MLX90819 Relative Integrated Pressure Sensor Datasheet 1. Features and Benefits 3. Description Fully integrated IC: MEMS, analog front end, 16 bit microcontroller, analog back end, voltage regulators, SENT driver The MLX90819 is an integrated relative pressure sensor delivering a ratiometric analog or digital (using the SENT protocol) signal. Ratiometric Analog and SENT outputs Automotive temperature (-40°C to 150°C) Automotive qualified beyond AECQ100 Automotive diagnostic features (clamping levels, broken track diagnostics, multiple internal fault diagnostics) Use of an optimized architecture and a high density CMOS technology imparts the MLX90819 with best in class automotive EMC performance. A DSP based architecture using a 16bit microcontroller provides outstanding performance in terms of initial accuracy. Glass pedestal for easy assembly and for back side exposed configuration for higher resistance to common automotive media High accuracy and robust EMC performance DSP G M U X A D Gain & Offset temperature compensation Pressure Linearization Programmable filter Diagnostics Logic Analog/ Digital Regulator D RAM EEP ROM Figure 1: Block Diagram 2. Application Examples Mid pressure ranges (10..50bar) Automotive oil (engine, transmissions) Automotive HVAC Automotive fuel line Industrial applications REVISION 3 – OCTOBER 20, 2016 3901090819 A Rev. Pol. & OverVolt. Gain VDD OUT TX ROM - F/W Diagnostic Signals C 16 Piezoresistive sensing element Temperature Sensor 12 The MLX90819 is mounted on a glass pedestal to ease the assembly of the die at the customers being the ideal solution for back side exposed pressure sensor applications requiring high accuracy, high EMC robustness, miniaturization and compliance to harsh automotive environments (See application note 90819 Pressure Sensor Assembly Guidelines). (SENT) GND MLX90819 Datasheet Contents 1. Features and Benefits ................................................................................................................. 1 2. Application Examples ................................................................................................................. 1 3. Description ................................................................................................................................. 1 4. Ordering Information ................................................................................................................. 3 5. Functional Diagram .................................................................................................................... 4 6. Glossary of Terms ....................................................................................................................... 5 7. Bond Pads Location and Description ........................................................................................... 5 8. Absolute Maximum Ratings ........................................................................................................ 6 9. General Electrical Specifications ................................................................................................. 7 10. Pressure Accuracy Specifications............................................................................................... 8 11. Application Information............................................................................................................ 8 12. Die Dimensions......................................................................................................................... 9 13. Standard Information ............................................................................................................. 10 14. ESD Precautions...................................................................................................................... 10 15. Contact................................................................................................................................... 11 16. Disclaimer .............................................................................................................................. 11 REVISION 3 – OCTOBER 20, 2016 3901090819 Page 2 of 11 MLX90819 Datasheet 4. Ordering Information Product Temperature Package Option Code Packing Form Definition MLX90819 L (-40°C to 150°C) UF EBA-000 WB 10 to 35 bar range with electronic wafer map MLX90819 L (-40°C to 150°C) UF EBA-001 WB 10 to 35 bar range inked wafer MLX90819 L (-40°C to 150°C) UF EBB-000 WB 30 to 50 bar range with electronic wafer map MLX90819 L (-40°C to 150°C) UF EBA-001 WB 30 to 50 bar range inked wafer Table 1: Ordering information Legend: Temperature Code: L: from -40°C to 150°C Package Code: “UF” for saw wafer on foil Option Code: EBA-000: 10 to 35 bar application range with electronic wafer map EBA-001: 10 to 35 bar application range inked wafer EBB-000: 30 to 50 bar application range with electronic wafer map EBB-001: 30 to 50 bar application range inked wafer Packing Form: “WB” for wafer box Ordering Example: “MLX90819LUF-EBA-000-WB” For a sensor covering 10 to 35 bar pressure span in the application delivered as a saw wafer on foil with an electronic wafer map. REVISION 3 – OCTOBER 20, 2016 3901090819 Page 3 of 11 MLX90819 Datasheet 5. Functional Diagram The pressure sensing element consists of a square diaphragm realized in the silicon chip by backside etching. The diaphragm reacts to a pressure difference between the top and bottom side of the diaphragm. The internal str ain increases, in particular at the border of the diaphragm. Here, the piezo -resistive elements have been implanted into the silicon diaphragm, which act as a transducer. The electronics front end amplifies the signal from the bridge, performs a coarse of fset compensation and an ADC conversion. The DSP performs the compensations over temperature. Furthermore, the digital circuit provides some filtering, the possibility to linearize the pressure signal and also implements the clamping function. The analog b ack end consists of a 12 bit DAC and an output driver. This chip delivers an analog output proportional to the pressure or a SENT output compliant with SAE J2716 spec dated January 2010. A broken wire detection block allows actively driving the output to one of the rails in case of a broken supply or ground connection. Extensive protection of the supply lines allows the MLX90819 to handle extreme overvoltage conditions and is immune to severe external disturbances. Several diagnostic functions (over -voltage, under-voltage, overpressure, under pressure detections) have been implemented on the 90819 and can be enabled by programming EEPROM settings. Figure 2 describes MLX90819 block diagram. Temperature Sensor G M U X A D D Gain & Offset temperature compensation Pressure Linearization Programmable filter Diagnostics Logic A Rev. Pol. & OverVolt. Gain VDD OUT TX ROM - F/W Diagnostic Signals C 16 Piezoresistive sensing element Analog/ Digital Regulator 12 DSP RAM EEP ROM (SENT) GND Figure 2: MLX90819 block diagram REVISION 3 – OCTOBER 20, 2016 3901090819 Page 4 of 11 MLX90819 Datasheet 6. Glossary of Terms Bar Pressure unit (1bar = 100kPa) ADC Analog to Digital Converter DAC Digital to Analog Converter VDD TX DSP Digital Signal Processor EMC Electro Magnetic Compatibility FSO Full Span Output SENT Single Edge Nibble Transmission TEST VDD TX TEST Table 2: Glossary of terms 7. Bond Pads Location and Description The positions of the bond pads are shown Error! are depicted in SN Reference source not found. in Figure 3. The (X, Y) axes SN GND OUT GND blue; they represent the basis of the Cartesian coordinates of the bond pads center points. SP SP VDD VDD TX TEST OUT TX TEST Y (0,0) SN SP GND OUT X SN SP GND OUT Figure 3: Bond Pads Location 2650 2650 The bond pad coordinates and their names and functional type are given in table 3. REVISION 3 – OCTOBER 20, 2016 3901090819 Page 5 of 11 MLX90819 Datasheet Coordinates XY (1) Pad Opening X, Y Pin Type Comment VDD Supply 470 2345 100 150 TX Output 612 2370 100 100 To be connected in SENT mode TEST Input 86 1914 95 95 Do Not Connect SN Output 80 325 80 120 Do Not Connect SP Output 80 163 80 120 Do Not Connect GND Ground 1070 91 150 100 OUT Output 1397 91 100 100 To be connected in Analog Mode Table 3: Bond pad coordinates 8. Absolute Maximum Ratings Parameter Symbol Max. Unit VDD +18 V VDDREV -14 V (2) +18 V (2) -0.5 V Operating Temperature Range -40 to 150 °C Storage Temperature Range -40 to 150 °C PBURST 70 140 Bar PPROOF 60 100 Bar Supply Voltage (2) Reverse Supply Voltage (3) Positive Output Voltage Reverse Output Voltage Burst Pressure @ Room Temperature For EBA For EBB Proof Pressure @ Room Temperature For EBA For EBB Table 4: Absolute maximum ratings Exceeding the absolute maximum ratings may cause permanent damage. conditions for extended periods may affect device reliability. 1 2 3 Exposure to absolute maximum-rated Coordinate of the center of the pad. No time limit or temperature limit for these over voltage conditions Reverse Voltage Protection at -14V at 150 C for maximum 1 hour. At Room Temperature that condition can apply for maximum 24 hours REVISION 3 – OCTOBER 20, 2016 3901090819 Page 6 of 11 MLX90819 Datasheet 9. General Electrical Specifications DC Operating Parameters T = -40°C to 150°C, VDD = 5V (unless otherwise specified) Parameter Nominal Supply Voltage Symbol VDD Test Conditions Nominal Supply Current IDD No output load connected Load Resistance RLOAD Pull-up or Pull-down Capacitive Load CLOAD Diagnostic Limits diag_lo Clamping Levels Analog Saturation Output Level Max 5.5 Units V 8 mA kΩ 4.7 470 nF 2 %VDD clamp_lo 25 %VDD clamp_hi 50 100 %VDD 0 2 %VDD 97 vsat_lo vsat_hi Power Up Time 7 2.2 Pull-up ≥ 4.7kΩ Pull-up ≥ 4.7kΩ Pull-up ≥ 10kΩ (4) Typ 5 96 98 0 diag_hi (5) Min 4.5 Depending on the load configuration %VDD 100 %VDD (6) 5.5 ms (7) 1 ms 0.2 %VDD 2 mVrms 1.8 LSBrms Response Time Ratiometricity Error Analog Output noise SENT Output noise (8) (8) Table 5: General electrical specification 4Typical values are defined at T A = +25ºC and V DD = 5V 5 Programmable range with 8 bits resolution for the low clamping level and 9 bits resolution for the high clamping level (See application note 90819 Advanced Configuration Settings for detailed information) 6 Time from reaching the minimum allowed supply voltage of 4.5V till having the output within specification 7 Time needed for the output to react to a pressure change from 10% to 90% of its final value (pressure change corresponding to maximum a 4V output change) using default filter settings SSF=1, PFLT = 0 (See application note 90819 Advanced Configuration Settings for detailed inform ation) 8 Bandwidth limited to 50kHz. Using default filter settings SSF = 1, PFLT = 0. REVISION 3 – OCTOBER 20, 2016 3901090819 Page 7 of 11 MLX90819 Datasheet 10. Pressure Accuracy Specifications DC Operating Parameters T = -40°C to 150°C, VDD = 5V (unless otherwise specified) Parameter Non Linearity Error Symbol (9) Test Conditions EBA Room Temperature 10 bar (2 point calibration) 35 bar (2 point calibration) EBB Room Temperature 30 bar (2 point calibration) 50 bar (2 point calibration) Min Hysteresis Programmable Pressure Spans EBA EBB (10) Overall Accuracy Max Units 0.1 0.2 %FSO -0.25 0.1 0.2 0.25 10 30 -2.5 35 50 2.5 %FSO %FSO Bar %FSO Table 6: Pressure accuracy specification 11. Application Information The MLX90819 only needs 2 capacitors in the application, a 47nF decoupling capacitor on the supply line and a 47nF load on the analog output pin. When the SENT output is used a 2.2nF capacitor is recommended. Consult Melexis to discuss the ideal application schematics depending on the EMC specs to be fulfilled. MLX90819 in analog mode Vdd 47nF Gnd 47nF AnaOut Figure 4: MLX90819 application schematic - analog 9 Best Fit Non Linearity using ceramics prototype package. Indicative overall accuracy using ceramics prototype package and calibration in engineering setup of EBA at 20bar and EBB at 50bar. 10 REVISION 3 – OCTOBER 20, 2016 3901090819 Page 8 of 11 MLX90819 Datasheet MLX90819 in SENT mode 2.2nF SENTOut (TX) Vdd 47nF Gnd Figure 5: MLX90819 application schematic - SENT 12. Die Dimensions The MLX90819 shall be delivered as bare die, on fully tested wafers. Each wafer is accompanied by a wafer map in order to discriminate between good and bad die during customer assembly. The die dimensions (including scribe lane), membrane size are depicted in Figure 6. All dimensions are in mm. Die Dimension excluding scribe lane TYP 0 .780 Die Dimension including scribe lane (after dicing) TYP < 0 .1 2 . 555 ± 0 . 05 TYP 0 .55 1 .05 ± 0 .05 TYP < 0 . 1 0.8 ±0.08 2.555 ± 0 .05 TYP 0 . 5 1.09 ±0.08 Figure 6: Floorplan of a single die, including central position of membrane REVISION 3 – OCTOBER 20, 2016 3901090819 Page 9 of 11 MLX90819 Datasheet 13. Standard Information Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to standards in place in Semiconductor industry. For further details about test method references and for compliance verification of selected soldering method for product integration, Melexis recommends reviewing on our web site the General Guidelines soldering recommendation. For all soldering technologies deviating from the one mentioned in above document (regarding peak temperature, temperature gradient, temperature profile etc), additional class ification and qualification tests have to be agreed upon with Melexis. For package technology embedding trim and form post-delivery capability, Melexis recommends to consult the dedicated trim&form recommendation application note: lead trimming and forming recommendations Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/en/quality-environment 14. ESD Precautions Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products. REVISION 3 – OCTOBER 20, 2016 3901090819 Page 10 of 11 MLX90819 Datasheet 15. Contact For the latest version of this document, go to our website at www.melexis.com. For additional information, please contact our Direct Sales team and get help for your specific needs: Europe, Africa Telephone: +32 13 67 04 95 Email : [email protected] Americas Telephone: +1 603 223 2362 Email : [email protected] Asia Email : [email protected] 16. Disclaimer The information furnished by Melexis herein (“Information”) is believed to be correct and accurate. 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High reliability applications, such as medical life-support or lifesustaining equipment are specifically not recommended by Melexis. The Product(s) may not be used for the following applications subject to export control regulations: the development, product ion, processing, operation, maintenance, storage, recognition or proliferation of 1) chemical, biological or nuclear weapons, or for the development, production, maintenance o r storage of missiles for such weapons: 2) civil firearms, including spare parts or ammunition for such arms; 3) defense related products, or other material for military use or for law enforcement; 4) any applications that, alone or in combination with other goods, substances or organisms could cause serious harm to persons or goods and that can be used as a means of violence in an armed conflict or any similar violent situation. The Products sold by Melexis are subject to the terms and conditions as specified in the Terms of Sale, which can be found at https://www.melexis.com/en/legal/terms-andconditions. This document supersedes and replaces all prior information regarding the Product(s) and/or previous versions of this document. Melexis NV © - No part of this document may be reproduced without the prior written consent of Melexis. (2016) ISO/TS 16949 and ISO14001 Certified REVISION 3 – OCTOBER 20, 2016 3901090819 Page 11 of 11