TI OPA2340-DIE Single-supply, rail-to-rail operational amplifier microamplifier Datasheet

OPA2340-DIE
www.ti.com
SBOS691A – JUNE 2013 – REVISED SEPTEMBER 2013
SINGLE-SUPPLY, RAIL-TO-RAIL OPERATIONAL AMPLIFIER
MicroAmplifier ™
Check for Samples: OPA2340-DIE
FEATURES
1
•
•
•
•
•
•
•
23
APPLICATIONS
Rail-to-Rail Input
Rail-to-Rail Output
Wide Bandwidth
High Slew Rate
Low THD+Noise
Low Quiescent Current
Single, Dual, and Quad Versions
•
•
•
•
•
•
•
•
Driving A/D Converters
PCMCIA Cards
Data Acquisition
Process Control
Audio Processing
Communications
Active Filters
Test Equipment
DESCRIPTION
The OPA2340-DIE rail-to-rail CMOS operational amplifier is optimized for low-voltage, single-supply operation.
Rail-to-rail input/output and high-speed operation make them ideal for driving sampling analog-to-digital (A/D)
converters. The OPA2340-DIE is also well-suited for general purpose and audio applications as well as providing
I/V conversion at the output of digital-to-analog (D/A) converters. Single, dual, and quad versions have identical
specifications for design flexibility.
The OPA2340-DIE operates on a single supply. Dual and quad designs feature completely independent circuitry
for lowest crosstalk and freedom from interaction.
ORDERING INFORMATION (1)
(1)
(2)
PRODUCT
PACKAGE
DESIGNATOR
PACKAGE
OPA2340
TD
Bare die in waffle pack (2)
ORDERABLE PART NUMBER
PACKAGE QUANTITY
OPA2340TDF1
100
OPA2340TDF2
10
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MicroAmplifier is a trademark of Texas Instruments, Inc.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
OPA2340-DIE
SBOS691A – JUNE 2013 – REVISED SEPTEMBER 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
2
DIE THICKNESS
BACKSIDE FINISH
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
10.5 mils.
Silicon with backgrind
Floating
AlSiCu
800 nm
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Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: OPA2340-DIE
OPA2340-DIE
www.ti.com
SBOS691A – JUNE 2013 – REVISED SEPTEMBER 2013
Table 1. Bond Pad Coordinates in Microns
DESCRIPTION
PAD NUMBER
X MIN
Y MIN
X MAX
Y MAX
Out A
1
5
1010.65
107
1112.65
N/C
2
5
778.4
107
880.4
-In A
3
5
548.5
107
650.5
+In A
4
5
250.6
107
352.6
V-
5
611
5
713
107
+In B
6
1217
250.6
1319
352.6
-In B
7
1217
548.5
1319
650.5
N/C
8
1217
778.4
1319
880.4
Out B
9
1217
1010.65
1319
1112.65
V+
10
611
1208.9
713
1310.9
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: OPA2340-DIE
3
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
OPA2340TDF1
ACTIVE
0
100
TBD
Call TI
N / A for Pkg Type
OPA2340TDF2
ACTIVE
0
10
TBD
Call TI
N / A for Pkg Type
(4/5)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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