Semikron C0-3N9S-10 Ceramic chip inductor Datasheet

CERAMIC CHIP INDUCTORS
C0 SERIES
1. PART NO. EXPRESSION :
C 0 - 1 N 0 S - □□
(a)
(b) (c)
(d)
(a) Series code
(c) Inductance Tolerence : S=± 0.3nH , J=± 5% , K=± 10%
(b) Inductance code : 1N0 = 1.0nH
(d) 10: Standard
11 ~ 99 : Internal control number
2. C0NFIGURATION & DIMENSIONS :
A
B
D
L
H
C
G
Recommended PC Board Pattern
Unit:m/m
B
A
C
G
H
L
0.20~0.30
0.25~0.40
0.80
D
0.60± 0.03 0.30± 0.03 0.30± 0.03 0.15± 0.05
3. SCHEMATIC :
4. MATERIALS :
b
a
Ag(100%)
Ni(100%)-1.5um(min.)
Sn(100%)-3.0um(min.)
(a) Body : ceramic ( Pb Free )
(b) Termination : ( Pb Free )
5. GENERAL SPECIFICATION :
a) Operating temp. : -40° C to +105° C ( including self-temperature. rise )
b) Storage condition (component in its packaging)
i) Temperature : -10 to 40° C
ii) Humidity : 60%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.01.2015
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
CERAMIC CHIP INDUCTORS
C0 SERIES
6. ELECTRICAL CHARACTERISTICS :
Part Number
Inductance
Test Frequency
Q
(nH)
( MHz )
Min
Q(Typ.) Frequency(MHz)
100 300
500 800 1000
Rated Current
DC Resistance
(Ω)
SRF
( MHz )
(mA) Max
Typ.
Max.
Typ.
Min
0.11
>13000
10000
C0-1N0S-10
1.0
100
4
6
12
17
22
27
470
0.088
C0-1N2S-10
1.2
100
4
6
12
16
21
25
450
0.089
0.12
>13000
10000
C0-1N5S-10
1.5
100
4
6
12
15
20
23
430
0.11
0.13
>13000
10000
C0-1N8S-10
1.8
100
4
6
12
15
20
23
390
0.12
0.16
>13000
10000
C0-2N0S-10
2.0
100
4
6
12
15
20
22
380
0.13
0.17
>13000
10000
C0-2N2S-10
2.2
100
4
6
12
15
20
22
360
0.14
0.19
12500
8800
C0-2N4S-10
2.4
100
4
6
12
15
20
22
350
0.15
0.20
11700
8300
7700
C0-2N7S-10
2.7
100
5
7
12
15
20
22
340
0.16
0.21
11000
C0-3N0S-10
3.0
100
5
7
12
15
20
22
330
0.18
0.22
11000
7200
C0-3N3S-10
3.3
100
5
7
12
15
20
22
320
0.19
0.23
9600
6700
C0-3N6S-10
3.6
100
5
7
12
15
20
22
310
0.20
0.25
9100
6400
C0-3N9S-10
3.9
100
5
7
12
15
20
22
300
0.20
0.27
8600
6000
C0-4N3S-10
4.3
100
5
7
12
15
19
21
280
0.22
0.30
8100
5700
C0-4N7S-10
4.7
100
5
7
12
15
19
21
280
0.24
0.30
7600
5300
C0-5N1S-10
5.1
100
5
7
12
15
19
21
270
0.26
0.33
7100
5000
7
12
15
19
21
260
0.27
0.36
6600
4600
C0-5N6S-10
5.6
100
5
C0-6N2S-10
6.2
100
5
7
11
14
18
20
250
0.29
0.38
6100
4200
C0-6N8J-10
6.8
100
5
7
11
14
18
20
250
0.30
0.39
5600
3900
C0-7N5J-10
7.5
100
5
7
11
14
18
19
240
0.34
0.41
5300
3600
C0-8N2J-10
8.2
100
5
7
11
14
18
19
230
0.34
0.45
4900
3400
C0-9N1J-10
9.1
100
5
7
11
14
17
18
220
0.40
0.48
4600
3200
7
11
14
17
18
220
0.41
0.51
4200
2900
C0-10NJ-10
10
100
5
C0-12NJ-10
12
100
5
7
11
14
17
18
190
0.45
0.68
3800
2700
C0-15NJ-10
15
100
5
7
11
13
16
17
180
0.50
0.71
3300
2300
C0-18NJ-10
18
100
5
7
11
13
16
17
170
0.57
0.81
3000
2100
C0-22NJ-10
22
100
5
7
11
13
15
16
150
0.71
1.00
2600
1800
C0-27NJ-10
27
100
4
6
10
12
14
15
120
1.11
1.35
2600
1800
C0-33NJ-10
33
100
4
6
10
12
14
14
110
1.33
1.47
2400
1700
C0-39NJ-10
39
100
4
6
10
12
13
12
100
1.51
1.72
2100
1500
1300
C0-47NJ-10
47
100
4
6
10
11
12
11
100
1.74
1.90
1800
6
10
11
11
10
80
1.85
2.27
1600
1100
C0-56NJ-10
56
100
4
C0-68NJ-10
68
100
4
6
10
11
11
10
80
2.30
2.66
1500
1100
C0-82NJ-10
82
100
4
6
10
11
10
8
70
2.60
3.37
1400
1000
C0-R10J-10
100
100
4
6
9
10
9
6
60
3.00
3.74
1200
900
Inductance Tolerence : S=± 0.3nH , J=± 5% , K=± 10%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.01.2015
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PG. 2
CERAMIC CHIP INDUCTORS
C0 SERIES
7. CHARACTERISTICS CURVES :
Impedance v.s. Frequency Characteristics
HCI0 603F Z
10000
100n
1000
IMPEDANCE(Ohm)
VS Freq.
47n
22n
100
10
10n
1
0.1
6.8n
2.2n
1
10
100
1000
10000
FREQUENCY(MHz)
Inductance v.s. Frequency Characteristics
HCI060 3F L
INDUCTA NCE(nH)
1000
VS
Freq.
100n
100
47n
22n
10n
10
2.2n
6.8n
1
1
10
100
1000
10000
FREQUENCY(MHz)
Q v.s. Frequency Characteristics
HCI0603F Q VS Freq.
100
2.2n
6.8n
Q
10n
10
22n
47n
100n
1
1
10
100
1000
10000
FREQUENCY(MHz)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 3
CERAMIC CHIP INDUCTORS
C0 SERIES
8. SOLDERING AND MOUNTING :
8-1. Recommended PC Board Pattern
Unit:m/m
L
H
G
L
G
H
0.80
0.20~0.30
0.25~0.40
PC board should be designed so that products can prevent damage from
mechanical stress when warping the board.
8-2. Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If wave soldering is used ,there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
8-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C)
8-2.2 Soldering Iron :
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a
soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.
Note :
d) 1.0mm tip diameter (max)
a) Preheat circuit and products to 150° C.
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
b) 350° C tip temperature for Ferrite chip bead (max)
f) Limit soldering time to 4-5 secs.
c) Never contact the ceramic with the iron tip
Soldering
Natural
cooling
20~40s
TP(26 0° C/40 s max.)
217
200
150
60~150s
60~180s
25
4 80s max.
Preheating
TEMPERATURE ° C
TEMPERATURE ° C
Preheating
Time(sec.)
Figure 1. Re-flow Soldering:3 times max
Soldering
Natural
cooling
350
150
G rad ual
Cooling
O ve r 60s.
Within4 ~5s
Figure 2. Wave Soldering:1 times max
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 4
CERAMIC CHIP INDUCTORS
C0 SERIES
8-3. Solder Volume
Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume
may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 3.
Minimum fillet height = soldering thickness + 25% product height
Upper limit
t
ReC0mmendable
Figure 3
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 5
CERAMIC CHIP INDUCTORS
C0 SERIES
9. PACKAGING INFORMATION :
9-1. Reel Dimension
A
2± 0.5
13.5± 0.5
R10.5
R0.5
C
D
B
R1.9
120°
7" x 8mm
Type
A(mm)
B(mm)
7" x 8mm
9.0± 0.5
60± 2
C(mm)
D(mm)
13.5± 0.5 178.0± 2.0
9-2 Tape Dimension / 8mm
Material : Paper
D:1.5+0.1-0.0
Bo
Ao
P
W:8.0± 0.3
t
F:3.5± 0.05
E:1.75± 0.1
Po:4± 0.1
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
C0
0.70± 0.06
0.40± 0.06
0.45 max
2.0± 0.05
0.45 max
Ko
9-3. Packaging Quantity
Chip Size
C0
Chip / Reel
15000
Inner Box
75000
Middle Box
375000
Carton
750000
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 6
CERAMIC CHIP INDUCTORS
C0 SERIES
9-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
F
165° C to 180° C
Top cover tape
Room Temp.
(° C)
Room Humidity
(%)
Room atm
(hPa)
Tearing Speed
(mm/min)
5~35
45~85
860~1060
300
Base tape
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes :
a) Recommended products should be used within 12 months from the time of delivery.
b) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation :
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7