Diodes DMN62D0UDW-13 Dual n-channel enhancement mode mosfet Datasheet

DMN62D0UDW
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
NEW PRODUCT
Product Summary
Features
BVDSS
RDS(ON) max
ID max
TA = +25°C
60V
2Ω @ VGS = 4.5V
2.5Ω @ VGS = 2.5V
350mA
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Description
This MOSFET is designed to minimize the on-state resistance
(RDS(ON)) and yet maintain superior switching performance, making it
ideal for high efficiency power management applications.
Dual N-Channel MOSFET
Low On-Resistance
Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Ultra-Small Surface Mount Package
ESD Protected Gate
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Applications
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Motor Control
Power Management Functions
Case: SOT363
Case Material: Molded Plastic. “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Terminal Connections: See Diagram
Weight: 0.006 grams (Approximate)
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SOT363
D1
D2
D2
G1
S1
S2
S2
G2
D1
G2
G1
ESD Protected Gate
Gate Protection
Diode
Top View
Gate Protection
Diode
S1
Q2 N-Channel
Q1 N-Channel
Top View
Pin out
Equivalent Circuit
Ordering Information
(Note 4)
Part Number
DMN62D0UDW-7
DMN62D0UDW-13
Notes:
Case
SOT363
SOT363
Packaging
3000/Tape & Reel
10000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
LEE = Product Type Marking Code
YM = Date Code Marking
Y or Y = Year (ex: D = 2016)
M = Month (ex: 9 = September)
Date Code Key
Year
2016
Code
D
Month
Code
Jan
1
2017
E
Feb
2
DMN62D0UDW
Document number: DS38029 Rev. 2 - 2
2018
F
Mar
3
2019
G
Apr
4
2020
H
May
5
2021
I
Jun
6
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2022
J
2023
K
2024
L
2025
M
2026
N
2027
O
Jul
7
Aug
8
Sep
9
Oct
O
Nov
N
Dec
D
August 2016
© Diodes Incorporated
DMN62D0UDW
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
NEW PRODUCT
Drain-Source Voltage
Gate-Source Voltage
Steady
State
Maximum Continuous Body Diode Forward Current (Note 6)
Continuous Drain Current (Note 6) VGS = 4.5V
TA = +25°C
TA = +70°C
ID
IS
Value
60
±20
350
290
0.4
Unit
V
V
Value
320
400
410
312
-55 to +150
Unit
mW
°C/W
mW
°C/W
°C
mA
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Operating and Storage Temperature Range
Electrical Characteristics
Steady State
Steady State
Symbol
PD
RθJA
PD
RθJA
TJ, TSTG
(@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
60
—
—
—
—
—
—
1.0
±10
V
µA
µA
VGS = 0V, ID = 250µA
VDS = 60V, VGS = 0V
VGS = ±20V, VDS = 0V
VGS(TH)
0.5
—
1.0
V
Static Drain-Source On-Resistance
RDS(ON)
—
1.2
1.4
1.8
2.0
2.5
3.0
Ω
|Yfs|
VSD
—
—
1.8
0.8
—
1.3
S
V
VDS = 10V, ID = 250µA
VGS = 4.5V, ID = 0.1A
VGS = 2.5V, ID = 0.05A
VGS = 1.8V, ID = 0.05A
VDS =10V, ID = 0.2A
VGS = 0V, IS = 115mA
Ciss
Coss
Crss
Rg
Qg
Qgs
Qgd
—
—
—
—
—
—
—
—
—
—
—
32
3.9
2.4
101
0.5
0.09
0.09
2.4
2.5
22.6
12.5
—
—
—
—
—
—
—
—
—
—
—
pF
pF
pF
Ω
nC
nC
nC
ns
ns
ns
ns
Forward Transconductance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes:
tD(ON)
tR
tD(OFF)
tF
Test Condition
VDS = 30V, VGS = 0V
f = 1.0MHz
f = 1MHz , VGS = 0V, VDS = 0V
VGS = 4.5V, VDS = 10V,
ID = 250mA
VDD = 30V, VGS = 10V,
RG = 25Ω, ID = 200mA
5. Device mounted on FR-4 PCB, with minimum recommended pad layout
6. Device mounted on 1” x 1” FR-4 PCB with high coverage 2oz. Copper, single sided.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
DMN62D0UDW
Document number: DS38029 Rev. 2 - 2
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© Diodes Incorporated
DMN62D0UDW
1.0
0.8
VDS=5V
VGS=4.5V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VGS=3.0V
0.8
VGS=2.0V
0.6
VGS=1.8V
0.4
0.2
0.6
0.4
TA=125℃
0.2
VGS=1.5V
TA=85℃
TA=25℃
TA=150℃
VGS=1.3V
TA=-55℃
0.0
0
0
1
2
3
4
VDS, DRAIN-SOURCE VOLTAGE (V)
5
0.5
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(Ω)
3
2.5
2
VGS=2.5V
1.5
VGS=4.5V
1
0.5
0
0
0.2
0.4
0.6
0.8
1
1.5
2
2.5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristic
Figure 1. Typical Output Characteristic
3
2.5
2
1.5
ID=100mA
1
0
1
5
10
15
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4. Typical Transfer Characteristic
ID, DRAIN-SOURCE CURRENT (A)
Figure 3. Typical On-Resistance vs. Drain Current and
Gate Voltage
4.5
20
2.2
TA=150℃
VGS= 4.5V
4
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
NEW PRODUCT
VGS=2.5V
TA=125℃
3.5
TA=85℃
3
2.5
2
TA=25℃
1.5
TA=-55℃
1
0.5
0
0
0.2
0.4
0.6
0.8
1
ID, DRAIN CURRENT (A)
Figure 5. Typical On-Resistance vs. Drain Current and
Temperature
DMN62D0UDW
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2
1.8
VGS=4.5V, ID=100mA
1.6
1.4
1.2
VGS=2.5V, ID=50mA
1
0.8
0.6
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 6. On-Resistance Variation with Junction
Temperature
August 2016
© Diodes Incorporated
VGS(TH), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
1.2
3.5
3
2.5
VGS=2.5V, ID=50mA
2
1.5
VGS=4.5V, ID=100mA
1
0.5
0
1.1
1
ID=1mA
0.9
0.8
ID=250μA
0.7
0.6
0.5
0.4
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 7. On-Resistance Variation with Junction
Temperature
-50
1
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 8. Gate Threshold Variation vs. Junction
Temperature
100
CT, JUNCTION CAPACITANCE (pF)
IS, SOURCE CURRENT (A)
f=1MHz
0.8
VGS=0V, TA=85℃
VGS=0V, TA=125℃
0.6
VGS=0V, TA=150℃
0.4
VGS=0V, TA=25℃
0.2
VGS=0V, TA=-55℃
Ciss
10
Coss
Crss
1
0
0
0.3
0.6
0.9
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs. Current
0
1.5
5
10
15
20
25
30
35
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Junction Capacitance
40
10
4.5
RDS(ON) Limited
4
ID, DRAIN CURRENT (A)
3.5
3
VGS (V)
NEW PRODUCT
DMN62D0UDW
2.5
VDS=10V, ID=250mA
2
1.5
1
PW =100μs
PW =1ms
1
0.1
PW =10ms
PW =100ms
0.01
0.5
TJ(MAX)=150℃
PW =1s
TC=25℃
PW =10s
Single Pulse
DUT on 1*MRP board
DC
VGS=4.5V
0.001
0
0
0.1
0.3
Qg (nC)
Figure 11. Gate Charge
DMN62D0UDW
Document number: DS38029 Rev. 2 - 2
0.2
0.4
0.5
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0.1
1
10
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 12. SOA, Safe Operation Area
100
August 2016
© Diodes Incorporated
DMN62D0UDW
r(t), TRANSIENT THERMAL RESISTANCE
NEW PRODUCT
1
D=0.5
D=0.9
D=0.3
0.1
D=0.7
D=0.1
D=0.05
D=0.02
0.01
D=0.01
D=0.005
RθJA (t)=r(t) * RθJA
RθJA=405℃/W
Duty Cycle, D=t1 / t2
D=Single Pulse
0.001
1E-06
1E-05
0.0001
0.001
0.01
0.1
1
10
100
1000
t1, PULSE DURATION TIME (sec)
Figure 13. Transient Thermal Resistance
DMN62D0UDW
Document number: DS38029 Rev. 2 - 2
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DMN62D0UDW
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
NEW PRODUCT
SOT363
E
E1
F
SOT363
Dim Min Max
Typ
A1 0.00 0.10
0.05
A2 0.90 1.00
1.00
b
0.10 0.30
0.25
c
0.10 0.22
0.11
D
1.80 2.20
2.15
E
2.00 2.20
2.10
E1 1.15 1.35
1.30
e
0.650 BSC
F
0.40 0.45 0.425
L
0.25 0.40
0.30
a
0°
8°
-All Dimensions in mm
b
D
A2
c
L
e
A1
a
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT363
C
Dimensions
G
Y1
Y
C
G
X
Y
Y1
Value
(in mm)
0.650
1.300
0.420
0.600
2.500
X
DMN62D0UDW
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DMN62D0UDW
IMPORTANT NOTICE
NEW PRODUCT
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause
the
failure of the life support device or to affect its safety or effectiveness.
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
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DMN62D0UDW
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