ESDALC12-1T2 Single line transient surge voltage suppressor (TVS) for data and power line Datasheet − production data Features ■ Stand-off voltage 10 V ■ Unidirectional device ■ Low clamping factor VCL/VBR ■ Breakdown voltage VBR = 12 V min. ■ Fast response time ■ Very thin package: 0.4 mm ■ Low leakage current ■ RoHS compliant SOD882T Benefits ■ High ESD robustness of the application ■ Suitable for high density boards Figure 1. Functional diagram Complies with the following standards: ■ IEC 61000-4-2 level 4: – 15 kV (air discharge) – 8 kV (contact discharge) ■ MIL STD 883G - Method 3015-7: class 3B I/O1 GND GND 3 Applications Where transient overvoltage protection and electrical overstress protection in sensitive equipment are required, such as: ■ Computers ■ Printers ■ Communication systems ■ Cellular phone handsets and accessories ■ Video equipment Description The ESDALC12-1T2 is a unidirectional single line Transil™ diode designed specially for protection of integrated circuits in portable equipment and miniaturized electronic devices subjected to ESD and EOS transient over voltages. Packed in SOD882T, it minimizes PCB occupation. TM: Transil is a trademark of STMicroelectronics June 2012 This is information on a product in full production. Doc ID 15025 Rev 3 1/11 www.st.com 11 Characteristics ESDALC12-1T2 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter VPP Peak pulse voltage - IEC 61000-4-2 Air discharge Contact discharge PPP Peak pulse power dissipation (8/20 µs) (1) Value Unit 25 20 kV 50 W 2 A Tj initial = Tamb (1) IPP Peak pulse current (8/20 µs) Tj Operating junction temperature range - 40 to + 125 °C Storage temperature range - 55 to +150 °C Tstg 1. For a surge greater than the maximum values, the diode will fail in short-circuit Figure 2. Electrical characteristics (definitions) Symbol VBR IRM VRM VCL Rd IPP IR αT VF Table 2. = = = = = = = = = Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Breakdown current Voltage temperature coefficient Forward voltage drop 2/11 IF VCL VBR VF VRM V IRM Slope = 1/Rd IPP Electrical characteristics (Tamb = 25 °C) Symbol Test conditions VBR IR = 1 mA IRM VRM = 10 V Rd 1 A to 3 A, 8/20 µs VCL IPP = 1 A, 8/20µs C I Min. Typ. 12 Max. Unit 14 V 200 nA Ω 1.9 VR = 0 V DC, F = 1 MHz, VOSC = 30 mVRMS Doc ID 15025 Rev 3 15 20 V 18 pF ESDALC12-1T2 Figure 3. 100 Characteristics Peak pulse power dissipation versus initial junction temperature PPP(W) Figure 4. Peak pulse power versus exponential pulse duration PPP(W) 1000 8/20 µs Tj initial = 25 °C 90 Tj = 125 °C 80 70 100 60 50 40 10 30 20 10 Tj(°C) 0 0 25 Figure 5. 10.0 50 75 100 125 150 TP(µs) 1 175 Clamping voltage versus peak pulse current (maximum values) 1 10 Figure 6. IPP(A) 10.00 100 1000 Forward voltage drop versus peak forward current (typical values) IFM(A) Tj = 25 °C 8/20 µs Tj initial = 25 °C 1.00 1.0 0.10 0.01 VCL(V) 0.1 12 Figure 7. 16 14 16 18 20 22 24 26 28 0.00 0.0 Figure 8. Junction capacitance versus reverse applied voltage (typical values) C(pF) 10.00 VFM(V) 0.5 1.0 12 2.0 2.5 3.0 Leakage current versus junction temperature (typical values) IR(nA) VR = VRM = 10 V F = 1 Mhz VOSC = 30 mVRMS Vr = 0 V Tj = 25 °C 14 1.5 1.00 10 8 6 0.10 4 2 VR(V) 0 0 1 2 3 4 Tj(°C) 0.01 5 25 Doc ID 15025 Rev 3 50 75 100 125 3/11 Characteristics Figure 9. ESDALC12-1T2 ESD response to IEC 61000-4-2 (+15 kV air discharge) on each channel Figure 10. ESD response to IEC 61000-4-2 (-15 kV air discharge) on each channel 5 V/div 10 V/div 100 ns/div 100 ns/div Figure 11. S21 attenuation measurement 0.00 dB -5.00 -10.00 -15.00 -20.00 -25.00 F (Hz) -30.00 300.0k 4/11 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G Doc ID 15025 Rev 3 3.0G ESDALC12-1T2 2 Ordering information scheme Ordering information scheme Figure 12. Ordering information scheme ESDA LC 12 - 1 T2 ESD array Low capacitance Breakdown voltage 12 = 12 Volt min. Number of lines Package T2 = SOD882T Doc ID 15025 Rev 3 5/11 Package information 3 ESDALC12-1T2 Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 13. SOD882 dimension definitions L1 L2 b1 b2 PIN # 1 ID e A A1 E D Table 3. SOD882 dimension values Dimensions Ref. 6/11 Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.40 0.47 0.50 0.016 0.019 0.020 A1 0.00 0.05 0.000 b1 0.45 0.50 0.55 0.018 0.020 0.022 b2 0.45 0.50 0.55 0.018 0.020 0.022 D 0.55 0.60 0.65 0.022 0.024 0.026 E 0.95 1.00 1.05 0.037 0.039 0.041 e 0.60 0.65 0.70 0.024 0.026 0.028 L1 0.20 0.25 0.30 0.008 0.010 0.012 L2 0.20 0.25 0.30 0.008 0.010 0.012 Doc ID 15025 Rev 3 0.002 ESDALC12-1T2 Package information Figure 14. Footprint (dimensions in mm) Figure 15. Marking 0.55 (0.022) 0.55 (0.022) 0.50 0.020 Pin1 0.40 (0.016) Note: I VN Pin2 2 Pin Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Figure 16. Tape and reel specifications Cathode bar Ø 1.55 2.0 4.0 1.75 0.20 3.5 1.10 8.0 N N N 0.68 N N All dimensions in mm N N 0.6 2.0 User direction of unreeling Doc ID 15025 Rev 3 7/11 Recommendation on PCB assembly ESDALC12-1T2 4 Recommendation on PCB assembly 4.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 17. Stencil opening dimensions L T b) W General design rule Stencil thickness (T) = 75 ~ 125 µm W Aspect Ratio = ----- ≥ 1.5 T L×W Aspect Area = ---------------------------- ≥ 0.66 2T ( L + W ) 2. Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for leads: Opening to footprint ratio - between 60% and 65%. Figure 18. Recommended stencil windows position Package footprint Lead footprint on PCB Stencil window position 0.055 mm 0.39 mm Lead footprint on PCB Stencil window position 0.45 mm 0.05 mm 4.2 8/11 0.05 mm Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed 4. Solder paste with fine particles: powder particle size is 20-45 µm. Doc ID 15025 Rev 3 ESDALC12-1T2 4.3 4.4 4.5 Recommendation on PCB assembly Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Reflow profile Figure 19. ST ECOPACK® recommended soldering reflow profile for PCB mounting 240-245 °C Temperature (°C) 250 -2 °C/s to -3 °C/s -6 °C/s max 2 - 3 °C/s 60 sec (90 max) 200 150 100 0.9 °C/s 50 Time (s) 0 Note: 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Doc ID 15025 Rev 3 9/11 Ordering information 5 ESDALC12-1T2 Ordering information Table 4. Ordering information Order code Marking Package Weight Base qty Delivery mode ESDALC12-1T2 V(1) SOD882T 0.76 mg 12000 Tape and reel 1. The marking can be rotated by multiples of 90° to differentiate assembly location 6 Revision history Table 5. 10/11 Document revision history Date Revision Changes 16-Sep-2008 1 Initial release 02-Nov-2010 2 Updated Table 1, base quantity change onTable 4 and updated graphics. 13-Jun-2012 3 Added Figure 13, updated Table 3 and added note after Figure 15. 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