Diodes DMTH6010LK3Q-13 60v 175c n-channel enhancement mode mosfet Datasheet

DMTH6010LK3Q
Green
60V 175°C N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
INFORMATION
ADVANCED
NEW PRODUCT
BVDSS
Features

ID Max
RDS(ON) Max
TC = +25°C
8mΩ @ VGS = 10V
70A
12mΩ @ VGS = 4.5V
50A

60V






Description and Applications
This MOSFET is designed to meet the stringent requirements of
Automotive applications. It is qualified to AEC-Q101, supported by a
PPAP and is ideal for use in:



Engine Management Systems
Body Control Electronics
DCDC Converters
Rated to 175°C – ideal for high ambient temperature
environments
100% Unclamped Inductive Switching – ensures more reliable
and robust end application
Low On-Resistance
Low Input Capacitance
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
PPAP Capable (Note 4)
Mechanical Data

Case: TO252

Case Material: Molded Plastic, “Green” Molding Compound.

UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020

Terminal Finish - Matte Tin Annealed over Copper Leadframe;
Solderable per MIL-STD-202, Method 208
Weight: 0.33 grams (Approximate)

TO252
Top View
Pin Out Top View
Equivalent Circuit
Ordering Information (Note 5)
Part Number
DMTH6010LK3Q-13
Notes:
Case
TO252
Packaging
2,500/Tape & Reel
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. For more information, please refer to
http://www.diodes.com/product_compliance_definitions.html.
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
H6010L
YYWW
DMTH6010LK3Q
Document number: DS38162 Rev. 2 - 2
= Manufacturer’s Marking
H6010L = Product Type Marking Code
YYWW = Date Code Marking
YY = Last Two Digits of Year (ex: 15 = 2015)
WW = Week Code (01 to 53)
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DMTH6010LK3Q
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
TA = +25C
TA = +70C
TC = +25C
TC = +100C
INFORMATION
ADVANCED
NEW PRODUCT
Continuous Drain Current, VGS = 10V (Note 6)
Continuous Drain Current, VGS = 10V (Note 7)
Value
60
±20
14.8
11.9
ID
A
IS
IDM
IAS
EAS
70
50
60
130
20
20
A
A
A
mJ
Symbol
PD
RθJA
PD
RθJC
TJ, TSTG
Value
31
47
60
2.5
-55 to +175
Unit
W
°C/W
W
°C/W
°C
ID
Maximum Continuous Body Diode Forward Current (Note 7)
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)
Avalanche Current, L = 0.1mH
Avalanche Energy, L = 0.1mH
Unit
V
V
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Total Power Dissipation (Note 7)
Thermal Resistance, Junction to Case (Note 7)
Operating and Storage Temperature Range
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
60
-
-
1
V
μA
-
-
100
μA
Zero Gate Voltage Drain Current (Note 9)
IDSS
Gate-Source Leakage
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
IGSS
-
-
±100
nA
VGS(TH)
RDS(ON)
VSD
6.3
8.3
0.9
3
8
12
1.2
V
Static Drain-Source On-Resistance
1
-
Ciss
Coss
Crss
Rg
Qg
Qg
Qgs
Qgd
tD(ON)
tR
tD(OFF)
tF
tRR
QRR
0.1
-
2090
746
38.5
0.59
19.3
41.3
6
8.8
5.7
4.3
23.4
9.7
35.4
38.2
1.8
-
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = 4.5V)
Total Gate Charge (VGS = 10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Notes:
mΩ
V
Test Condition
VGS = 0V, ID = 1mA
VDS = 48V, VGS = 0V
VDS = 48V, VGS = 0V,
TJ = 125°C
VGS = ±20V, VDS = 0V
VDS = VGS, ID = 250μA
VGS = 10V, ID = 20A
VGS = 4.5V, ID = 20A
VGS = 0V, IS = 20A
pF
VDS = 30V, VGS = 0V,
f = 1MHz
Ω
VDS = 0V, VGS = 0V, f = 1MHz
nC
VDS = 30V, ID = 20A
ns
VDD = 30V, VGS = 10V,
ID = 20A, Rg = 3Ω
ns
nC
IF = 20A, di/dt = 100A/μs
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. Thermal resistance from junction to soldering point (on the exposed drain pad).
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.
DMTH6010LK3Q
Document number: DS38162 Rev. 2 - 2
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DMTH6010LK3Q
30.0
30
VGS=3.5V
VDS= 5V
25
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VGS=3.0V
VGS=4.0V
VGS=4.5V
20.0
15.0
VGS=10V
10.0
VGS=2.5V
5.0
20
15
125℃
10
0
1
2
3
4
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1. Typical Output Characteristic
85℃
150℃
25℃
5
175℃
VGS=2.2V
0.0
-55℃
0
5
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
VGS, GATE-SOURCE VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
Figure 2. Typical Transfer Characteristic
0.01
0.009
VGS=4.5V
0.008
0.007
VGS=10V
0.006
0.005
0.004
0
4
6
8
10 12 14 16 18
ID, DRAIN-SOURCE CURRENT (A)
Figure 3. Typical On-Resistance vs. Drain Current and
Gate Voltage
2
0.02
2
1.6
1.2
VGS=10V, ID=10A
0.8
VGS=5V, ID=5A
0.4
VGS= 4.5V
0.018
150℃
0.016
125℃
175℃
0.014
0.012
85℃
0.01
25℃
0.008
-55℃
0.006
0.004
0.002
0
20
0
10
15
20
25
30
ID, DRAIN CURRENT (A)
Figure 4. Typical On-Resistance vs. Drain Current and
Temperature
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
INFORMATION
ADVANCED
NEW PRODUCT
25.0
5
0.02
0.018
0.016
0.014
0.012
VGS=5V, ID=5A
0.01
0.008
0.006
VGS=10V, ID=10A
0.004
0.002
0
-50
-25
0
25
50
75
100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 5. On-Resistance Variation with Temperature
DMTH6010LK3Q
Document number: DS38162 Rev. 2 - 2
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-50
-25
0
25 50 75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 6. On-Resistance Variation with Temperature
December 2015
© Diodes Incorporated
DMTH6010LK3Q
30
1.8
1.6
IS, SOURCE CURRENT (A)
INFORMATION
ADVANCED
NEW PRODUCT
VGS(TH), GATE THRESHOLD VOLTAGE (V)
2
ID=1mA
1.4
1.2
1
ID=250μA
0.8
0.6
25
VGS=0V, TJ=125℃
20
VGS=0V, TJ=150℃
15
VGS=0V, TJ=175℃
VGS=0V, TJ=85℃
10
VGS=0V, TJ=25℃
5
0.4
VGS=0V, TJ=-55℃
0.2
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 7. Gate Threshold Variation vs. junction
Temperature
175
0
10000
1.5
10
f=1MHz
9
Ciss
8
Coss
1000
7
VDS=30V, ID=20A
6
VGS (V)
CT, JUNCTION CAPACITANCE (pF)
0.3
0.6
0.9
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 8. Diode Forward Voltage vs. Current
100
Crss
5
4
3
10
2
1
0
1
0
10
20
30
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 9. Typical Junction Capacitance
40
0
5
10
15
20
25
30
35
Qg, TOTAL GATE CHARGE (nC)
Figure 10. Gate Charge
40
45
1000
ID, DRAIN CURRENT (A)
RDS(ON) Limited
PW =10µs
PW =100µs PW =1µs
100
10
1
0.1
PW =1ms
TJ(Max) = 175℃
TC = 25℃
Single Pulse
DUT on infinite heatsink
VGS= 10V
PW =10ms
PW =100ms
PW =1s
0.01
0.1
1
10
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 11. SOA, Safe Operation Area
DMTH6010LK3Q
Document number: DS38162 Rev. 2 - 2
100
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DMTH6010LK3Q
D=0.7
D=0.5
r(t), TRANSIENT THERMAL RESISTANCE
INFORMATION
ADVANCED
NEW PRODUCT
1
D=0.9
D=0.3
0.1
D=0.1
D=0.05
0.01
D=0.02
D=0.01
RθJC(t) = r(t) * RθJC
RθJC = 2.48℃/W
Duty Cycle, D = t1 / t2
D=0.005
D=Single Pulse
0.001
1E-06
DMTH6010LK3Q
Document number: DS38162 Rev. 2 - 2
1E-05
0.0001
0.001
0.01
0.1
t1, PULSE DURATION TIME (sec)
Figure 12 .Transient Thermal Resistance
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1
10
December 2015
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DMTH6010LK3Q
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
TO252 (DPAK)
E
A
INFORMATION
ADVANCED
NEW PRODUCT
b3
7° ± 1°
c
L3
D
A2
L4
e
H
b(3x)
b2(2x)
Gauge Plane
0.508
D1
E1
Seating Plane
a
L
A1
2.74REF
TO252 (DPAK)
Dim Min Max Typ
A 2.19 2.39 2.29
A1 0.00 0.13 0.08
A2 0.97 1.17 1.07
b 0.64 0.88 0.783
b2 0.76 1.14 0.95
b3 5.21 5.46 5.33
c
0.45 0.58 0.531
D 6.00 6.20 6.10
D1 5.21
e
2.286
E 6.45 6.70 6.58
E1 4.32
H 9.40 10.41 9.91
L 1.40 1.78 1.59
L3 0.88 1.27 1.08
L4 0.64 1.02 0.83
a
0°
10°
All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
TO252 (DPAK)
X1
Y1
Dimensions
C
X
X1
Y
Y1
Y2
Y2
C
Value (in mm)
4.572
1.060
5.632
2.600
5.700
10.700
Y
X
DMTH6010LK3Q
Document number: DS38162 Rev. 2 - 2
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DMTH6010LK3Q
IMPORTANT NOTICE
INFORMATION
ADVANCED
NEW PRODUCT
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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final and determinative format released by Diodes Incorporated.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
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Document number: DS38162 Rev. 2 - 2
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