Material Content Data Sheet Sales Product Name TLE4206-2G Issued MA# MA000727136 Package PG-DSO-14-22 26. September 2014 Weight* 142.95 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver acrylic resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 3.173 2.22 0.015 0.01 0.060 0.04 422 1.207 0.84 8443 49.007 34.28 35.17 342838 351809 0.217 0.15 0.15 1519 1519 0.172 0.12 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 2.22 22199 22199 106 1206 7.928 5.55 78.074 54.62 60.29 546179 602847 1.226 0.86 0.86 8578 8578 1.030 0.72 0.72 7204 7204 0.184 0.13 0.652 0.46 55462 1286 0.59 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 4558 5844 1000000