YAGEO AF122-FR-13XXXRL Anti-sulfurated chip resistor Datasheet

DATA SHEET
ANTI-SULFURATED CHIP RESISTORS
AF122 (4Pin/2R) / AF124 (8Pin/4R) /
AF162 (4Pin/ 2R)/ AF164 (8Pin/ 4R)
5%, 1%
sizes 2 × 0402, 4 x 0402, 2 x 0603, 4 x 0603
Product specification –June 28, 2016 V.4
RoHS compliant
Product specification
Chip Resistor Surface Mount
AF
2
8
122/124/162/164 (RoHS Compliant)
SERIES
SCOPE
ORDERING INFORMATION - GLOBAL PART NUMBER & 12NC
This specification describes
AF122/AF124/AF162/AF164
(convex)series chip resistor arrays
with lead-free terminations made
by thick film process.
Both part numbers are identified by the series, size, tolerance, packing
type, temperature coefficient, taping reel and resistance value.
YAGEO BRAND ordering code
GLOBAL PART NUMBER (PREFERRED )
AF XX X - X X X XX XXXX L
APPLICATIONS
 Terminal for SDRAM and
DDRAM
(1) (2)
(7)
(1) SIZE
12 = 0402 x 2 (0404)
 High-end Computer &
Multimedia Electronics in high
sulfur environment
 Consume electronic
equipments: PDAs, PNDs
(3) (4) (5) (6)
12 = 0402 x 4 (0408)
16 = 0603 x 2 (0606)
16 = 0603 x 4 (0612)
(2) NUMBER OF RESISTORS
2 = 2 resistors
 Mobile phone, telecom…
4 = 4 resistors
FEATURES
 AEC-Q200 qualified
(3) TOLERANCE
F = ± 1%
J = ± 5% (for Jumper ordering, use code of J)
 RoHS compliant
 Reducing environmentally
hazardous wastes
 High component and equipment
reliability
(4) PACKAGING TYPE
R = Paper taping reel
(5) TEMPERATURE COEFFICIENT OF RESISTANCE
– = Base on spec
 Saving of PCB space
 None forbidden-materials used
in products/production
(6) TAPING REEL
07 = 7 inch dia. Reel
13 = 13 inch dia. Reel
 Halogen Free Epoxy
 Moisture sensitivity level: MSL 1
(7) RESISTANCE VALUE
There are 2~4 digits indicated the resistor value. Letter R/K/M is decimal point, no need
to mention the last zero after R/K/M, e.g.1K2, not 1K20.
Detailed resistance rules show in table of “Resistance rule of global part number”.
(8) DEFAULT
Resistance CODE
rule of global part
ORDERING EXAMPLE
(Note)
number
Letter
L is the system default code for ordering
Theonly.
ordering code of a AF122
Resistance code rule
Example
0R
0R = Jumper
XRXX
(1 to 9.76 Ω)
1R = 1 Ω
1R5 = 1.5 Ω
9R76 = 9.76 Ω
XXRX
(10 to 97.6 Ω)
10R = 10 Ω
97R6 = 97.6 Ω
XXXR
(100 to 976 Ω)
100R = 100 Ω
XKXX
(1 to 9.76 KΩ)
1K = 1,000 Ω
9K76 = 9760 Ω
XM
(1 MΩ)
convex chip resistor array, value
1,000Ω with ± 5% tolerance,
supplied in 7-inch tape reel is:
AF122-JR-071KL.
NOTE
1. All our R-Chip products meet RoHS
compliant. "LFP" of the internal 2D reel
label mentions "Lead Free Process"
2. On customized label, "LFP" or specific
symbol printed and the optional "L" at
the end of GLOBAL PART NUMBER
1M = 1,000,000 Ω
www.yageo.com
Jun. 28, 2016 V.4
Product specification
Chip Resistor Surface Mount
AF
SERIES
3
8
122/124/162/164 (RoHS Compliant)
MARKING
AF122 / 162
No marking
Fig. 1
AF124 / 164
0
I-Digit marking
Fig. 2 Value = 0Ω
3 60
1% E-24/E-96: R≧ 100Ω 4digits
First three digits for significant figure and 4th digit for number of zeros
Fig. 3 Value = 316KΩ
5% E-24: R≧ 10Ω
First two digits for significant figure and 3rd digit for number of zeros
Fig. 3 Value = 240KΩ
For further marking information, please refer to data sheet “Chip resistors marking”.
CONSTRUCTION
The resistor is constructed on top
of a high-grade ceramic body.
Internal metal electrodes are added
on each end to make the contacts to
the thick film resistive element. The
composition of the resistive element
is a noble metal embedded into a
glass and covered by a glass. The
resistor is laser trimmed to the
rated resistance value. The resistor
is covered with a protective epoxy
coat, finally the external
terminations (matte tin on Nibarrier) are added as shown in Fig.4.
OUTLINES
Fig. 4 Chip resistor outlines
DIMENSIONS
Table 1
TYPE
AF122
AF124
AF162
AF164
B (mm)
0.24± 0.10
0.25± 0.15
0.35±0.10
0.35± 0.15
H (mm)
0.30+0.10/-0.05
0.45± 0.05
0.30±0.10
0.65± 0.05
---
0.30± 0.05
--
0.50± 0.15
P (mm)
0.67± 0.05
0.50± 0.05
0.80±0.05
0.80± 0.05
L (mm)
1.00± 0.10
2.00± 0.10
1.60±0.10
3.20± 0.15
T (mm)
0.30± 0.10
0.45± 0.10
0.40±0.10
0.60± 0.10
W1 (mm)
0.25± 0.10
0.30± 0.15
0.30±0.10
0.30± 0.15
W2 (mm)
1.00± 0.10
1.00± 0.10
1.60±0.10
1.60± 0.15
H1 (mm)
For dimension, please refer to Table 1
AF122 / 162
AF124 / 164
Fig. 5 AF122/124/162/164 series chip resistors dimension
www.yageo.com
Jun. 28, 2016 V.4
Product specification
Chip Resistor Surface Mount
AF
SERIES
122/124/162/164 (RoHS Compliant)
4
8
SCHEMATIC
For dimension, please refer to Fig. 5 and Table 1
Fig. 6 Equivalent circuit diagram
ELECTRICAL CHARACTERISTICS
Table 2
AF122
AF124
AF162
AF164
–55 °C to +155 °C
–55 °C to +155 °C
–55 °C to +155 °C
–55 °C to +155 °C
1/16 W
1/16 W
1/16W
1/16W
Maximum Working Voltage
50 V
25 V
50V
50V
Maximum Overload Voltage
100 V
50 V
100V
100V
Dielectric Withstanding
Voltage
Resistance Range
100 V
100 V
100V
100V
5% (E24) 1 Ω to 1 MΩ
1% (E24/E96) 10 Ω to 1 MΩ
Jumper < 50 mΩ
5% (E24) 1 Ω to 1 MΩ
1% (E24/E96) 1 Ω to 1 MΩ
Jumper < 50 mΩ
CHARACTERISTICS
Operating Temperature
Range
Rated Power
1 Ω ≤ R ≤ 10 Ω ± 250 ppm/°C
Temperature Coefficient
Jumper Criteria
5% (E24) 1 Ω to 1 MΩ
5% (E24) 1 Ω to 1 MΩ
1% (E24/E96) 1 Ω to 1 MΩ 1% (E24/E96) 1 Ω to 1 MΩ
Jumper < 50 mΩ
Jumper < 50 mΩ
± 250 ppm/°C
10 Ω ≤ R ≤ 1 MΩ ± 200 ppm/°C
Rated Current
0.5 A
Rated Current
1.0 A
Rated Current
1.0 A
Rated Current 1.0A
Maximum Current
1.0 A
Maximum Current
2.0 A
Maximum Current
2.0 A
Maximum Current 2.0A
FOOTPRINT AND SOLDERING PROFILES
For recommended footprint and soldering profiles, please refer to data sheet
“Chip resistors mounting”.
PACKING STYLE AND PACKAGING QUANTITY
Table 3 Packing style and packaging quantity
PACKING STYLE
Paper Taping Reel (R)
REEL DIMENSION
AF122
AF124
AF162
AF164
7" (178 mm)
10,000 units
10,000 units
5,000 units
5,000 units
13" (330 mm)
50,000 units
40,000 units
---
20,000 units
NOTE
1. For paper tape and reel specification/dimensions, please refer to data sheet “Chip resistors packing”.
www.yageo.com
Jun. 28, 2016 V.4
Product specification
Chip Resistor Surface Mount
AF
SERIES
122/124/162/164 (RoHS Compliant)
5
8
FUNCTIONAL DESCRIPTION
POWER RATING
AF122 / AF124 / AF162 / AF164 rated power at
70 °C is 1/16 W
RATED VOLTAGE
The DC or AC (rms) continuous working voltage
corresponding to the rated power is determined by
the following formula:
V= (P X R)
or max. working voltage whichever is less
Where
V=Continuous rated DC or
AC (rms) working voltage (V)
Fig. 7 Maximum dissipation (P) in percentage of rated power as a
function of the operating ambient temperature (T amb )
P=Rated power (W)
R=Resistance value (Ω)
www.yageo.com
Jun. 28, 2016 V.4
Product specification
Chip Resistor Surface Mount
AF
SERIES
6
8
122/124/162/164 (RoHS Compliant)
TESTS AND REQUIREMENTS
Table 4 Test condition, procedure and requirements
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Life/
Endurance
MIL-STD-202-method 108
1,000 hours at 70± 2 °C applied RCWV
1.5 hours on, 0.5 hour off, still air required
± (2%+0.05 Ω )
High Temperature
Exposure
MIL-STD-202-method 108
1,000 hours at maximum operating
temperature depending on specification,
unpowered
± (1%+0.05 Ω)
<50 mΩ for Jumper
IEC 60115-1 4.25
<100 mΩ for Jumper
Tolerances: 155± 3 °C
Moisture
Resistance
MIL-STD-202-method 106
Each temperature / humidity cycle is defined at
8 hours (method 106G), 3 cycles / 24 hours
for 10d with 25 °C / 65 °C 95% R.H, without
steps 7a & 7b, unpowered
± (2%+0.05 Ω)
<100 mΩ for Jumper
Parts mounted on test-boards, without
condensation on parts
Measurement at 24± 2 hours after
test conclusion
Thermal Shock
MIL-STD-202-method 107
-55/+125 °C
± (1%+0.05 Ω)
Note: Number of cycles required is 300.
Devices mounted
<50 mΩ for Jumper
Maximum transfer time is 20 seconds. Dwell
time is 15 minutes. Air – Air
Short Time
Overload
Board Flex/
Bending
IEC60115-1 4.13
IEC60115-1 4.33
2.5 times RCWV or maximum overload
voltage whichever is less for 5 sec at room
temperature
± (2%+0.05 Ω)
Device mounted on PCB test board as
described, only 1 board bending required
± (1%+0.05 Ω)
3 mm bending
No visible damage
<50 mΩ for Jumper
No visible damage
<50 mΩ for Jumper
Bending time: 60± 5 seconds
Ohmic value checked during bending
www.yageo.com
Jun. 28, 2016 V.4
Product specification
Chip Resistor Surface Mount
AF
SERIES
7
8
122/124/162/164 (RoHS Compliant)
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Solderability
- Wetting
J-STD-002 test B
Electrical Test not required
Well tinned (≥95% covered)
No visible damage
Magnification 50X
SMD conditions:
1st step: method B, aging 4 hours at 155 °C
dry heat
2nd step: leadfree solder bath at 245± 3 °C
Dipping time: 3± 0.5 seconds
- Leaching
J-STD-002 test D
Leadfree solder, 260 °C, 30 seconds
immersion time
No visible damage
- Resistance to
Soldering Heat
IEC 60115-1 4.18
Condition B, no pre-heat of samples
± (1%+0.05Ω)
MIL-STD-202 Method 215
Leadfree solder, 260 °C, 10 seconds
immersion time
<50 mΩ for Jumper
No visible damage
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
FOS
ASTM-B-809-95*
*Modified
Sulfur 750 hours, 105℃, unpowered
± (4.0%+0.05Ω)
<100mΩ for Jumper
www.yageo.com
Jun. 28, 2016 V.4
Product specification
Chip Resistor Surface Mount
AF
SERIES
122/124/162/164 (RoHS Compliant)
8
8
REVISION HISTORY
REVISION
DATE
CHANGE NOTIFICATION
DESCRIPTION
Version 4
Jun. 23, 2016
-
- AEC-Q200 qualified
Version 3
Nov. 17, 2015
-
- Add in AF162
Version 2
May 29,2015
-
- Add in AF164
Version 1
Aug. 15, 2014
-
- Update AF124 dimensions
Version 0
Oct. 02, 2013
-
- First issue of this specification
“ Yageo reserves all the rights for revising the content of this datasheet without further notification, as long as the products itself are unchanged. Any
product change will be announced by PCN.”
www.yageo.com
Jun. 28, 2016 V.4
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