Material Content Data Sheet Sales Product Name BSC0904NSI Issued MA# MA001015226 Package PG-TDSON-8-6 28. July 2015 Weight* 118.04 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal non noble metal inorganic material non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper gold carbon black epoxy resin silicondioxide tin silver silver tin lead iron phosphorus copper iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7439-89-6 7723-14-0 7440-50-8 7439-89-6 7723-14-0 7440-50-8 0.285 0.24 0.038 0.03 wire encapsulation leadfinish plating solder heatspreader heat sink CLIP *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.24 2410 2410 320 0.011 0.01 37.762 31.99 32.03 319898 96 320314 0.047 0.04 0.04 394 394 0.088 0.07 748 6.268 5.31 37.783 32.01 37.39 320080 373925 1.470 1.25 1.25 12451 12451 0.166 0.14 0.14 1402 1402 0.012 0.01 0.009 0.01 0.450 0.38 0.011 0.01 0.003 0.00 11.320 9.59 0.022 0.02 0.007 0.01 22.292 18.88 53097 100 80 0.40 3812 29 9.60 95898 2. 3. 57 18.91 188843 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 96023 189 Important Remarks: 1. 3992 96 189089 1000000