HLMP-HG65, HLMP-HM65, HLMP-HB65 Precision Optical Performance Red, Green, and Blue New 5mm Standard Oval LEDs Data Sheet Description Features These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct sunlight. Well defined spatial radiation pattern High brightness material Available in Red, Green and Blue color — Red AlInGaP 626 nm — Green InGaN 525nm — Blue InGaN 470nm Superior resistance to moisture Standoff Package Tinted and diffused Typical viewing angle 40° × 100° CAUTION INGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN – 1142 for additional details. Applications Full color signs Package Dimensions MEASURED AT BASE OF LENS. 10.80 ± 0.50 0.425 ± 0.020 1.30 ± 0.20 0.051 ± 0.008 0.50 ± 0.10 sq. typ. 0.020 ± 0.004 3.80 ± 0.20 0.150 ± 0.008 5.20 ± 0.20 0.205 ± 0.008 cathode lead 7.00 ± 0.20 0.276 ± 0.008 NOTE 1.02 max. 0.040 24.00 min. 0.945 All dimensions in millimeters (inches). Avago Technologies -1- 1.00 min. 0.039 2.54 ± 0.30 0.10 ± 0.012 HLMP-HG65, HLMP-HM65, HLMP-HB65 Data Sheet Device Selection Guide Device Selection Guide Part Number Color and Dominant Wavelength d (nm) Typa Luminous Intensity Iv (mcd) at 20 mA-Minb,c,d] Luminous Intensity Iv (mcd) at 20 mA-Maxb,c,d HLMP-HG65-VY000 Red 626 1150 2400 HLMP-HG65-VY0DD Red 626 1150 2400 HLMP-HM65-34B00 Green 525 4200 6050 HLMP-HM65-34BDD Green 525 4200 6050 HLMP-HM65-34CDD Green 525 4200 6050 HLMP-HB65-QU0DD Blue 470 460 1150 HLMP-HB65-RU0DD Blue 470 550 1150 a. Dominant wavelength,d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. b. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. c. The optical axis is closely aligned with the package mechanical axis. d. Tolerance for each bin limit is ± 15%. Part Numbering System HLMP-H x 65 - x x x xx Packaging Option DD: Ammopacks Color Bin Selection 0: Open distribution B: Color bin 2 and 3 C: Color bin 3 and 4 Maximum Intensity Bin 0: No maximum intensity limit Minimum Intensity Bin Refer to Device Selection Guide. Standoff/Non Standoff 5: Standoff Color G: Red 626 M: Green 525 B: Blue 470 Package H: 5mm Standard Oval 40° x 100° NOTE Refer to AB 5337 for complete information about the part numbering system. Avago Technologies -2- HLMP-HG65, HLMP-HM65, HLMP-HB65 Data Sheet Absolute Maximum Ratings Absolute Maximum Ratings TJ = 25 °C Parameter Red Green and Blue Unit DC Forward Currenta 50 30 mA Peak Forward Current 100b 100c mA Power Dissipation 120 116 mW Reverse Voltage 5 (IR = 100 μA) 5 (IR = 10 μA) V LED Junction Temperature 130 110 °C Operating Temperature Range –40 to +100 –40 to +85 °C Storage Temperature Range –40 to +100 –40 to +100 °C a. Derate linearly as shown in Figure 4 and Figure 8. b. Duty Factor 30%, frequency 1KHz. c. Duty Factor 10%, frequency 1KHz. Electrical/Optical Characteristics TJ = 25 °C Parameter Symbol Forward Voltage Red Green Blue VF Reverse Voltage Red Green and blue VR Dominant Wavelengtha Red Green Blue d Peak Wavelength Red Green Blue PEAK Thermal Resistance RJ-PIN Luminous Efficacyb Red Green Blue V Min. Typ. Max. Units V 1.8 2.8 2.8 2.1 3.2 3.2 2.4 3.8 3.8 Test Conditions IF = 20 mA V 5 5 618 520 460 IR = 100 μA IR = 10 μA 626 525 470 nm IF = 20 mA nm Peak of Wavelength of Spectral Distribution at IF = 20 mA °C/W LED Junction-to-Pin lm/W Emitted Luminous Power/Emitted Radiant Power 630 540 480 634 516 464 240 150 530 65 a. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp. b. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/V where IV is the luminous intensity in candelas and V is the luminous efficacy in lumens/watt. Avago Technologies -3- HLMP-HG65, HLMP-HM65, HLMP-HB65 Data Sheet AlInGaP Red AlInGaP Red Figure 2 Forward Current vs. Forward Voltage 1 100 0.8 80 FORWARD CURRENT - mA RELATIVE INTENSITY Figure 1 Relative Intensity vs. Wavelength 0.6 0.4 0.2 40 20 0 0 550 600 650 WAVELENGTH - nm 0 700 Figure 3 Relative Intensity vs. Forward Current 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 20 40 60 DC FORWARD CURRENT - mA 1 2 FORWARD VOLTAGE - V 3 Figure 4 Maximum Forward Current vs. Ambient Temperature I F MAX . - MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 60 80 100 Avago Technologies -4- 60 50 40 30 20 10 0 0 20 40 60 80 TA- AMBIENT TEMPERATURE - C 100 HLMP-HG65, HLMP-HM65, HLMP-HB65 Data Sheet InGaN Blue and Green InGaN Blue and Green Figure 6 Forward Current vs. Forward Voltage 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 100 BLUE FORWARD CURRENT - mA RELATIVE INTENSITY Figure 5 Relative Intensity vs. Wavelength GREEN 80 60 40 20 0 430 480 530 580 630 0 1 2 3 FORWARD VOLTAGE - V WAVELENGTH - nm Figure 7 Relative Intensity vs. Forward Current I F max - MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20mA) BLUE 3.0 GREEN 2.5 2.0 1.5 1.0 0.5 0.0 20 40 60 80 DC FORWARD CURRENT - mA 100 120 RELATIVE DOMINANT WAVELENGTH SHIFT -nm BLUE GREEN 0 20 40 60 FORWARD CURRENT-mA 35 30 25 20 15 10 5 0 0 20 40 60 T A - AMBIENT TEMPERATURE - °C Figure 9 Relative Dominant Wavelength vs. Forward Current 10 8 6 4 2 0 -2 -4 -6 -8 -10 5 Figure 8 Maximum Forward Current vs. Ambient Temperature 3.5 0 4 80 100 Avago Technologies -5- 80 100 HLMP-HG65, HLMP-HM65, HLMP-HB65 Data Sheet InGaN Blue and Green Figure 11 Radiation Pattern – Minor Axis 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 RED BLUE GREEN -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES 60 NORMALIZED INTENSITY NORMALIZED INTENSITY Figure 10 Radiation Pattern – Major Axis 90 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -90 Figure 12 Relative Light Output vs. Junction Temperature -30 0 30 ANGULAR DISPLACEMENT - DEGREES 60 90 0.3 RED GREEN BLUE 1 -20 0 20 40 60 80 100 TJ - JUNCTION TEMPERATURE - °C 120 RED GREEN BLUE 0.2 FORWARD VOLTAGE SHIFT-V RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ = 25°C) -60 Figure 13 Relative Forward Voltage vs. Junction Temperature 10 0.1 -40 RED BLUE GREEN 140 0.1 0 -0.1 -0.2 -0.3 -0.4 -40 Avago Technologies -6- -20 0 20 40 60 80 100 TJ -JUNCTION TEMPERATURE 120 140 HLMP-HG65, HLMP-HM65, HLMP-HB65 Data Sheet Intensity Bin Limit Table (1.2:1 lv Bin Ratio) Intensity Bin Limit Table (1.2:1 lv Bin Ratio) Green Color Bin Table Bin Intensity (mcd) at 20 mA Bin Min 1 Max Q 460 550 R 550 660 S 660 800 T 800 960 U 960 1150 V 1150 1380 W 1380 1660 X 1660 1990 Y 1990 2400 Z 2400 2900 1 2900 3500 2 3500 4200 3 4200 5040 4 5040 6050 528.0 4 532.0 5 536.0 Bin Max 2.0 2.2 2.2 2.4 3 4 5 NOTE Tolerance for each bin limit is ±0.05V VF binning only applicable to Red color. 630 532.0 536.0 540.0 Xmin Ymin Ymin Xmax Ymax 0.0743 0.8338 0.1856 0.6556 0.1650 0.6586 0.1060 0.8292 0.1060 0.8292 0.2068 0.6463 0.1856 0.6556 0.1387 0.8148 0.1387 0.8148 0.2273 0.6344 0.2068 0.6463 0.1702 0.7965 0.1702 0.7965 0.2469 0.6213 0.2273 0.6344 0.2003 0.7764 0.2003 0.7764 0.2659 0.6070 0.2469 0.6213 0.2296 0.7543 Min Dom 460.0 464.0 468.0 Max Dom Xmax Ymax 464.0 468.0 472.0 Xmax 472.0 476.0 476.0 480.0 Xmin Ymin 0.1440 0.0297 0.1766 0.0966 0.1818 0.0904 0.1374 0.0374 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 0.1187 0.0671 0.1517 0.1423 0.1616 0.1209 0.1063 0.0945 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327 Tolerance for each bin limit is ± 5 nm. Red Color Range 618 528.0 2.0 VB MinDom Max Dom 524.0 Xmin Blue Color Bin Table 2 VA 1. 2. Max Dom Tolerance for each bin limit is ± 5 nm. 1 Min 1.8 524.0 3 VF Bin Table (V at 20 mA) VD 520.0 2 Tolerance for each bin limit is ± 15%. Bin ID Min Dom Ymax 0.6872 0.3126 0.6890 0.2943 0.6690 0.3149 0.7080 0.2920 Tolerance for each bin limit is ± 5 nm. Avago Technologies -7- HLMP-HG65, HLMP-HM65, HLMP-HB65 Data Sheet Avago Color Bin on CIE 1931 Chromaticity Diagram Avago Color Bin on CIE 1931 Chromaticity Diagram 1.000 0.800 Green 1 2 3 4 5 Y 0.600 0.400 Red 0.200 Blue 5 4 3 21 0.000 0.000 0.100 0.200 0.300 0.400 0.500 0.600 X Avago Technologies -8- 0.700 0.800 HLMP-HG65, HLMP-HM65, HLMP-HB65 Data Sheet Precautions Precautions Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. The customer is advised to perform daily checks on the soldering profile to ensure that it is always conforming to recommended soldering conditions. Lead Forming: The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. For better control, it is recommended to use the proper tool to precisely form and cut the leads to the applicable length rather than doing it manually. If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground that prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand soldering operation, as the excess lead length also acts as small heat sink. NOTE 1. 2. Soldering and Handling: Take care during PCB assembly and soldering process to prevent damage to the LED component. LED component may be effectively hand soldered to PCB. However, it is recommended only under unavoidable circumstances, such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59 mm. Soldering the LED using soldering iron tip closer than 1.59 mm might damage the LED. PCBs with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if the same wave soldering setting is used. So, it is recommended to recalibrate the soldering profile again before loading a new type of PCB. Avago Technologies’ AllnGaP high brightness LEDs are using a high efficiency LED die with a single wire bond as shown below. The customer is advised to take extra precautions during wave soldering to ensure that the maximum wave temperature does not exceed 260 °C and the solder contact time does not exceed 5 s. Overstressing the LED during the soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED Configuration 1.59mm ESD precautions must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Refer to Avago application note AN 1142 for details. The soldering iron used should have a grounded tip to ensure electrostatic charge is properly grounded. Recommended soldering condition: Wave Solderinga, b CATHODE InGaN Device Manual Solder Dipping Pre-heat temperature 105 °C Max. — Preheat time 60 sec Max — Peak temperature 260 °C Max. 260 °C Max. Dwell time 5 sec Max. 5 sec Max a. Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. b. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. Avago Technologies -9- ANDOE AlInGaP Device Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Nonmetal material is recommended as it will absorb less heat during wave soldering process. At elevated temperature, LED is more susceptible to mechanical stress. Therefore, the PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. HLMP-HG65, HLMP-HM65, HLMP-HB65 Data Sheet Application Precautions If the PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If the surface mount must be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. The following table shows the recommended PC board plated through holes (PTH) size for LED component leads. LED Component Lead Size Diagonal 1. The drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance. 2. LEDs do exhibit slightly different characteristics at different drive currents that might result in larger performance variations (such as intensity, wavelength, and forward voltage). The user is recommended to set the application current as close as possible to the test current to minimize these variations. 3. The LED is not intended for reverse bias. Use other appropriate components for such purposes. When driving the LED in matrix form, it is crucial to ensure that the reverse bias voltage does not exceed the allowable limit of the LED. Plated through Hole Diameter 0.45 × 0.45 mm (0.018 × 0.018 inch) 0.636 mm (0.025 in.) 0.98 to 1.08 mm (0.039 to 0.043 in.) 0.50 x 0.50 mm (0.020 × 0.020 inch) 0.707 mm (0.028 in.) 1.05 to 1.15 mm (0.041 to 0.045 in.) Application Precautions Over-sizing the PTH can lead to a twisted LED after clinching. On the other hand, under-sizing the PTH can cause difficulty when inserting the TH LED. NOTE Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Avago Technologies - 10 - HLMP-HG65, HLMP-HM65, HLMP-HB65 Data Sheet Example of Wave Soldering Temperature Profile for TH LED Example of Wave Soldering Temperature Profile for TH LED 260°C Max TEMPERATURE (°C) Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255°C ± 5°C (maximum peak temperature = 260°C) 105°C Max Dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) 60 sec Max Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. TIME (sec) Ammo Packs Drawing 6.35±1.30 0.25±0.0512 12.70±1.00 0.50±0.0394 CATHODE 20.50±1.00 0.8071±0.0394 9.125±0.625 0.3593±0.0246 18.00±0.50 0.7087±0.0197 A 12.70±0.30 0.50±0.0118 0.70±0.20 0.0276±0.0079 A VIEW A - A Avago Technologies - 11 - Ø 4.00±0.20 TYP 0.1575±0.008 HLMP-HG65, HLMP-HM65, HLMP-HB65 Data Sheet Packaging Box for Ammo Packs Packaging Box for Ammo Packs FROM LEFT SIDE OF BOX ADHESIVE TAPE MUST BE FACING UPWARDS. LABEL ON THIS SIDE OF BOX ANODE LEAD LEAVES THE BOX FIRST. Packaging Label (i) Avago Mother Label (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 260C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin Avago Technologies - 12 - HLMP-HG65, HLMP-HM65, HLMP-HB65 Data Sheet Acronyms and Definition (i) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 260C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition Example BIN: (i) Color bin only or VF bin only (i) Color bin only or VF bin only BIN: 2 (represent color bin 2 only) (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) BIN: VB (represent VF bin “VB” only) (ii) Color bin incorporate with VF Bin OR BIN: 2VB (ii) Color bin incorporated with VF Bin where 2 is color bin 2 only and VB is VF bin "VB" (Applicable for part number that have both color bin and VF bin) DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. Avago Technologies - 13 - For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago Technologies and the A logo are trademarks of Avago Technologies in the United States and other countries. All other brand and product names may be trademarks of their respective companies. Data subject to change. Copyright © 2011–2016 Avago Technologies. All Rights Reserved. AV02-1485EN – June 7, 2016