Material Content Data Sheet Sales Product Name TLE4276GV MA# MA001133292 Package PG-TO263-5-1 Issued 28. August 2013 Weight* 1571.88 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material non noble metal noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus tin silver lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-31-5 7440-22-4 7439-92-1 3.304 0.21 0.925 0.06 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.21 2102 2102 588 0.277 0.02 923.552 58.73 58.81 587546 176 588310 0.297 0.02 0.02 189 189 1.253 0.08 797 57.654 3.67 567.762 36.12 39.87 361199 398674 12.370 0.79 0.79 7869 7869 0.243 0.02 0.001 0.00 0.085 0.01 0.106 0.01 4.056 0.26 36678 154 0.02 2. 3. Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 154 68 0.28 Important Remarks: 1. 0 54 2580 2702 1000000