA
OUTB
output data
EXT
Internal Counter
Count up
Co un t
S et
Stop
v alu e
Coun t
Count up
*13
Stop
Set value
* 13
Normal sequence
Normal sequence
Set output logic by
Move to macro direction
Move to macro direction
pa, pb
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BD64562GWZ
4) STOP sequence
It changes to the next state after short brake 16.7 µs (Typ.) when the state transition.
Shown in the following while the sequence is operating is done.
・
・
When normal sequence ends
When normal sequence cancels
* Special condition
There is a possibility that is not the pulse when {0x6, 0x5} address is small when Dir and START Bits are input at the
same time after reset is released.
5) Output rise, fall waveform
VM
A
A x 0.9
Output
Voltage
Output
Current
A x 0.1
0V
(VM-B) x 0.9 + B
(VM-B) x 0.1 + B
B
Tfall
Trise
0mA
A voltage = (VM voltage) - (Simulation DC output current at the only Resistance load) x (Upper side output ON-Resistance)
B voltage = (Simulation DC output current at the only Resistance load) x (Lower side output ON-Resistance)
(Ex.) In case, the load is Resistance element = 2 Ω, capacity element = 0.033 µF
25 °C, VM = 3 V, Upper side output ON-Resistance = 1 Ω, Lower side output ON-Resistance = 1 Ω
A voltage = (VM voltage) - ((VM voltage) / (Load(R) + Total ON-Resistance)) x (Upper side ON-Resistance)
= 3 V - (3 V / (2 Ω + (1 Ω + 1 Ω))) x 1 Ω
= 2.25 V
B voltage = ((VM voltage) / (Load(R) + Total ON-Resistance)) x (Lower side ON-R)
= (3 V / (2 Ω + (1 Ω + 1 Ω))) x 1Ω
= 0.75 V
Rise time = Trise (A x 0.1 to A x 0.9)
Fall time = Tfall ((VM - B) x 0.9 + B to (VM - B) x 0.1 + B)
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= 100 ns (Typ.)
= 100 ns (Typ.)
TSZ02201-0H2H0B600450-1-2
9.Oct.2012 Rev.001
Datasheet
BD64562GWZ
6) Setting method of VM voltage slope
The slope can be applied to the VM voltage by setting V1[7:0], V2[7:0], step1[2:0] and step2[4:0].
V1 and V2 are bits for setting VM voltage. The step1 and step2 are bits for setting VM slope.
VM voltage increase that it set it every 50 µs.
It is necessary to enlarge the setting of V2 more than V1.
LSB of each setting bits does not depend on the VCC voltage (LSB = 4.8 / 255 = 18.8 mV (Typ.)).
●Normal function
Setting V2[7:0] (V1[7:0] = 0x00, step1[2:0] = 0x0, step2[4:0] = 0x00)
VM
V2
cntck[2:0]×cnt[15:0]
time
●One time slope
Setting V2[7:0] and step2[4:0] (V1[7:0] = 0x00, step1[2:0] = 0x0 and cntck[2:0] = 0x0)
VM
V2
time
cnt[15:0]
①
②
③
= 50 µs × V2[7:0] / step2[4:0]
= 50 µs (The first step output the keeping voltage.)
= 50 µs × ( V2[7:0] / step2[4:0] - 1)
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●Two times slope
1. Setting V1[7:0], V2[7:0], step1[2:0] and step2[4:0] (cntck[2:0] = 0x0)
①
②
③
④
⑤
= 50 µs × V1[7:0] / step1[2:0]
= 50 µs × ( V2[7:0] - V1[7:0] ) / step2[4:0]
= 50 µs (The first step output the keeping voltage.)
= 50 µs × (( V2[7:0] - V1[7:0] ) / step2[4:0] – 1)
= 50 µs × V1[7:0] / step1[2:0]
2. Setting V1[7:0], V2[7:0] and step2[4:0] (step1[2:0] = 0x0 and cntck[2:0] = 0x0)
VM
V2
V1
time
cnt[15:0]
①
②
③
= 50 µs × ( V2[7:0] - V1[7:0] ) / step2[4:0]
= 50 µs (The first step output the keeping voltage.)
= 50 µs × ( V2[7:0] - V1[7:0] ) / step2[4:0]
3. Setting V1[7:0], V2[7:0] and step1[2:0] (step2[4:0] = 0x00 and cntck[2:0] = 0x0)
VM
V2
V1
time
cnt[15:0]
①
②
③
= 50 µs × V1[7:0] / step1[2:0]
= 50 µs (The first step output the keeping voltage.)
= 50 µs × V1[7:0] / step1[2:0]
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9.Oct.2012 Rev.001
Datasheet
BD64562GWZ
●Operational Notes
1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings, such as the applied voltage (VCC) or operating temperature
range (Topr), may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or
open mode) when such damage is suffered. A physical safety measure, such as a fuse, should be implemented when
using the IC at times where the absolute maximum ratings may be exceeded.
2)
Storage temperature range (Tstq)
As long as the IC is kept within this range, there should be no problems in the IC’s performance. Conversely, extreme
temperature changes may result in poor IC performance, even if the changes are within the above range.
3)
Power supply and wiring
Be sure to connect the power terminals outside the IC. Do not leave them open. Because a return current is generated
by a counter electromotive force of the motor, take necessary measures such as putting a Capacitor between the
power source and the ground as a passageway for the regenerative current. Be sure to connect a Capacitor of proper
capacitance (0.1 to 10 µF) between the power source and the ground at the foot of the IC, and ensure that there is no
problem in properties of electrolytic Capacitors such as decrease in capacitance at low temperatures. When the
connected power source does not have enough current absorbing capability, there is a possibility that the voltage of the
power source line increases by the regenerative current exceeds the absolute maximum rating of this product and the
peripheral circuits.
Therefore, be sure to take physical safety measures such as putting a zener diode for a voltage clamp between the
power source the ground.
4)
Ground terminal and wiring
The potential at GND terminal should be made the lowest under any operating conditions. Ensure that there are no
terminals where the potentials are below the potential at GND terminal, including the transient phenomena.
Also prevent the voltage variation of the ground wiring patterns of external components. Use short and thick power
source and ground wirings to ensure low impedance.
5)
Thermal design
Use a proper thermal design that allows for a sufficient margin of the power dissipation at actual operating conditions.
6)
Pin short and wrong direction assembly of the device
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if positive and ground power supply terminals are reversed. The IC may also be damaged if pins
are shorted together or are shorted to other circuit’s power lines.
7)
Avoiding strong magnetic field
Malfunction may occur if the IC is used around a strong magnetic field.
8)
ASO
Ensure that the output transistors of the motor driver are not driven under excess conditions of the absolute maximum
ratings and ASO.
9)
TSD circuit
This IC incorporates a TSD circuit. If the temperature of the chip reaches the below temperature, the motor coil output
will be opened. The TSD circuit is designed only to shut off the IC to prevent runaway thermal operation. It is not
designed to protect the IC or to guarantee its operation. Do not continue to use the IC after use of the TSD feature or
use the IC in an environment where the its assumed that the TSD feature will be used.
TSD ON temperature [°C]
(Typ.)
150
Hysteresis temperature [°C]
(Typ.)
20
10) PS terminal
Release PS after rising VCC. PS works resetting logic as well. If keep connecting PS with VCC, resetting cannot be
done cause malfunction or destroy.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only
for a reference to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
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TSZ22111・15・001
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TSZ02201-0H2H0B600450-1-2
9.Oct.2012 Rev.001
Datasheet
BD64562GWZ
●Ordering Information
B
U
6
4
5
6
2
Part Number
G
W
Z
E2
Package
GWZ: UCSP30L1
Packaging and forming specification
E2: Embossed tape and reel
●Physical Dimension Tape and Reel Information
UCSP30L1 (BU64562GWZ)
1PIN MARK
Lot No.
<Packing specification>
0.77±0.03
ＡＢＸ
0.06±0.05
0.33MAX
1.9±0.03
Tape
Embossed carrier tape
Quantity
3,000pcs/Reel
Direction of feed
E2 (See neighboring image)
S
0.185±0.05
0.06 S
A
0.05 A B
B
B
A
1
0.35±0.05
2
3
1234
1234
1234
1234
1234
1234
0.4
8-φ0.20±0.05
4
Reel
P=0.4×3
1pin
Direction of feed
*Order quantity needs to be multiple of the minimum quantity.
●Marking Diagram(TOP VIEW)
UCSP30L1 (BU64562GWZ)
Product Name
Lot No.
1PIN MARK
ABX
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Datasheet
BD64562GWZ
●Revision History
Date
9.Oct.2012
Revision
001
Changes
New Release
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BU64562GWZ - Web Page
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BU64562GWZ
UCSP30L1
3000
3000
Taping
inquiry
Yes