Diodes DMN2300UFL4 20v dual n-channel enhancement mode mosfet Datasheet

DMN2300UFL4
20V DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
BVDSS
Features and Benefits
ID max
TA = +25°C

Footprint of Just 1.3 mm2

Ultra Low Profile Package - 0.4mm Profile
(Note 6)

On Resistance <200mΩ
2.11A

Low Gate Threshold Voltage
260mΩ @ VGS = 2.5V
1.83A

Fast Switching Speed

Ultra-Small Surface Mount Package
380mΩ @ VGS = 1.8V
1.51A

ESD Protected Gate 2kV
520mΩ @ VGS = 1.5V
1.29A

Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)


Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Max RDS(ON)
195mΩ @ VGS = 4.5V
20V
Description and Applications
Mechanical Data
This MOSFET is designed to minimize the on-state resistance
(RDS(ON)) and yet maintain superior switching performance, making it

Case: X2-DFN1310-6

Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020

Terminals: Finish – NiPdAu Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208 e4
ideal for high efficiency power management applications.

Load Switch
D1
D2
G1
ESD PROTECTED TO 2kV
G2
Gate
Protection
Diode
S1
Gate
Protection
Diode
S2
Top View
Pin-Out
Device Symbol
Ordering Information (Note 4)
Part Number
DMN2300UFL4-7
Notes:
Marking
23N
Reel Size (inches)
7
Tape Width (mm)
8
Quantity Per Reel
3000
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green" products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.
Marking Information
23N
DMN2300UFL4
Datasheet Number: DS35946 Rev. 3 - 2
23N = Product Type Marking Code
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DMN2300UFL4
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Steady
State
Continuous Drain Current (Note 6)
TA = +25°C
TA = +85°C
Value
20
±8
2.11
1.19
6.0
Unit
V
V
Value
0.53
1.39
238
90
-55 to +150
Unit
ID
Pulsed Drain Current (Note 7)
IDM
A
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
(Note 5)
(Note 6)
(Note 5)
(Note 6)
Power Dissipation
Thermal Resistance, Junction to Ambient
PD
RθJA
Operating and Storage Temperature Range
Notes:
TJ, TSTG
W
°C/W
°C
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. Device mounted on minimum recommended pad layout test board, 10µs pulse duty cycle = 1%.
P(PK), PEAK TRANSIENT POIWER (W)
100
90
Single Pulse
RJA = 230C/W
RJA(t) = r(t) * RJA
TJ - TA = P * R JA(t)
80
70
60
50
40
30
20
10
0
0.0001 0.001
0.01
0.1
1
10
100
t1, PULSE DURATION TIME (sec)
Fig. 1 Single Pulse Maximum Power Dissipation
1
r(t), TRANSIENT THERMAL RESISTANCE
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.9
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
RRθJA
r(t)* *RR
(t) == r(t)
JA(t)
JA
θJA
=
230℃/W
RRθJA
=
230癈
/W
JA
Duty Cycle,
Cycle, DD==t1t1/
/ t2t2
Duty
D = 0.005
Single Pulse
0.001
0.00001
0.0001
DMN2300UFL4
Datasheet Number: DS35946 Rev. 3 - 2
0.001
0.01
0.1
1
t1,t1,
PULSE
TIMES
(sec)
PULSEDURATION
DURATION TIME
(sec)
Fig.
2 2Transient
ThermalResistance
Resistance
Fig.
Transient Thermal
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10
100
1,000
December 2017
© Diodes Incorporated
DMN2300UFL4
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = +25°C
Gate-Source Leakage
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
20
—
—
—
—
—
—
1
10
V
µA
µA
VGS = 0V, ID = 10μA
VDS = 20V, VGS = 0V
VGS = ±8V, VDS = 0V
VGS(TH)
RDS(ON)
|Yfs|
VSD
—
151
190
247
316
—
0.7
0.95
195
260
380
520
—
1.2
V
Static Drain-Source On-Resistance
0.45
—
—
—
—
40
—
VDS = VGS, ID = 250μA
VGS = 4.5V, ID = 300mA
VGS = 2.5V, ID = 250mA
VGS = 1.8V, ID = 100mA
VGS = 1.5V, ID = 50mA
VDS = 3V, ID = 30mA
VGS = 0V, IS = 300mA
Ciss
Coss
Crss
Rg
Qg
Qgs
Qgd
tD(ON)
tR
tD(OFF)
tF
—
—
—
—
—
—
—
—
—
—
—
64.3
6.1
4.5
70
1.6
0.2
0.2
3.5
2.8
38
13
128.6
12.2
9.0
140
3.2
0.4
0.4
10
10
60
25
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Note:
mΩ
mS
V
pF
pF
pF

nC
nC
nC
ns
ns
ns
ns
Test Condition
VDS = 25V, VGS = 0V,
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1MHz
VGS = 4.5V, VDS = 15V,
ID = 1A
VDS = 10V, ID = 1A
VGS = 10V, RG = 6Ω
8. Short duration pulse test used to minimize self-heating effect.
2.0
2.0
VGS = 4.5V
VDS = 5V
VGS = 2.5V
)A
(
T
N
E
R
R
U
C
N
IA
R
D
,D
I
VGS = 1.8V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VGS = 2.0V
1.5
VGS = 1.5V
1.0
0.5
1.5
1.0
0.5
TA = 150°C
TA = 125°C
VGS = 1.2V
TA = 85°C
TA = 25°C
TA = -55°C
0
0
1
2
3
4
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 3 Typical Output Characteristic
DMN2300UFL4
Datasheet Number: DS35946 Rev. 3 - 2
5
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0
0
0.5
1
1.5
2
2.5
VGS , GATE-SOURCE VOLTAGE (V)
Fig. 4 Typical Transfer Characteristic
3
December 2017
© Diodes Incorporated
0.4
)

(
E
C
N
A
T
S
IS
E
R
-N
O
E
C
R
U
O
S
-N
I
A
R
D
,N
)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
DMN2300UFL4
0.3
0.2
VGS = 2.5V
VGS = 4.5V
0.1
0
R
0
0.4
0.8
1.2
1.6
ID, DRAIN-SOURCE CURRENT (A)
Fig. 5 Typical On-Resistance
vs. Drain Current and Gate Voltage
2
VGS = 2.5V
ID = 500mA
1.2
1.0
0.8
0.4
TA = 125°C
-25
0.2
TA = 85°C
TA = 25°C
TA = -55°C
0
0.25
0.5 0.75 1
1.25 1.5 1.75
ID, DRAIN CURRENT (A)
Fig. 6 Typical On-Resistance
vs. Drain Current and Temperature
2
0.8
0.6
0.4
VGS = 2.5V
ID = 500mA
0.2
VGS = 4.5V
ID = 1.0A
0
-50
2.0
1.2
1.0
IS, SOURCE CURRENT (A)
1.6
ID = 1mA
0.8
0.6
TA = 150°C
-25
0
25
50
75 100 125 150
C))
TA, AMBIENT TEMPERATURE (°
(癈
Fig. 8 On-Resistance Variation with Temperature
0
25
50
75 100 125 150
C))
TA, AMBIENT TEMPERATURE (°
(癈
Fig. 7 On-Resistance Variation with Temperature
VGS(TH), GATE THRESHOLD VOLTAGE (V)
0.6
0
RDSON, DRAIN-SOURCE ON-RESISTANCE ()
RDSON, DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
VGS = 4.5V
ID = 1.0A
1.4
0.6
-50
T
(S
G
VGS = 4.5V
O
(
S
D
1.6
)V
(
E
G
A
T
L
O
V
D
L
O
H
S
E
R
H
T
E
T
A
G
, )H
0.8
ID = 250µA
0.4
1.2
= 25癈
TA =TA25°
C
0.8
0.4
0.2
V
0
-50 -25
0
25
50
75 100 125 150
TA , AMBIENT TEMPERATURE (°C)
Fig. 9 Gate Threshold Variation vs. Ambient Temperature
DMN2300UFL4
Datasheet Number: DS35946 Rev. 3 - 2
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0
0
0.2
0.4
0.6
0.8
1.0
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Fig. 10 Diode Forward Voltage vs. Current
December 2017
© Diodes Incorporated
DMN2300UFL4
1,000
100,000
TA = 125°C
I
TA = 85°C
TA = 25°C
S
D
1
)A 10,000
n
(
T
N
E
R
1,000
R
U
C
E
G
A
100
K
A
E
L
,S
S
G
10
I
IGSS, LEAKAGE CURRENT (nA)
IDSS, LEAKAGE CURRENT (nA)
)A
n
(
T
N
E 100
R
R
U
C
E
G
A
K
A
E
10
L
,S
TA = -55°C
1
2
4
6
8 10 12 14 16 18
VDS , DRAIN-SOURCE VOLTAGE (V)
Fig. 11 Typical Leakage Current
vs. Drain-Source Voltage
20
TA = 150°C
TA = 125°C
TA = 85°C
TA = 25°C
TA = -55°C
2
4
6
8
10
12
VGS , GATE-SOURCE VOLTAGE (V)
Fig.12 Leakage Current vs. Gate-Source Voltage
VGS, GATE-SOURCE VOLTAGE (V)
8
VDS = 15V
ID = 1A
6
4
2
0
0
0.5
1
1.5
2
2.5
Qg, TOTAL GATE CHARGE (nC)
Fig. 13 Gate-Charge Characteristics
DMN2300UFL4
Datasheet Number: DS35946 Rev. 3 - 2
3
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DMN2300UFL4
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
X2-DFN1310-6
A
A3
A1
Seating Plane
D
D2
z
R0.
f
f
b
150
E2
E(Pin #1 ID)
d
L
d
f
f
z
e
X2-DFN1310-6
Dim Min
Max
Typ
A
0.40
A1
0
0.05 0.02
A3
0.13
b
0.10 0.20 0.15
D
1.25 1.38 1.30
d
0.25
D2
0.30 0.50 0.40
E
0.95 1.075 1.00
e
0.35
E2
0.30 0.50 0.40
f
0.10
L
0.20 0.30 0.25
Z
0.05
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
X2-DFN1310-6
G2
X2
Dimensions
G1
G2
G3
X1
X2
Y1
Y2
a
b
Y2
G1
b
Y1
G3
DMN2300UFL4
Datasheet Number: DS35946 Rev. 3 - 2
a
X1
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Value (in mm)
0.16
0.17
0.15
0.52
0.20
0.52
0.375
0.09
0.06
December 2017
© Diodes Incorporated
DMN2300UFL4
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
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final and determinative format released by Diodes Incorporated.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
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labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
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Copyright © 2017, Diodes Incorporated
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DMN2300UFL4
Datasheet Number: DS35946 Rev. 3 - 2
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