TI1 DAC8740HRGER Hart and foundation fieldbus / profibus pa modem Datasheet

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DAC8740H, DAC8741H, DAC8742H
SBAS862 – JUNE 2017
DAC874xH, HART and FOUNDATION Fieldbus / PROFIBUS PA Modems
1 Features
3 Description
•
The DAC8740H, DAC8741H, and DAC8742H are
HART®, FOUNDATION Fieldbus™, and PROFIBUS
PA compliant low power modems designed for
industrial process control and industrial automation
applications.
•
•
•
•
•
•
•
•
HART-Compliant Physical Layer Modem
– 1200/2200 Hz HART FSK Sinusoids
– Register Programmable Amplitude of TX
Signals
(DAC8741H / DAC8742H only)
– Integrated RX Demodulator and Band-Pass
Filter with Minimal External Components
Foundation Fieldbus Compliant H1 Controller and
Medium Attachment Unit (MAU)
– 31.25 kbit/s Communication Based on
Manchester Coded Bus Powered (MBP)
– Integrated Manchester Encoder and Decoder
– Compliant with PROFIBUS PA
Low Quiescent Current: 200 uA Max
Integrated 1.5 V Reference
Flexible Clocking Options
– External Crystal Oscillator
– External CMOS Clock
Digital Interface
– DAC8740H: UART
– DAC8741H: SPI
– DAC8742H: UART and SPI
Reliability: CRC Bit Error Checking, Watchdog
Timer (DAC8741H and DAC8742H only)
Wide Operating Temperature: –55°C to 125°C
4 mm x 4 mm QFN and 5 mm x 5 mm TQFP
Packages
In HART mode, the DAC874xH integrates all of the
required circuitry to operate as half-duplex HART
physical layer modems, in either slave or master
configurations with minimal external components for
filtering. In FOUNDATION Fieldbus mode, the
DAC874xH integrates all of the required circuitry to
operate as half-duplex FOUNDATION Fieldbus
compliant H1 Controllers and MAUs.
The HART, FOUNDATION Fieldbus, or PROFIBUS
PA, data stream can be transferred from the
microcontroller through either a UART interface or an
integrated FIFO accessed by a SPI interface. The
SPI interface includes an SDO pin for daisy-chain
support, various interrupts, and other extended
features.
The devices operate from a supply of 2.7V to 5.5V
while consuming only 200 uA, making them an
excellent choice for loop-powered or 2-wire
applications. They operate from –55°C to 125°C and
are available in 24-lead VQFN and 32-lead TQFP
packages.
Device Information(1)
PART NUMBER
2 Applications
•
•
•
PACKAGE
BODY SIZE (NOM)
DAC8740H
VQFN (24)
4 mm × 4 mm
DAC8741H
VQFN (24)
4 mm × 4 mm
DAC8742H
TQFP (32)
5 mm × 5 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Industrial Process Control and Automation
PLC or DCS I/O Modules
Field and Sensor Transmitters
Simplified Schematic
IOVDD
CLK_CFG0 CLK_CFG1 CLKO
Clock
Generator
XEN
X1
X2
Precision
Oscillator
REF_EN
REF
REG_CAP AVDD
Voltage
Reference
CD / IRQ
UART_IN / CS
DUPLEX / SDI
UART_OUT / SDO
UART_RTS / SCLK
Digital Interface
UART (DAC8740H), SPI
(DAC8741H),
UART/SPI (DAC8742H)
RST
HART
Transmit
Modulator
DAC
Buffer
MOD_OUT
MUX
MOD_INF
PA/FF
Receive
Modulator
Carrier
Detect
Bandpass
Filter
MOD_IN
IF_SEL
DGND
BPFEN
GND
Copyright © 2017, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to
change without notice.
ADVANCE INFORMATION
1
DAC8740H, DAC8741H, DAC8742H
SBAS862 – JUNE 2017
www.ti.com
4 Device and Documentation Support
4.1 Documentation Support
4.1.1 Related Documentation
For related documentation see the following: DAC8742H Evaluation Module User's Guide (SLAU700)
4.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 1. Related Links
PARTS
PRODUCT FOLDER
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TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
DAC8740H
Click here
Click here
Click here
Click here
Click here
DAC8741H
Click here
Click here
Click here
Click here
Click here
DAC8742H
Click here
Click here
Click here
Click here
Click here
ADVANCE INFORMATION
4.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
4.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
4.5 Trademarks
E2E is a trademark of Texas Instruments.
FOUNDATION Fieldbus is a trademark of FieldComm Group.
HART is a registered trademark of FieldComm Group.
All other trademarks are the property of their respective owners.
4.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
4.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
2
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Product Folder Links: DAC8740H DAC8741H DAC8742H
DAC8740H, DAC8741H, DAC8742H
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SBAS862 – JUNE 2017
5 Mechanical, Packaging, and Orderable Information
ADVANCE INFORMATION
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2017, Texas Instruments Incorporated
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DAC8740H, DAC8741H, DAC8742H
SBAS862 – JUNE 2017
www.ti.com
PACKAGE OUTLINE
RGE0024F
VQFN - 1 mm max height
SCALE 3.300
PLASTIC QUAD FLATPACK - NO LEAD
4.1
3.9
A
B
PIN 1 INDEX AREA
0.5
0.3
4.1
3.9
ADVANCE INFORMATION
0.30
0.18
DETAIL
OPTIONAL TERMINAL
TYPICAL
C
1 MAX
SEATING PLANE
0.05
0.00
0.08
2.8 0.1
2X 2.5
(0.2) TYP
12
7
EXPOSED
THERMAL PAD
20X 0.5
6
13
2X
2.5
25
1
SEE TERMINAL
DETAIL
18
24X
24
PIN 1 ID
(OPTIONAL)
19
0.5
24X
0.3
0.30
0.18
0.1
0.05
C A
B
4222437/A 12/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
4. Reference JEDEC registration MO-220.
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SBAS862 – JUNE 2017
EXAMPLE BOARD LAYOUT
RGE0024F
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
( 2.8)
SYMM
24
19
24X (0.6)
1
18
24X (0.24)
25
ADVANCE INFORMATION
(1.15)
TYP
SYMM
20X (0.5)
(3.8)
13
6
( 0.2) TYP
VIA
7
12
(R0.05)
ALL PAD CORNERS
(3.8)
LAND PATTERN EXAMPLE
SCALE:18X
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4222437/A 12/2015
NOTES: (continued)
5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
6. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations
are shown.
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SBAS862 – JUNE 2017
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EXAMPLE STENCIL DESIGN
RGE0024F
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
4X ( 1.23)
(0.715) TYP
(R0.05) TYP
19
24
24X (0.6)
25
1
18
24X (0.24)
ADVANCE INFORMATION
(0.715) TYP
SYMM
20X (0.5)
(3.8)
13
6
METAL
TYP
7
SYMM
12
(3.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 25:
77% PRINTED SOLDER COVERAGE BY AREA
SCALE:25X
4222437/A 12/2015
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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PACKAGE OPTION ADDENDUM
www.ti.com
12-Nov-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DAC8740HRGER
PREVIEW
VQFN
RGE
24
3000
TBD
Call TI
Call TI
-55 to 125
DAC8740HRGET
PREVIEW
VQFN
RGE
24
250
TBD
Call TI
Call TI
-55 to 125
DAC
8740H
DAC8742HPBS
PREVIEW
TQFP
PBS
32
250
TBD
Call TI
Call TI
-55 to 125
8742H
DAC8742HPBSR
PREVIEW
TQFP
PBS
32
1000
TBD
Call TI
Call TI
-55 to 125
XDAC8740HRGET
ACTIVE
VQFN
RGE
24
250
TBD
Call TI
Call TI
-55 to 125
XDAC8742HPBST
ACTIVE
TQFP
PBS
32
250
TBD
Call TI
Call TI
-55 to 125
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
12-Nov-2017
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TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
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