TI 5962-8763101RA

SN54ACT374, SN74ACT374
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCAS539F – OCTOBER 1995 – REVISED NOVEMBER 2002
SN54ACT374 . . . J OR W PACKAGE
SN74ACT374 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
4.5-V to 5.5-V VCC Operation
Inputs Accept Voltages to 5.5 V
Max tpd of 10 ns at 5 V
Inputs Are TTL-Voltage Compatible
OE
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
description/ordering information
These 8-bit flip-flops feature 3-state outputs
designed specifically for driving highly capacitive
or relatively low-impedance loads. The devices
are particularly suitable for implementing buffer
registers, I/O ports, bidirectional bus drivers, and
working registers.
The eight flip-flops of the ’ACT374 devices are
D-type edge-triggered flip-flops. On the positive
transition of the clock (CLK) input, the Q outputs
are set to the logic levels set up at the data (D)
inputs.
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
CLK
1D
1Q
OE
VCC
SN54ACT374 . . . FK PACKAGE
(TOP VIEW)
A buffered output-enable (OE) input can be used
to place the eight outputs in either a normal logic
state (high or low logic levels) or the
high-impedance state. In the high-impedance
state, the outputs neither load nor drive the bus
lines significantly. The high-impedance state and
the increased drive provide the capability to drive
bus lines in bus-organized systems without need
for interface or pullup components.
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
8D
7D
7Q
6Q
6D
4Q
GND
CLK
5Q
5D
2D
2Q
3Q
3D
4D
8Q
D
D
D
D
OE does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while
the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
PDIP – N
–55°C to 125°C
TOP-SIDE
MARKING
Tube
SN74ACT374N
Tube
SN74ACT374DW
Tape and reel
SN74ACT374DWR
SOP – NS
Tape and reel
SN74ACT374NSR
ACT374
SSOP – DB
Tape and reel
SN74ACT374DBR
AD374
TSSOP – PW
Tape and reel
SN74ACT374PWR
AD374
CDIP – J
Tube
SNJ54ACT374J
SNJ54ACT374J
CFP – W
Tube
SNJ54ACT374W
SNJ54ACT374W
LCCC – FK
Tube
SNJ54ACT374FK
SOIC – DW
–40°C
40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SN74ACT374N
ACT374
SNJ54ACT374FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54ACT374, SN74ACT374
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCAS539F – OCTOBER 1995 – REVISED NOVEMBER 2002
FUNCTION TABLE
(each flip-flop)
INPUTS
OE
CLK
D
OUTPUT
Q
L
↑
H
H
L
↑
L
L
L
H or L
X
Q0
H
X
X
Z
logic diagram (positive logic)
OE
CLK
1
11
C1
1D
3
2
1Q
1D
To Seven Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA
Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54ACT374, SN74ACT374
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCAS539F – OCTOBER 1995 – REVISED NOVEMBER 2002
recommended operating conditions (see Note 3)
SN54ACT374
MAX
MIN
MAX
4.5
5.5
4.5
5.5
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
0
VO
IOH
Output voltage
0
High-level output current
IOL
∆t/∆v
Low-level output current
High-level input voltage
SN74ACT374
MIN
2
2
V
V
0.8
Input transition rise or fall rate
UNIT
0.8
V
VCC
VCC
V
–24
–24
mA
24
24
mA
8
8
ns/V
VCC
VCC
0
0
V
TA
Operating free-air temperature
–55
125
–40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
4.5 V
IOH = –50
50 µA
VOH
IOH = –24
24 mA
IOH = –50 mA†
IOH = –75 mA†
MIN
TA = 25°C
TYP
MAX
SN54ACT374
MIN
MAX
MIN
4.49
4.4
5.5 V
5.4
5.49
5.4
5.4
4.5 V
3.86
3.7
3.76
5.5 V
4.86
4.7
4.76
MAX
UNIT
4.4
V
3.85
5.5 V
IOL = 24 mA
SN74ACT374
4.4
5.5 V
IOL = 50 µA
VOL
VCC
3.85
4.5 V
0.1
0.1
5.5 V
0.1
0.1
0.1
0.1
4.5 V
0.36
0.44
0.44
5.5 V
0.36
0.5
0.44
V
IOL = 50 mA†
IOL = 75 mA†
5.5 V
IOZ
II
VO = VCC or GND
VI = VCC or GND
5.5 V
±0.25
±5
±2.5
µA
5.5 V
±0.1
±1
±1
µA
ICC
VI = VCC or GND,
IO = 0
One input at 3.4 V,
Other inputs at GND or VCC
5.5 V
4
80
40
µA
1.6
1.5
mA
∆ICC‡
1.65
5.5 V
5.5 V
1.65
0.6
Ci
VI = VCC or GND
5V
4.5
† Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms.
‡ This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
pF
3
SN54ACT374, SN74ACT374
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCAS539F – OCTOBER 1995 – REVISED NOVEMBER 2002
timing requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
SN54ACT374
MIN
100
MAX
SN74ACT374
MIN
90
UNIT
fclock
tw
Clock frequency
Pulse duration, CLK high or low
5
5
5
ns
tsu
th
Setup time, data before CLK↑
5
5.5
5.5
ns
1.5
1.5
1.5
ns
Hold time, data after CLK↑
70
MAX
MHz
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
fmax
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
FROM
(INPUT)
TO
(OUTPUT)
CLK
Q
OE
Q
OE
Q
MIN
TA = 25°C
TYP
MAX
SN54ACT374
MIN
MAX
SN74ACT374
MIN
70
MAX
100
160
90
2
8.5
10
1.5
12
2
11.5
2
8
9.5
1.5
11.5
1.5
11
2
8
9.5
1.5
11.5
1.5
10.5
1.5
8
9
1.5
11.5
1.5
10.5
1.5
8.5
11.5
1.5
13
1
12.5
1.5
7
8.5
1.5
11
1
10
UNIT
MHz
ns
ns
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
4
TEST CONDITIONS
Power dissipation capacitance
CL = 50 pF,
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
f = 1 MHz
TYP
40
UNIT
pF
SN54ACT374, SN74ACT374
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCAS539F – OCTOBER 1995 – REVISED NOVEMBER 2002
PARAMETER MEASUREMENT INFORMATION
2 × VCC
S1
500 Ω
From Output
Under Test
CL = 50 pF
(see Note A)
Open
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
Open
3V
1.5 V
Timing Input
LOAD CIRCUIT
0V
th
tsu
3V
1.5 V
Data Input
tw
0V
3V
1.5 V
Input
1.5 V
VOLTAGE WAVEFORMS
1.5 V
0V
VOLTAGE WAVEFORMS
Output
Control
(low-level
enabling)
3V
1.5 V
1.5 V
0V
tPZL
3V
Input
1.5 V
1.5 V
0V
tPLH
Output
tPHL
50% VCC
VOH
50% VCC
VOL
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPLZ
≈VCC
50% VCC
tPZH
Output
Waveform 2
S1 at Open
(see Note B)
VOLTAGE WAVEFORMS
VOL + 0.3 V
VOL
tPHZ
50% VCC
VOH – 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-87631012A
ACTIVE
LCCC
FK
20
1
TBD
5962-8763101RA
ACTIVE
CDIP
J
20
1
TBD
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
5962-8763101SA
ACTIVE
CFP
W
20
1
TBD
Call TI
N / A for Pkg Type
5962-8763101VRA
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
5962-8763101VSA
ACTIVE
CFP
W
20
1
TBD
Call TI
N / A for Pkg Type
SN74ACT374DBLE
OBSOLETE
SSOP
DB
20
Call TI
Call TI
SN74ACT374DBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT374DBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT374DBRG4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT374DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT374DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT374DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT374DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT374DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT374DWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT374N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74ACT374NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74ACT374NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT374NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT374NSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT374PW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT374PWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT374PWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT374PWLE
OBSOLETE
TSSOP
PW
20
SN74ACT374PWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT374PWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT374PWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54ACT374FK
ACTIVE
LCCC
FK
20
TBD
TBD
1
Addendum-Page 1
TBD
Call TI
Call TI
POST-PLATE N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
Orderable Device
Status (1)
Package
Type
SNJ54ACT374J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54ACT374W
ACTIVE
CFP
W
20
1
TBD
Call TI
N / A for Pkg Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74ACT374DBR
SSOP
DB
20
2000
330.0
16.4
8.2
7.5
2.5
12.0
16.0
Q1
SN74ACT374DWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
SN74ACT374NSR
SO
NS
20
2000
330.0
24.4
8.2
13.0
2.5
12.0
24.0
Q1
SN74ACT374PWR
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74ACT374DBR
SN74ACT374DWR
SSOP
DB
20
2000
346.0
346.0
33.0
SOIC
DW
20
2000
346.0
346.0
41.0
SN74ACT374NSR
SO
NS
20
2000
346.0
346.0
41.0
SN74ACT374PWR
TSSOP
PW
20
2000
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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