FCI FTC131 1a 500v/600v bidirectional triac Datasheet

1A 500V/600V BIDIRECTIONAL TRIACS
Description:
Glasspassivated,sensitive gate triacs in a plastic
envelope,intended for use in general purpose bidirectional
switching and phase control applications.These devices are
intended to be interfaced directly to micro controllers,
logic integrated circuits and other low power gate trigger
circuits.
FTC131
500V/600 V
VDRM
I T(RMS) 1A
ITSM
16A
Pinging :TO-92: DESCRIPTION
Pin1: Main Terminal 2
Pin 2: G
Pin 3: Main Terminal 3
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL
PARAMETER
VDRM
Repetitive peak off-state
voltages
IT(RMS)
ITSM
RMS on-state current
Non-repetitive peak
on-state current
I2t
dIT/dt
IGM
VGM
PGM
PG(AV)
Tstg
Tj
I2t for fusing
Repetitive rate of rise of
on-state current after
triggering
CONDITIONS
MIN.
-
full sine wave; Tlead ≤51 ˚C
full sine wave; Tj = 25 ˚C prior to
surge
t = 20 ms
t = 16.7 ms
t = 10 ms
ITM = 1.5 A; IG = 0.2 A;
dIG/dt = 0.2 A/µs
T2+ G+
T2+ GT2- GT2- G+
MAX.
-500
500
UNIT
-600
600
V
-
1
A
-
16
17.6
1.28
A
A
A2s
-40
-
50
50
50
10
2
5
5
0.5
150
125
A/µs
A/µs
A/µs
A/µs
A
V
W
W
˚C
˚C
Peak gate current
Peak gate voltage
Peak gate power
Average gate power
over any 20 ms period
Storage temperature
Operating junction
temperature
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may
switch to the on-state. The rate of rise of current should not exceed 3 A/µs.
1A 500V/600V BIDIRECTIONAL TRIACS
THERMAL RESISTANCES
SYMBOL
PARAMETER
CONDITIONS
Rth j-lead
Thermal resistance
junction to lead
Thermal resistance
junction to ambient
full cycle
half cycle
pcb mounted;lead length = 4mm
Rth j-a
MIN.
TYP.
MAX.
UNIT
-
150
60
80
-
K/W
K/W
K/W
MIN.
TYP.
MAX.
UNIT
T2+ G+
T2+ GT2- GT2- G+
-
0.4
1.3
1.4
3.8
3
3
3
7
mA
mA
mA
mA
T2+ G+
T2+ GT2- GT2- G+
0.2
-
1.2
4.0
1.0
2.5
1.3
1.2
0.7
0.3
0.1
5
8
5
8
5
1.5
1.5
0.5
mA
mA
mA
mA
mA
V
V
V
mA
MIN.
TYP.
MAX.
UNIT
5
15
-
V/µs
-
2
-
µs
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL
PARAMETER
CONDITIONS
IGT
Gate trigger current
VD = 12 V; IT = 0.1 A
IL
Latching current
IH
VT
VGT
Holding current
On-state voltage
Gate trigger voltage
ID
Off-state leakage current
VD = 12 V; IGT = 0.1 A
VD = 12 V; IGT = 0.1 A
IT = 2.0 A
VD = 12 V; IT = 0.1 A
VD = 400 V; IT = 0.1 A; Tj = 125 ˚C
VD = VDRM(max); Tj = 125 ˚C
DYNAMIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL
PARAMETER
CONDITIONS
dVD/dt
Critical rate of rise of
off-state voltage
Gate controlled turn-on
time
VDM = 67% VDRM(max); Tj = 125 ˚C;
exponential waveform; RGK = 1 kΩ
ITM = 1.5 A; VD = VDRM(max); IG = 0.1 A;
dIG/dt = 5 A/µs
tgt
1A 500V/600V BIDIRECTIONAL TRIACS
1.4
BT132D
Ptot / W
Tmb(max) / C
=180
1.2
120
1
1
IT(RMS) / A
41
53
60
0.6
30
51 C
1
65
0.8
90
0.8
BT132D
1.2
77
0.6
89
0.4
0.4
101
0.2
113
00
0
0.2
0.4
0.6
IT(RMS) / A
0.8
125
1.2
1
3
100
150
BT132D
IT(RMS) / A
2.5
T
time
2.0
Tj initial = 25 C max
100
1.5
dI T/dt limit
1
T2- G+ quadrant
0.5
100us
1ms
T/s
10ms
100ms
Fig.2. Maximum permissible non-repetitive peak
on-state current ITSM, versus pulse width tp, for
sinusoidal currents, tp ≤ 20ms.
ITSM / A
50
ITSM
IT
20
0
Fig.4. Maximum permissible rms current IT(RMS) ,
versus lead temperature Tlead.
BT132D
ITSM / A
10
10us
0
-50
Tlead / C
Fig.1. Maximum on-state dissipation, Ptot, versus rms
on-state current, IT(RMS), where α = conduction angle.
1000
0.2
0
0.01
1.6
I TSM
T
15
10
Fig.5. Maximum permissible repetitive rms on-state
current IT(RMS), versus surge duration, for sinusoidal
currents, f = 50 Hz; Tlead ≤ 51˚C.
BT136
IT
0.1
1
surge duration / s
VGT(Tj)
VGT(25 C)
BT136
1.4
time
Tj initial = 25 C max
1.2
10
1
0.8
5
0.6
0
10
100
Number of cycles at 50Hz
1000
Fig.3. Maximum permissible non-repetitive peak
on-state current ITSM, versus number of cycles, for
sinusoidal currents, f = 50 Hz.
0.4
-50
0
50
Tj / C
100
150
Fig.6. Normalised gate trigger voltage
VGT(Tj)/ VGT(25˚C), versus junction temperature Tj.
1A 500V/600V BIDIRECTIONAL TRIACS
3
IGT(Tj)
IGT(25 C)
2
BT131
Tj = 125 C
Tj = 25 C
T2+ G+
T2+ GT2- GT2- G+
2.5
BT134W
IT / A
1.5
Vo = 1.0 V
Rs = 0.21 Ohms
2
typ
1
1.5
max
1
0.5
0.5
0
0
-50
0
50
Tj / C
100
150
Fig.7. Normalised gate trigger current
IGT(Tj)/ IGT(25˚C), versus junction temperature Tj.
3
IL(Tj)
IL(25 C)
0
2.5
1
VT / V
1.5
2
Fig.10. Typical and maximum on-state characteristic.
100
TRIAC
0.5
BT134W
Zth j-sp (K/W)
10
unidirectional
2
bidirectional
1
1.5
P
D
1
tp
0.1
0.5
t
0
-50
0
50
Tj / C
100
150
3
0.1ms
1ms
10ms
0.1s
1s
10s
tp / s
Fig.8. Normalised latching current IL(Tj)/ IL(25˚C),
versus junction temperature Tj.
IH(Tj)
IH(25C)
0.01
10us
Fig.11. Transient thermal impedance Zth j-lead, versus
pulse width tp.
1000
TRIAC
dVD/dt (V/us)
2.5
100
2
1.5
10
1
0.5
0
-50
0
50
Tj / C
100
150
Fig.9. Normalised holding current IH(Tj)/ IH(25˚C),
versus junction temperature Tj.
1
0
50
100
150
Tj / C
Fig.12. Typical, critical rate of rise of off-state voltage,
dVD/dt versus junction temperature Tj.
Similar pages