1 of 3 Creation Date : June 26, 2017 (GMT) Multilayer Ceramic Chip Capacitors CGA3E3X7R1V224K080AB TDK item description CGA3E3X7R1V224KT**** Applications Feature Automotive Grade General General (Up to 50V) AEC-Q200 AEC-Q200 Series CGA3(1608) [EIA 0603] Status Production Size Length(L) 1.60mm ±0.10mm Width(W) 0.80mm ±0.10mm Thickness(T) 0.80mm ±0.10mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 0.30mm Min. 0.70mm to 1.00mm(Flow Soldering) Recommended Land Pattern (PA) 0.60mm to 0.80mm(Reflow Soldering) 0.80mm to 1.00mm(Flow Soldering) Recommended Land Pattern (PB) 0.60mm to 0.80mm(Reflow Soldering) 0.60mm to 0.80mm(Flow Soldering) Recommended Land Pattern (PC) 0.60mm to 0.80mm(Reflow Soldering) Electrical Characteristics Capacitance 220nF ±10% Rated Voltage 35VDC Temperature Characteristic X7R(±15%) Dissipation Factor (Max.) 5% Insulation Resistance (Min.) 2272MΩ Other Soldering Method Wave (Flow) Reflow AEC-Q200 Yes Packing Punched (Paper)Taping [180mm Reel] Package Quantity 4000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : June 26, 2017 (GMT) Multilayer Ceramic Chip Capacitors CGA3E3X7R1V224K080AB Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance CGA3E3X7R1V224K080AB ESR CGA3E3X7R1V224K080AB Capacitance CGA3E3X7R1V224K080AB CGA3E3X7R1V224K080AB Temperature Characteristic CGA3E3X7R1V224K080AB(No Bias) DC Bias Characteristic CGA3E3X7R1V224K080AB(DC Bias = 17.5V ) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Ripple Temperature Rising CGA3E3X7R1V224K080AB(100kHz) CGA3E3X7R1V224K080AB(500kHz) CGA3E3X7R1V224K080AB(1MHz) Multilayer Ceramic Chip Capacitors CGA3E3X7R1V224K080AB Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : June 26, 2017 (GMT)