ASMT-MYA0 1W Power LED Light Source on MCPCB Data Sheet Description Features Avago Technologies’ 1W Warm White Power LED is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard. • Available in Warm White color. The Warm White Power LED is available in various color temperature ranging from 2600K to 4000K. The product has high Color Rendering Index (CRI) which provides excellent color perception and visual clarity. • Wide viewing angle. Package Dimensions • InGaN Technology • Energy efficient • High current operation. • Long operation life. • Silicone encapsulation Specifications • 3.6V, 350 mA (typical) • 110 viewing angle Applications • Portable (flash light, bicycle head light) • Reading light • Architectural lighting • Garden lighting • Decorative lighting Notes: 1. All dimensions in millimeters. 2. Tolerance is ±0.1mm unless otherwise specified. Device Selection Guide at Junction Temperature Tj = 25�� °�C Luminous Flux, Φv[1,2,3] (lm) Color Part Number Min Typ Max Test Current (mA) Dice Technology Warm White ASMT-MYA0 43.0 50.0 73.0 350 InGaN Notes: 1. ΦV is the total luminous flux output as measured with an integrating sphere at 25ms mono pulse condition. 2. Flux tolerance is ±10 % 3. ΦV data are only applicable for ASMT-MY00 component level device only. Part Numbering System ASMT-M x A0 - N x1 x2 x3 0 Color Bin Selection Max Flux Bin Selection Min Flux Bin Selection Color Y - Warm White Absolute Maximum Ratings[3] at TA = 25°C Parameter ASMT-MYA0 Units DC Forward Current [1] 350 mA Peak Pulsing Current [2] 500 mA Power Dissipation 1400 mW LED Junction Temperature 110 °C Operating Ambient Temperature Range -40 to +85 °C Storage Temperature Range °C -40 to +100 Note: 1. DC forward current – derate linearly based on Figure 5. 2. Pulse condition duty factor = 10%, Frequency = 1kHz. 3. Absolute Maximum Rating data are only applicable for ASMT-MY00 component level device only. Optical Characteristics[2] (TA = 25 °C) Correlated Color Temperature, CCT (Kelvin) Viewing Angle 2��� θ�� ½ [1] (Degrees) Luminous Efficiency (lm/W) Part Number Color Min Max Typ Typ ASMT-MYA0 Warm White 2600 4000 110 40 Notes: 1. θ½ is the off-axis angle where the luminous intensity is ½ the peak intensity. 2. Optical Characteristics data are only applicable for ASMT-MY00 component level device only. Electrical Characteristic[3] (TA = 25°C) Thermal Resistance Rθj-b (°C/W) [2] Forward Voltage VF (Volts) @ IF = 350mA Dice Type Typ Max. Reverse Voltage VR [1] Typ. InGaN 3.6 4.0 Not recommended 18 Note: 1. Not designed for reverse bias operation. 2. Rθj-b is Thermal Resistance from LED junction to MCPCB. 3. Electrical Characteristic data are only applicable for ASMT-MY00 component level device only. 500 WARM WHITE FORWARD CURRENT - mA RELATIVE INTENSITY 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 380 430 480 530 580 630 680 730 450 400 350 300 250 200 150 100 50 0 0.00 780 0.50 1.00 Figure 1. Relative intensity vs. wavelength 2.00 2.50 3.00 3.50 4.00 Figure 2. Forward Current vs Forward Voltage 1.40 1.0 1.20 0.9 0.8 1.00 RELATIVE INTENSITY RELATIVE LUMINOUS FLUX (v) - lm 1.50 FORWARD VOLTAGE - V WAVELENGTH - nm 0.80 0.60 0.40 0.20 0.00 0.7 0.6 0.5 0.4 0.3 Warm White 0.2 0.1 0.0 0 50 -90 100 150 200 250 300 350 400 450 500 MONO PULSE CURRENT - mA Figure 3. Relative Luminous Flux vs. Mono Pulse Current -70 -50 -30 -10 10 30 50 70 90 OFF-AXIS ANGLE (°) Figure 4. Radiation Pattern 350 10 - 30 SEC. 300 Rθ JA = 50°C/W 250 TEMPERATURE I F MAX FORWARD CURRENT - mA 400 Rθ JA = 40°C/W 200 Rθ JA = 30°C/W 150 100 6°C/SEC. MAX. 150°C 3°C/SEC. MAX. 50 0 100 SEC. MAX. 60 - 120 SEC. 0 10 20 30 40 50 60 70 TA AMBIENT TEMPERATURE - °C 80 Figure 5. Maximum forward current vs. ambient temperature Derated based on TJMAX = 110°C, RθJA = 30°C/W / 40°C/W and 50°C/W 217°C 200°C 255 - 260 °C 3°C/SEC. MAX. 90 TIME (Acc. to J-STD-020C) Figure 6. Recommended Reflow Soldering RELATIVE FORWARD VOLTAGE SHIFT (mV) 200 150 100 50 0 -50 -100 -150 -200 -40 -15 10 35 TEMPERATURE - °C Figure 7. Recommended soldering land pattern Figure 8. Temperature vs. relative forward voltage shift 100 RELATIVE INTENSITY (%) 90 80 70 60 50 40 30 20 10 0 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 JUNCTION TEMPERATURE (°C) Figure 9. Relative LOP vs. junction temperature Note: All parametric charts are only applicable for ASMT-MY00 component level device only. 60 85 Flux Bin Limit[1] (For reference only) [X1, X2] Color Bin Selections [X3] Individual reel will contain parts from one full bin only. Flux (lm) at 350mA 0 Full Distribution Bin Min Max A A only J 43.0 56.0 B B only K 56.0 73.0 C C only D D only E E only F F only Z A and B only Y B and C only W C and D only V D and E only U E and F only Q A, B and C only P B, C and D only N C, D and E only M D, E and F only Tolerance for each bin limits is ±10 % Note: 1. Flux Bin Limit is only applicable for ASMT-MY00 component level device only J Special Color Bin 1 A, B, C and D only 2 E, F, G and H only 3 B, C, D and E only 4 C, D, E and F only 5 A, B, C, D and E only 6 B, C, D, E, and F only 0.46 Y - COORDINATE 0.44 A 0.42 C E 0.38 3.5k D 4.0k F 0.36 2.6k 3.0k B Black Body Curve 0.34 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52 X - COORDINATE Note: 1. Color Limit and Color binning chart are only applicable for ASMT-MY00 component level device only Color Limits (Chromaticity Coordinates) Bin A X Y 0.452 0.434 0.488 0.447 0.470 0.414 0.438 0.403 Bin B X Y 0.438 0.403 0.470 0.414 0.452 0.384 0.424 0.376 Bin C X Y 0.407 0.393 0.418 0.422 0.452 0.434 0.438 0.403 Bin D X Y 0.395 0.362 0.407 0.393 0.438 0.403 0.424 0.376 Bin E X Y 0.381 0.377 0.387 0.404 0.418 0.422 0.407 0.393 Bin F X Y 0.373 0.349 0.381 0.377 0.407 0.393 0.395 0.362 Tolerances ± 0.01 0.48 0.40 White Package Tray Dimensions Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body (white plastic). DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. AV02-0542EN - July 3, 2007