CYSTEKEC MB8ST05 Miniature glass passivated single phase surface mount bridge rectifier Datasheet

CYStech Electronics Corp.
Spec. No. : C769HT
Issued Date : 2014.04.29
Revised Date : 2014.06.06
Page No. : 1/ 3
Miniature Glass Passivated Single Phase Surface Mount Bridge Rectifiers
Reverse Voltage 50 to 1000 Volts
Forward Current 0.5 Ampere
MBST
MB05ST05 thru MB10ST05
Features
• Plastic package has Underwriters Laboratory Flammability Classification 94V-0
• Save space on printed circuit boards
• Glass passivated chip junction
• High surge overload rating: 30A peak
Equivalent Circuit
Mechanical Data
• Case: Molded plastic body over passivated junctions
• Terminals: Pure tin plated, solderable per MIL-STD-750 method 2026
• High temperature soldering guaranteed : 260°C/10 seconds, 0.375”(9.5mm) lead length, 5lbs(2.3kg) tension
• Mounting position: Any.
• Weight: 0.22gram, 0.078 oz.
Maximum Ratings and Electrical Characteristics
(Rating at 25°C ambient temperature unless otherwise specified.)
Parameter
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous forward
voltage drop per leg at 0.4A
Maximum average forward output rectified
current @Ta=40°C
Peak forward surge current @8.3ms single half
sine wave superimposed on rated load (JEDEC
method)
TA=25°C
Maximum DC reverse current at
rated DC blocking voltage per leg TA=100°C
Typical thermal resistance per leg
Typical diode junction capacitance @f=1MHz
and applied 4V reverse voltage
Operating junction and storage temperature
range
MB05ST05 thru MB10ST05
Type
Symbol MB05S MB1S MB2S MB4S MB6S
T05
T05
T05
T05
T05
VRRM
50
100
200
400
600
VRMS
35
70
140
280
420
VDC
50
100
200
400
600
MB8S
T05
800
560
800
MB10S Units
T05
1000
V
700
V
1000
V
VF
1
V
IF(AV)
0.5
A
IFSM
30
A
IR
5
500
μA
RθJA
RθJL
RθJC
75
20
24
°C /W
CJ
25
pF
TJ ;Tstg
-55 ~ +150
°C
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C769HT
Issued Date : 2014.04.29
Revised Date : 2014.06.06
Page No. : 2/ 3
Ordering Information
Device
Package
MBST
(Pb-free lead plating and halogen-free package)
MBXXST05-0-T8-X
Shipping
750 pcs / tape & reel
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T8 : 750 pcs / tape & reel, 7” reel
Product rank, zero for no rank products
Product name
Characteristic Curves
MB05ST05 thru MB10ST05
CYStek Product Specification
Spec. No. : C769HT
Issued Date : 2014.04.29
Revised Date : 2014.06.06
Page No. : 3/ 3
CYStech Electronics Corp.
MBST Dimension
Marking :
XX
□□□□□
Date Code
Device Name
MBST Plastic Surface
Mounted Package
CYStek Package Code: HT
Type
Marking
MB05ST05 MB1ST05 MB2ST05 MB4ST05 MB6ST05 MB8ST05 MB10ST05
MB05S
Inches
Min.
Max.
0.165
0.181
0.023
0.031
0.177
0.193
0.049
0.057
0.900
0.106
DIM
A
B
C
D
E
MB1S
MB2S
Millimeters
Min.
Max.
4.200
4.600
0.600
0.800
4.500
4.900
1.250
1.450
2.300
2.700
MB4S
DIM
F
G
J
L
Q
MB6S
MB8S
Inches
Min.
Max.
0.008
0.275
0.006
0.010
0.650
0.024
0.028
MB10S
Millimeters
Min.
Max.
0.200
7.000
0.150
0.250
1.650
0.600
0.700
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : Pure tin plated.
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MB05ST05 thru MB10ST05
CYStek Product Specification
Similar pages