AVAGO ALMD-EG3E Compact form factor Datasheet

ALMD-EL3E, ALMD-EG3E, ALMD-CM3E, ALMD-CB3E
High Brightness SMT Round
Red, Amber, Green and Blue LED Lamps
Data Sheet
Description
Features
The new Avago ALMD-xx3E LED series has the same or
just slightly less luminous intensity than conventional
high brightness, through-hole LEDs.
• Compact form factor
• High brightness material
• Available in Red, Amber, Green and Blue color
The new LED lamps can be assembled using common
SMT assembly processes and are compatible with industrial reflow soldering processes.
• Red AlInGaP 626 nm
• Amber AlInGaP 590 nm
The LEDs are made with an advanced optical grade epoxy
for superior performance in outdoor sign applications.
• Green InGaN 525 nm
For easy pick and place assembly, the LEDs are shipped in
tape and reel. Every reel is shipped from a single intensity
and color bin– except the red color–for better uniformity.
• JEDEC MSL 2A
Package Dimensions
• Typical viewing angle: 30°
• Blue InGaN 470 nm
• Compatible with reflow soldering process
• Tinted lens
Applications
Package Marking
• Full color signs
A
A
• Mono color signs
4.20
C
C
A: Anode
C: Cathode
4.20
4.75 ± 0.50
6.50 ± 0.50
3.40 ± 0.50
1.60 ± 0.50
2.50
1.4 (4×)
C
A
1.00
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.20 mm, unless otherwise specified.
3. Mildsteel leadframe.
CAUTION: InGaN devices are Class 1C HBM ESD sensitive, AlInGaP devices are Class 1B ESD sensitive per JEDEC Standard.
Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
CAUTION: Customer is advised to always keep the LED in the MBB with <5% RH when not in use as prolonged exposure to
environment might cause the silver-plated leads to tarnish or rust, which might cause difficulties in soldering.
Device Selection Guide
Part Number
Color and Dominant Wavelength
λd (nm) Typ. [3]
Luminous Intensity Iv (mcd) [1,2,5]
Min.
Max.
Viewing Angle
Typ. (°) [4]
ALMD-EG3E-VX002
Red 626
4200
9300
30°
ALMD-EL3E-VX002
Amber 590
4200
9300
ALMD-CM3E-Y1002
Green 525
9300
21000
ALMD-CB3E-SU002
Blue 470
1900
4200
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
2. The optical axis is closely aligned with the package mechanical axis.
3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ½ is the off-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each bin limit is ± 15%.
Part Numbering System
A
L
M
D
-
x1
x2
x3
x4
-
x5
x6
x7
x8
x9
Code
Description
Option
x1
Package type
E
C
Round AlInGaP
Round InGaN
x2
Color
B
G
L
M
Blue
Red
Amber
Green
x3
Viewing angle
3
30°
x4
Product specific designation
E
x5
Minimum intensity bin
Refer to device selection guide
x6
Maximum intensity bin
Refer to device selection guide
x7
Color bin selection
0
Full distribution
x8x9
Packaging option
02
Tested 20mA, 13inch carrier tape
2
Absolute Maximum Rating, TJ = 25 °C
Parameter
Red and Amber
Green
Blue
Unit
30
20
mA
100 [3]
100 [3]
mA
76
mW
DC Forward Current [1]
50
Peak Forward Current
100 [2]
120
114
Power Dissipation
110
°C
Operating Temperature Range
-40 to +85
°C
Storage Temperature Range
-40 to +100
°C
LED Junction Temperature
Notes:
1. Derate linearly as shown in Figure 4 and Figure 9.
2. Duty Factor 30%, frequency 1 kHz.
3. Duty Factor 10%, frequency 1 kHz.
Electrical / Optical Characteristics, TJ = 25 °C
Parameter
Symbol
Forward Voltage
Red
Amber
Green
Blue
VF
Reverse Voltage [3]
Red & Amber
Green & Blue
VR
Dominant Wavelength [1]
Red
Amber
Green
Blue
λd
Peak Wavelength
Red
Amber
Green
Blue
λPEAK
Thermal Resistance
Red
Amber
Green
Blue
RθJ-PIN
Luminous Efficacy [2]
Red
Amber
Green
Blue
ηV
Thermal coefficient of λd
Red
Amber
Green
Blue
Min.
1.8
1.8
2.8
2.8
Typ.
2.1
2.1
3.2
3.2
Max.
2.4
2.4
3.8
3.8
5
5
618.0
584.5
519.0
460.0
626.0
590.0
525.0
470.0
634
594
516
464
270
270
270
480
200
490
530
65
0.059
0.103
0.028
0.024
Units
Test Conditions
V
IF = 20 mA
V
IR = 100 µA
IR = 10 µA
IF = 20 mA
630.0
594.5
539.0
480.0
nm
Peak of Wavelength of Spectral
Distribution at IF = 20 mA
°C/W
LED Junction-to-Pin
lm/W
Emitted Luminous Power/Emitted
Radiant Power
nm/°C
IF = 20 mA ; +25 °C ≤ TJ ≤ +100 °C
Notes:
1. The dominant wavelength is derived from the chromaticity diagram and represents the color of the lamp.
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/ηV where IV is the luminous intensity in candelas and ηV is
the luminous efficacy in lumens/watt.
3. Indicates product final testing condition. Long-term reverse bias is not recommended.
3
AlInGaP
1.0
60
Red
Amber
FORWARD CURRENT - mA
RELATIVE INTENSITY
0.8
0.6
0.4
0.2
0.0
500
550
600
WAVELENGTH - nm
MAXIMUM FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
Red
Amber
2.0
1.5
1.0
0.5
0
10
20
30
40
FORWARD CURRENT - mA
50
60
Figure 3. Relative Intensity vs. Forward Current
RELATIVE DOMINANT WAVELENGTH SHIFT - nm
10
0
0.5
1
1.5
2
FORWARD VOLTAGE - V
2.5
3
Amber
Red
10
50
RJA = 460 °C/W
40
R JA = 660 ° C/W
30
20
10
0
0
20
40
60
80
TA - AMBIENT TEMPERATURE - °C
Figure 4. Maximum Forward Current vs. Ambient Temperature
20
30
40
FORWARD CURRENT - mA
50
Figure 5. Relative Dominant Wavelength Shift vs. Forward Current
4
20
60
2.5
0
30
Figure 2. Forward Current vs. Forward Voltage
3.0
1.2
1
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
40
0
650
Figure 1. Relative Intensity vs. Wavelength
0.0
50
60
100
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
380
30
BLUE
FORWARD CURRENT - mA
RELATIVE INTENSITY
InGaN
GREEN
25
20
15
10
5
430
480
530
WAVELENGTH - nm
580
0
0
630
Figure 6. Relative Intensity vs. Wavelength
MAXIMUM FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
1.0
0.8
0.6
0.4
0.2
0
5
10
15
20
DC FORWARD CURRENT - mA
25
30
RELATIVE DOMINANT WAVELENGTH SHIFT
(NORMALIZED AT 20 mA)
Figure 8. Relative Intensity vs. Forward Current
5
0
Blue
Green
-5
20
40
60
FORWARD CURRENT - mA
Figure 10. Dominant Wavelength Shift vs. Forward Current
5
4
Green
30
Blue
20
10
0
0
20
40
60
80
TA - AMBIENT TEMPERATURE - °C
Figure 9. Maximum Forward Current vs. Ambient Temperature
10
0
3
40
1.2
-10
2
FORWARD VOLTAGE - V
Figure 7. Forward Current vs. Forward Voltage
1.4
0.0
1
80
100
100
NORMALIZED INTENSITY
1
0.8
0.6
Package Marking
0.4
A
X
0.2
X
C
-60
-30
0
30
ANGULAR DISPLACEMENT-DEGREE
60
Figure 11a. Radiation Pattern for x-axis
Figure 11b. Component Axis for Radiation Pattern
NORMALZIED INTENSITY (PHOTO)
10
Green
Blue
Red
Amber
1
0.4
Red
Green
Blue
Amber
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-20
0
20
40
60
80
TJ - JUNCTION TEMPERATURE (°C)
100
120
0.7
4.0
Figure 12. Relative Intensity Shift vs. Junction Temperature
2.1
5.2
Note: Recommended stencil thickness
is 0.1524mm (6 mils) minimum and
above
Figure 14. Recommended Soldering Land Pattern
6
C
90
FORWARD VOLTAGE SHIFT - V
0
-90
0.1
-40
A
-0.4
-40
-20
0
20
40
60
80
TJ - JUNCTION TEMPERATURE (°C)
Figure 13. Forward Voltage Shift vs. Junction Temperature
100
120
4.00±0.20
0.50±0.10
2.00±0.20
1.55±0.20
1.75±0.20
1.80±0.20
7.50±0.20
5.20±0.20
2.20±0.20
8.00±0.20
16.00±0.30
4.50±0.20
1.60±0.20
5.30±0.20
7.10±0.20
Figure 15. Carrier Tape Dimension
∅100 ± 0.50
16.40 ± 0.20
∅330 MAX.
13.00 ± 0.20
Figure 16. Reel Dimension
2 anode leads lead unreeling direction
Figure 17. Unit Orientation from reel
7
Intensity Bin Limit Table (1.3:1 Iv bin ratio)
VF Bin Table (V at 20 mA) for Red and Amber only
Intensity (mcd) at 20 mA
Bin
Min.
Max.
S
1900
2500
T
2500
3200
U
3200
4200
V
4200
5500
W
5500
7200
X
7200
9300
Y
9300
12000
Z
12000
16000
1
16000
21000
Bin ID
Min.
Max.
VD
1.8
2.0
VA
2.0
2.2
VB
2.2
2.4
Tolerance for each bin limit is ± 0.05 V
Tolerance for each bin limit is ± 15%
Red Color Range
Green Color Range
Min Dom
Max Dom X min
Y Min
X max
Y max
0.2943
Min
Bin Dom
Max
Dom
618.0
630.0
0.6872
0.3126
0.6890
Xmin
Ymin
Xmax
Ymax
0.6690
0.3149
0.7080
0.2920
1
523.0
0.0667
0.8323
0.1450
0.7319
0.1200
0.7375
0.0979
0.8316
0.0979
0.8316
0.1711
0.7218
0.1450
0.7319
0.1305
0.8189
0.1305
0.8189
0.1967
0.7077
0.1711
0.7218
0.1625
0.8012
0.1625
0.8012
0.2210
0.6920
0.1967
0.7077
0.1929
0.7816
0.1929
0.7816
0.2445
0.6747
0.2210
0.6920
0.2233
0.7600
519.0
Tolerance for each bin limit is ± 0.5nm
Amber Color Range
Bin
Min
Dom
Max
Dom
Xmin
Ymin
Xmax
Ymax
1
584.5
587.0
0.5420
0.4580
0.5530
0.4400
0.5370
0.4550
0.5570
0.4420
0.5570
0.4420
0.5670
0.4250
0.5530
0.4400
0.5720
0.4270
0.5720
0.4270
0.5820
0.4110
0.5670
0.4250
0.5870
0.4130
0.5870
0.4130
0.5950
0.3980
0.5820
0.4110
0.6000
0.3990
2
4
6
587.0
589.5
592.0
589.5
592.0
594.5
Tolerance for each bin limit is ± 0.5nm
2
523.0
527.0
3
527.0
531.0
4
5
531.0
535.0
535.0
539.0
Tolerance for each bin limit is ± 0.5nm
Blue Color Range
Min
Bin Dom
Max
Dom
Xmin
Ymin
Xmax
Ymax
1
460.0
464.0
0.1440
0.0297
0.1766
0.0966
0.1818
0.0904
0.1374
0.0374
2
464.0
468.0
0.1374
0.0374
0.1699
0.1062
0.1766
0.0966
0.1291
0.0495
0.1291
0.0495
0.1616
0.1209
0.1699
0.1062
0.1187
0.0671
0.1187
0.0671
0.1517
0.1423
0.1616
0.1209
0.1063
0.0945
0.1063
0.0945
0.1397
0.1728
0.1517
0.1423
0.0913
0.1327
3
468.0
472.0
4
472.0
476.0
5
476.0
480.0
Tolerance for each bin limit is ± 0.5nm
8
Packing Label
(i) Mother Label (Available on MBB bag)
(1T) Lot: Lot Number
STANDARD LABEL LS0002
RoHS Compliant
e4 Max Temp 260C MSL 2a
(Q) QTY: Quantity
LPN:
CAT: Intensity Bin
(9D)MFG Date: Manufacturing Date
BIN: Refer to below information
(1P) Item: Part Number
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
DeptID: OEAT01
Made In: Country of Origin
(ii) Baby Label (Available on Plastic Reel)
(1P) PART #: Part Number
(1T) Lot #: Lot Number
(9D)MFG Date: Manufacturing Date
C/0: Country of Origin
(1T) TAPE DATE: Taping Date
BABY LABEL COSBOO1B V0.0
(Q) QTY: Quantity
(9D) Date Code: Date Code
CAT Intensity Bin
BIN Refer to Below information
Note: Acronyms and Definition:
Example:
BIN:
a. Color bin only or VF bin only
(i) Color bin only or VF bin only
(Applicable for part number with color bins but without VF bin or part number with VF bins and no color bin)
(ii) Color bin incorporated with VF bin
Applicable for part number that have both color bin
and VF bin
BIN: 4 (represent color bin 4 only)
BIN: VA (represent VF bin “VA” only)
b. Color bin incorporate with VF bin
BIN: 4 VA
VA: VF bin “VA”
4: Color bin 4 only
9
Soldering
Recommended reflow soldering condition:
(i) Leaded reflow soldering:
(ii) Lead-free reflow soldering:
20 SEC. MAX.
183°C
100-150°C
-6°C/SEC.
MAX.
3°C/SEC.
MAX.
120 SEC. MAX.
60-150 SEC.
TIME
a. Reflow soldering must not be done more than two
times. Do observe necessary precautions for handling
a moisture-sensitive device, as stated in the following
section.
b. Recommended board reflow direction:
TEMPERATURE
TEMPERATURE
10 to 30 SEC.
240°C MAX.
3°C/SEC. MAX.
217°C
200°C
255 - 260 °C
3°C/SEC. MAX.
6°C/SEC. MAX.
150°C
3 °C/SEC. MAX.
100 SEC. MAX.
60 - 120 SEC.
TIME
c. Do not apply any pressure or force on the LED during
reflow and after reflow when the LED is still hot.
d. It is preferred that you use reflow soldering to
solder the LED. Use hand soldering only for rework
if unavoidable but must be strictly controlled to the
following conditions:
- Soldering iron tip temperature = 320 °C max.
- Soldering duration = 3 sec max.
- Number of cycles = 1 only
- Power of soldering iron = 50 W max.
e. Do not touch the LED body with a hot soldering iron
except the soldering terminals as this may damage the
LED.
f. For de-soldering, it is recommended to use appropriate
double head soldering iron. User is advised to confirm
beforehand whether the functionality and performance
of the LED is affected by hand soldering.
10
PRECAUTIONARY NOTES
d. Control of assembled boards
1. Handling precautions
For automated pick and place, Avago has tested nozzle
size below made with urethane material to be working
fine with this LED. However, due to the possibility of
variations in other parameters such as pick and place
machine maker/model and other settings of the machine, customer is recommended to verify the nozzle
selected.
- If the PCB soldered with the LEDs is to be
subjected to other high temperature processes,
the PCB need to be stored in sealed MBB with
desiccant or desiccator at <5%RH to ensure that
all LEDs have not exceeded their floor life of 672
hours.
e. Baking is required if:
- The HIC indicator is not BROWN at 10% and is
AZURE at 5%.
Pick & Place nozzle
4.8mm
>3.5mm
- The LEDs are exposed to condition of >30°C /
60% RH at any time.
- The LED floor life exceeded 672hrs.
LED flange
4.4mm
Φ3.9mm
The recommended baking condition is: 60±5ºC
for 20hrs. Baking should only be done once.
f. Storage
Note:
1. Nozzle tip should touch the LED flange during pick and place.
2. Outer dimensions of the nozzle should be able to fit into the
carrier tape pocket.
2. Handling of moisture-sensitive device
This product has a Moisture Sensitive Level 2a rating
per JEDEC J-STD-020. Refer to Avago Application Note
AN5305, Handling of Moisture Sensitive Surface Mount
Devices, for additional details and a review of proper
handling procedures.
a. Before use
- An unopened moisture barrier bag (MBB) can
be stored at <40°C/90%RH for 12 months. If the
actual shelf life has exceeded 12 months and
the humidity Indicator Card (HIC) indicates that
baking is not required, then it is safe to reflow the
LEDs per the original MSL rating.
- It is recommended that the MBB not be opened
prior to assembly (e.g. for IQC).
b. Control after opening the MBB
- The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
- The LEDs must be kept at <30°C / 60%RH at all
times and all high temperature related processes
including soldering, curing or rework need to be
completed within 672 hours.
c. Control for unfinished reel
- Unused LEDs must be stored in a sealed MBB
with desiccant or desiccator at <5%RH.
11
- The soldering terminals of these Avago LEDs
are silver plated. If the LEDs are being exposed
in ambient environment for too long, the silver
plating might be oxidized and thus affecting its
solderability performance. As such, unused LEDs
must be kept in sealed MBB with desiccant or in
desiccator at <5%RH.
3. Application precautions
a. Drive current of the LED must not exceed the
maximum allowable limit across temperature as
stated in the datasheet. Constant current driving is
recommended to ensure consistent performance.
b. LED is not intended for reverse bias. Do use other
appropriate components for such purpose. When
driving the LED in matrix form, it is crucial to ensure
that the reverse bias voltage is not exceeding the
allowable limit of the LED.
c. Avoid rapid change in ambient temperature
especially in high humidity environment as this will
cause condensation on the LED.
d. If the LED is intended to be used in outdoor or harsh
environment, the LED leads must be protected
with suitable potting material against damages
caused by rain water, oil, corrosive gases etc. It is
recommended to have louver or shade to reduce
direct sunlight on the LEDs.
4. Eye safety precautions
LEDs may pose optical hazards when in operation. It is
not advisable to view directly at operating LEDs as it
may be harmful to the eyes. For safety reasons, use appropriate shielding or personal protective equipments.
DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for
sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a
nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to
make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
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Data subject to change. Copyright © 2005-2015 Avago Technologies. All rights reserved.
AV02-4540EN - April 27, 2015