1 of 3 Creation Date : November 09, 2017 (GMT) Multilayer Ceramic Chip Capacitors CGA2B3X8R1C473M050BE TDK item description CGA2B3X8R1C473MT***S Applications Automotive Grade 150°C High Temperature Application Feature Soft Soft Termination AEC-Q200 AEC-Q200 Series CGA2(1005) [EIA 0402] Status Production Size Length(L) 1.00mm +0.15,-0.05mm Width(W) 0.50mm +0.10,-0.05mm Thickness(T) 0.50mm +0.10,-0.05mm Terminal Width(B) 0.10mm Min. Terminal Spacing(G) 0.30mm Min. Recommended Land Pattern (PA) 0.30mm to 0.50mm Recommended Land Pattern (PB) 0.35mm to 0.45mm Recommended Land Pattern (PC) 0.40mm to 0.60mm Electrical Characteristics Capacitance 47nF ±20% Rated Voltage 16VDC Temperature Characteristic X8R(±15%) Dissipation Factor (Max.) 5% Insulation Resistance (Min.) 2127MΩ Other Soldering Method Reflow AEC-Q200 Yes Packing Punched (Paper)Taping [180mm Reel] Package Quantity 10000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Multilayer Ceramic Chip Capacitors 2 of 3 Creation Date : November 09, 2017 (GMT) CGA2B3X8R1C473M050BE Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Multilayer Ceramic Chip Capacitors CGA2B3X8R1C473M050BE Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : November 09, 2017 (GMT)