Panasonic EFOS1695E3SM Ceramic res o na tors, chip type (3 array type) rohs compliant Datasheet

Ceramic Resonators, Chip Type
Ceramic Resonators, Chip Type
(3 Array Type)
Type: EFOS
Type: EFOB
Type: EFOSS
Type: EFOSM
Type: EFOBM
Type: EFOJM
■ Recommended Applications
■ Features
● Clock generator for microprocessors
● Carrier circuit between telecommunication equipment
(Telephone to telephone, personal computer to printer)
● Encased in a ceramic package
● High reliability against soldering heat and mechanical
stress
● Moisture-proof sealing
● 1.2 mm maximum (SS/SM/BM/JM),
● Designed for reflow soldering
● Flat-bottom plate for better mountings
● Simplifies oscillation circuits by reducing the number
of circuit parts
● RoHS compliant
■ Handling Precautions (See Page 175 to 176)
■ Packaging Specifications
See Page 169 to 177
■ Explanation of Part Numbers
1
2
3
E
F
O
4
5
6
7
8
3
5
8
4
9
10
11
12
Design No.
Product Code
Ceramic
EFO
Resonators
Type
Built-In Capacitors
Type with 3-terminals
2 to 13 MHz
S
13.1 to 20 MHz
B
1
2
3
E
F
O
4
5
Nominal Oscillation
Frequency
3584
3.58 MHz
1695 16.93 MHz
(Example)
Frequency
Tolerance
±1.0 %
0
±0.3 %
3
±0.5 %
5
Packaging Style
B Bulk Pack
Embossed
E
Taping
6
7
8
9
4
0
0
4
10
11
12
Design No.
Product Code
Ceramic
EFO
Resonators
Part Number
EFOS
EFOB
EFOSS
EFOSM
EFOBM
EFOJM
Type
Built-In Capacitors
Type with 3-terminals
4 to 13 MHz
SS
4 to 13 MHz
SM
12 to 20 MHz
BM
16 to 20 MHz
JM
30 to 50 MHz
Frequency range
(MHz)
2.00 to 8.39
8.40 to 13.0
13.1 to 20.0
4.00 to 8.39
8.40 to 13.0
4.00 to 8.39
8.40 to 13.0
12.0 to 20.0
16.0 to 20.0
30.0 to 50.0
Nominal Oscillation
Frequency
4004
4.00 MHz
1695 16.93 MHz
2005 20.00 MHz
4005 40.00 MHz
Packaging Style
B Bulk Pack
Embossed
E
Taping
Frequency
Tolerance
±1.0 %
0
±0.3 %
3
±0.5 %
5
(Example)
Frequency Temperature Characteristics
(–20 to +80 °C)
±0.2 %
±1.0 %
±0.5 %
±0.2 %
±0.3 %
±0.2 %
±1.0 %
±0.3 %
±0.5 %
±0.2 %
Built-in Capacitors
(Reference)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– EC166 –
33 pF
33 pF
21 pF
33 pF
18 pF
10 pF
01 Feb. 2009
Ceramic Resonators, Chip Type
■ Dimensions in mm (not to scale)
Recommended Land Dimensions
[Type EFOS, EFOSM]
[Type EFOS]·····2.0 to 13.0 MHz
Oscillating Frequency
Serial No.
1.60±0.20
2.5
(2.70)
4.2
(7.30)
Terminal
Electrodes
2.5
7.80 +0.50
–0.20
6-(1.30)
3.20 +0.30
–0.20
3-0.9 to 1.2
6–R(0.20)
6-(1.00)
2.50±0.20
2.50±0.20
[Type EFOSM]·····4.0 to 13.0 MHz
Oscillating Frequency
1.20 max.
Serial No.
(7.30)
Terminal
Electrodes
(2.70)
+0.30
3.20 –0.20
+0.50
7.80 –0.20
6–R(0.20)
3–(1.00)
2.50±0.20
[Type EFOSS]·····4.0 to 13.0 MHz
[Type EFOSS]
(0.15)
Terminal
Electrodes
1.5
1.5
(1.60)
1.6
1.20 max.
Oscillating Frequency
Serial No.
2.6
2.50±0.20
2.00±0.30
4.50±0.20
3-0.55
3–(0.55)
2–1.50±0.20
6–(0.60)
[Type EFOB]·····13.1 to 20.0 MHz
3-0.8
[Type EFOB]
(5.00)
1.9
1.9
(2.70)
6–(1.20)
4.2
Terminal
Electrodes
1.60±0.20
Oscillating Frequency
Serial No.
+0.50
5.50 –0.20
+0.25
3.20 –0.15
6–R(0.20)
3-1.2
6–(1.20)
1.90±0.20
1.90±0.20
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– EC167 –
01 Feb. 2009
Ceramic Resonators, Chip Type
■ Dimensions in mm (not to scale)
Recommended Land Dimensions
[Type EFOBM]
[Type EFOBM]·····12.0 to 20.0 MHz
Oscillating Frequency
1.20 max.
Serial No.
(2.40)
3.9
(3.70)
Terminal
Electrodes
1.351.35
2.90±0.30
4.10±0.20
6–R(0.20)
3–(0.80)
2–1.35±0.20
3-0.8
[Type EFOJM]·····16.0 to 20.0, 30.0 to 50.0 MHz
[Type EFOJM]
Oscillating Frequency
(3.90)
1.6 1.6
(3.10)
4.6
Terminal
Electrodes
1.20 max.
Serial No.
+0.30
4.40 +0.50
–0.20
3.60 –0.20
6–R(0.20)
3-0.7 to 1.0
3–(0.80)
2–1.60±0.20
■ Test Circuits Diagram
For Oscillation Circuit
For Loop Gain
+5 V
+5 V
IC
14 13
1 2 3
11
4
IC
9
5
7
0.01
IN
1 M
V1
14 13
1 2 3
11
4
9
7
Frequency
IC
G=20 log (V0/ V1)
2.00 to 8.39 MHz
OUT
FET probe
10 M min.
2 pF max.
µPD4069UBC,
TC4069UBP
or similar
8.40 to 50.0 MHz
µPD74HCU,
TC74 HCU04AP
or similar
5
1 M
Frequency Counter T.G.
Output
=–20dBm
Ceramic Resonator
V0
Ceramic Resonator
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– EC168 –
01 Feb. 2009
Ceramic Resonators, Chip Type
■ Typical Characteristics ····· Temperature Characteristics
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8
2.0 to 8.39 MHz
8.4 to 13 MHz
–20 0 20 40 60 80
Temperature (°C)
–20 0 20 40 60 80
Temperature (°C)
Type EFOBM
2.0 to 8.39 MHz
8.4 to 13 MHz
–20 0 20 40 60 80
Temperature (°C)
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8
4.0 to 8.39 MHz
8.4 to 13 MHz
–20 0 20 40 60 80
Temperature (°C)
Type EFOJM
Oscillation Frequency Drift(%)
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8
Oscillation Frequency Drift(%)
Oscillation Frequency Drift(%)
Type EFOSM
Oscillation Frequency Drift(%)
Type EFOSS
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8
Oscillation Frequency Drift(%)
Type EFOB
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8
Oscillation Frequency Drift(%)
Type EFOS
–20 0 20 40 60 80
Temperature (°C)
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8
30 to 50 MHz
16 to 20 MHz
–20 0 20 40 60 80
Temperature (°C)
■ Packaging Specifications
● Standard Packing Quantity
Type
Embossed Taping
EFOS, EFOSM
2500 pcs./reel
EFOSS
2000 pcs./reel
EFOB , EFOBM, EFOJM
1000 pcs./reel
Bulk
500 pcs./bag
● Dimensions for Reel in mm (not to scale)
[Type EFOS, EFOSM]
T
E
φA
φB
C
D
E
330±5
80 min.
13.0±0.5
21.0±0.8
2.0±0.5
Dim.
(mm)
W
T
t
r
16.4+2.0
0
22.4 max.
3 max.
1.0
φB
C
Dim.
(mm)
D
r
[Type EFOSS, EFOB, EFOBM, EFOJM]
φA
W
Dim.
(mm)
φA
φB
C
D
E
180±5
60 min.
13.0±0.5
21.0±0.8
2.0±0.5
Dim.
(mm)
W
T
t
r
12.4+2.0
0
18.4 max.
3 max.
1.0
t
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– EC169 –
01 Feb. 2009
Ceramic Resonators, Chip Type
Chip pocket
F E
P1
P0
P2
Feeding hole
P0
φD0 Chip pocket
P2
B
A
Tape running
direction
Chip Componen
A
7.80
W
B
A
t2
t1
3.20
B
W
F
t2
E
P1
Dim.
(mm)
3.7±0.2
Dim.
(mm)
P2
P0
φD 0
t1
t2
2.0±0.1
4.0±0.1
1.5+0.1
0
0.3
3.5 max.
8.3±0.2 16.0±0.3 7.5±0.1 1.75±0.10 8.0±0.1
2.00
P1
Tape running direction
Chip Component
A
4.50
t1 Feeding hole φD0
[Type EFOSS]
F E
W
[Type EFOS, EFOSM]
B
W
Dim.
(mm)
2.6±0.2
Dim.
(mm)
P2
P0
φD 0
2.0±0.1
4.0±0.1
1.5+0.1
0
F
E
P1
5.1±0.2 12.0±0.3 5.5±0.1 1.75±0.10 4.0±0.1
t1
t2
0.6 max. 3.0 max.
[Type EFOB, EFOBM, EFOJM]
Feeding hole
φD0
t1
Chip pocket
A
P0
P1
t2
4.40
B
F E
W
3.60
Type EFOJM
(Example)
P2
Chip Component
Tape running direction
Dim.
(mm)
A
B
1
2
W
Dim.
(mm)
P2
P0
φD 0
2.0±0.1
4.0±0.1
1.5+0.1
0
F
E
P1
12.0±0.3 5.5±0.1 1.75±0.10 8.0±0.1
t1
t2
0.6 max. 3.0 max.
Dim. (mm)
A
B
1
2
Type EFOB
3.7±0.2
6.0±0.2
Type EFOBM
3.4±0.2
4.6±0.2
Type EFOJM
4.1±0.2
4.9±0.2
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– EC170 –
01 Feb. 2009
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