BRU20N90 Rev.D Nov.-2015 描述 / DATA SHEET Descriptions TO-3P 塑封封装 N 沟 MOS 场效应管。N-Channel MOSFET in a TO-3P Plastic Package. 特征 / Features 低栅极电荷，开关速度快，雪崩能量高，dv/dt 能力强。 Low gate charge, Fast switching capability, Avalanche energy specified, Improved dv/dt capability. 用途 / Applications 用于高电压、高速功率开关应用，如高效率开关模电源、功率因数校正。 Designed for high voltage, high speed power switching applications such as high efficiency switched mode power supplies, active power factor correction. 内部等效电路 引脚排列 / Equivalent Circuit / Pinning PIN1：Gate 放大及印章代码 PIN 2：Drain PIN 3：Source / hFE Classifications & Marking 见印章说明。See Marking Instructions. http://www.fsbrec.com 1/6 BRU20N90 Rev.D Nov.-2015 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter Drain-to-Source Breakdown Voltage 符号 Symbol VDSS 数值 Rating 900 单位 Unit V Continuous Drain Current ID(Tc=25℃) 20 A Continuous Drain Current ID(Tc=100℃) 13 A IDM 80 A Gate-to-Source Voltage VGSS ±30 V Repetitive Avalanche Energy EAR 100 mJ Single Pulse Avalanche Energy EAS 1000 mJ Peak Diode Recovery dv/dt dv/dt 5 V/ns 250 W Junction Temperature Range PD(Tc=25℃) Tj 150 ℃ Storage Temperature Range Tstg -55～150 ℃ Thermal Resistance Junction-Ambient RθJA 40 ℃/W Thermal Resistance Junction-Case RθJC 0.5 ℃/W Drain Current Pulsed Power Dissipation 电性能参数 / Electrical Characteristics(Ta=25℃) 参数 Parameter Drain-to-Source Breakdown Voltage Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate Threshold Voltage Static Drain-to-Source On-Resistance Diode Forward Voltage 符号 Symbol ID=250μA VDS=900V VGS=0V 25 VDS=720V TC=125℃ 250 VGS=±20V VDS=0V ±10 μA VGS(th) VDS=VGS ID=250μA 4.0 V RDS(on) VGS=10V ID=10A 0.4 Ω VSD VGS=0V ISD=20A 1.5 V VDS=25V f=1.0MHz VGS=0V IDSS IGSS Ciss Output Capacitance Coss Reverse Transfer Capacitance Crss Turn-On Delay Time td(on) Turn-Off Delay Time Fall Time Total Gate Charge tr td(off) Qgs Gate-Drain Charge Qgd 900 V 2.0 0.31 μA 9140 504 pF 63.5 22 VDD=300V VGS=10V ID=20A RG=4.7Ω tf Qg Gate-Source Charge http://www.fsbrec.com 最小值 典型值 最大值 单位 Min Typ Max Unit VGS=0V VDSS Input Capacitance Rise Time 测试条件 Test Conditions 42 153 ns 97 162 VDS=300V VGS=10V ID=20A 22 nC 59 2/6 BRU20N90 Rev.D Nov.-2015 电参数曲线图 DATA SHEET / Electrical Characteristic Curve http://www.fsbrec.com 3/6 BRU20N90 Rev.D Nov.-2015 外形尺寸图 DATA SHEET / Package Dimensions http://www.fsbrec.com 4/6 BRU20N90 Rev.D Nov.-2015 印章说明 / DATA SHEET Marking Instructions BR 20N90 **** 说明： BR: 为公司代码 20N90： 为型号代码 ****： 为生产批号代码，随生产批号变化。 Note: BR: 20N90: ****: http://www.fsbrec.com Company Code. Product Type. Lot No. Code, code change with Lot No. 5/6 BRU20N90 Rev.D Nov.-2015 DATA SHEET 波峰焊温度曲线图(无铅) / Temperature Profile for Dip Soldering(Pb-Free) 说明： Note: 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150℃, Time:60~90sec. 2、峰值温度 255±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:255±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：270±5℃ 包装规格 Package Type 封装形式 使用说明 Temp:270±5℃ Time:10±1 sec / Packaging SPEC. 套管包装 TO-3P 时间：10±1 sec. / TUBE Units 包装数量 Dimension 包装尺寸 3 (unit：mm ) Units/Tube 只/套管 Tubes/Inner Box 套管/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Tube 套管 Inner Box 盒 Outer Box 箱 30 15 450 5 2250 497.5×46×8 555×164×50 575×290×180 / Notices http://www.fsbrec.com 6/6