FERRITE CHIP INDUCTORS L3 SERIES 1. PART NO. EXPRESSION : L 3 - 4 7 N K - □□ (a) (b) (c) (d) (a) Series code (c) Tolerance code : K = ± 10%, M = ± 20% (b) Inductance code : 47N = 0.047uH (g) 10: Standard 11 ~ 99 : Internal control number 2. CONFIGURATION & DIMENSIONS : A D B L H C G Recommended PC Board Pattern Unit:m/m A 2.00± 0.20 B C D 1.25± 0.20 0.85± 0.20 1.25± 0.20 0.50± 0.30 G H L 1.00 Ref. 1.00 Ref. 3.00 Ref. 3. SCHEMATIC : 4. MATERIALS : b a Ag(100%) Ni(100%)-1.5um(min.) (a) Body : Ferrite (b) Termination : Ag/Ni/Sn Sn(100%)-3.0um(min.) 5. GENERAL SPECIFICATION : a) Operating temp. : -40° C to +105° C ( including self-temperature. rise ) b) Storage condition (component in its packaging) i) Temperature : -10 to 40° C ii) Humidity : 60% NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 FERRITE CHIP INDUCTORS L3 SERIES 6. ELECTRICAL CHARACTERISTICS : Part Number Dim. C ( mm ) ± 0.2 Inductance ( μH ) Q Min. Test Frequency ( MHz ) SRF ( MHz ) Min. DC Resistance (Ω) Max. Rated Current ( mA ) Max. L3-47N□-10 0.85 0.047 15 50 320 0.20 300 L3-68N□-10 0.85 0.068 15 50 280 0.20 300 L3-82N□-10 0.85 0.082 15 50 255 0.20 300 L3-R10□-10 0.85 0.100 20 25 235 0.30 250 L3-R12□-10 0.85 0.120 20 25 220 0.30 250 L3-R15□-10 0.85 0.150 20 25 200 0.40 250 L3-R18□-10 0.85 0.180 20 25 185 0.40 250 L3-R22□-10 0.85 0.220 20 25 170 0.50 250 L3-R27□-10 0.85 0.270 20 25 150 0.50 250 L3-R33□-10 0.85 0.330 20 25 145 0.55 250 L3-R39□-10 0.85 0.390 25 25 135 0.65 200 L3-R47□-10 1.25 0.470 25 25 125 0.65 200 L3-R56□-10 1.25 0.560 25 25 115 0.75 150 L3-R68□-10 1.25 0.680 25 25 105 0.80 150 L3-R82□-10 1.25 0.820 25 25 100 1.00 150 L3-1R0□-10 0.85 1.000 45 10 75 0.40 50 L3-1R2□-10 0.85 1.200 45 10 65 0.50 50 L3-1R5□-10 0.85 1.500 45 10 60 0.50 50 L3-1R8□-10 0.85 1.800 45 10 55 0.60 50 L3-2R2□-10 0.85 2.200 45 10 50 0.65 30 L3-2R7□-10 1.25 2.700 45 10 45 0.75 30 L3-3R3□-10 1.25 3.300 45 10 41 0.80 30 L3-3R9□-10 1.25 3.900 45 10 38 0.90 30 L3-4R7□-10 1.25 4.700 45 10 35 1.00 30 L3-100□-10 1.25 10.000 45 2 24 1.15 15 Inductance tolerance : □ : K : ±10% L : ± 15% M : ± 20% NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 FERRITE CHIP INDUCTORS L3 SERIES 7. IMPEDANCE VS. FREQUENCY CURVES : L vs IDC FCI2012F-Series L vs IDC. Inductance(uH) 1 00 100 10 4R7 1R2 1 R12 0.1 1 10 100 1 000 DC Current(mA) Q vs Freq. FCI2012F-Series Q vs Freq. 120 100 Q 4R7 100 80 R10 1R0 60 40 20 0 1 10 100 FREQUENCY(MHz) NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 FERRITE CHIP INDUCTORS L3 SERIES 8. SOLDERING AND MOUNTING : 8-1. Recommended PC Board Pattern 3.00 PC board should be designed so that products can prevent damage from mechanical stress when warping the board. 1.00 1.00 8-2. Soldering Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note. If wave soldering is used ,there will be some risk. Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk 8-2.1 Lead Free Solder Re-flow : Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C) 8-2.2 Soldering Iron : Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2. Note : d) 1.0mm tip diameter (max) a) Preheat circuit and products to 150° C. e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 350° C tip temperature for Ferrite chip bead (max) c) Never contact the ceramic with the iron tip f) Limit soldering time to 4-5 secs. Soldering Natural cooling 20~40s TP(26 0° C/40 s max.) 217 200 150 60~150s 60~180s 4 80s max. 25 Preheating TEMPERATURE ° C TEMPERATURE ° C Preheating Time(sec.) Soldering Natural cooling 350 150 G rad ual Cooling O ve r 60s. Figure 1. Re-flow Soldering:3 times max Within4 ~5s Figure 2. Wave Soldering:1 times max NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 FERRITE CHIP INDUCTORS L3 SERIES 8-3. Solder Volume Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 3. Minimum fillet height = soldering thickness + 25% product height Upper limit t ReC0mmendable Figure 3 NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 FERRITE CHIP INDUCTORS L3 SERIES 9. PACKAGING INFORMATION : 9-1. Reel Dimension C(mm) D(mm) Type A(mm) B(mm) 7" x 8mm 9.0± 0.5 60.0± 2.0 13.5± 0.5 178.0± 2.0 7" x 12mm 13.5± 0.5 60.0± 2.0 13.5± 0.5 178.0± 2.0 C D B A 2± 0.5 7" x 8mm 13.5± 0.5 7" x 12mm R10.5 R1.9 R0.5 120° 9-2.1 Tape Dimension / 8mm Material of taping is paper D:1.5+0.1/-0.0 Bo P W:8.0± 0.3 t F:3.5± 0.05 E:1.75± 0.1 Po:4± 0.1 Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) 0 0.68± 0.05 0.38± 0.05 0.50max 2.0± 0.05 0.50max Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) 1 1.12± 0.03 0.62± 0.03 0.60± 0.03 2.0± 0.10 0.60± 0.03 2 1.85± 0.05 1.05± 0.05 0.95± 0.05 4.0± 0.10 0.95± 0.05 3(09) 2.30± 0.05 1.50± 0.05 0.95± 0.05 4.0± 0.10 0.95± 0.05 Ko Ao Po:4± 0.1 +0.1 -0.05 t Bo Ko Ao P W:8.0± 0.1 D:1.56 F:3.5± 0.1 E:1.75± 0.1 P2:2± 0.1 Material of taping is plastic Po:4± 0.1 D:1.5+0.1 t Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 2(08) 1.95± 0.10 1.05± 0.10 1.05± 0.10 4.0± 0.10 0.23± 0.05 none 3(09) 2.25± 0.10 1.42± 0.10 1.04± 0.10 4.0± 0.10 0.22± 0.05 1.0± 0.10 3(12) 2.35± 0.10 1.50± 0.10 1.45± 0.10 4.0± 0.10 0.22± 0.05 1.0± 0.10 4(11) 3.50± 0.10 1.88± 0.10 1.27± 0.10 4.0± 0.10 0.22± 0.05 1.0± 0.10 5 3.42± 0.10 2.77± 0.10 1.55± 0.10 4.0± 0.10 0.22± 0.05 1.0± 0.10 4(09) 3.40± 0.10 1.77± 0.10 1.04± 0.10 4.0± 0.10 0.22± 0.05 1.0± 0.10 P A D1:1± 0.1 Ao Bo W:8.0± 0.1 A F:3.5± 0.05 E:1.75± 0.1 P2:2± 0.05 Ko Section A-A NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8 FERRITE CHIP INDUCTORS L3 SERIES 9-2.2 Tape Dimension / 12mm Po:4± 0.1 P2:2± 0.05 t A P A Ao Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 6 4.95± 0.1 1.93± 0.1 1.93± 0.1 4.0± 0.1 0.24± 0.05 1.5± 0.1 7 4.95± 0.1 3.66± 0.1 1.85± 0.1 8.0± 0.1 0.24± 0.05 1.5± 0.1 Z/L Bo W:12.0± 0.1 Series F:5.5± 0.05 E:1.75± 0.1 D:1.5+0.1 Ko Section A-A D1:1.5± 0.1 9-3. Packaging Quantity Chip Size 7 6 5 4(11) 4(09) 3(12) 3(09) 2 1 0 Chip / Reel 1000 2000 2500 3000 3000 2000 4000 4000 10000 15000 Inner Box 4000 8000 12500 15000 15000 10000 20000 20000 50000 75000 Middle Box 20000 40000 62500 75000 75000 50000 100000 100000 250000 375000 Carton 40000 80000 125000 150000 150000 100000 200000 200000 500000 750000 9-4. Tearing Off Force The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. F 165° C to 180° C Top cover tape Room Temp. (° C) Room Humidity (%) Room atm (hPa) Tearing Speed (mm/min) 5~35 45~85 860~1060 300 Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Recommended products should be used within 12 months from the time of delivery. b) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 9