DATASHEET ISL55015 FN6284 Rev 3.00 February 6, 2017 MMIC Silicon Bipolar Broadband Amplifier The ISL55015 is a high performance gain block featuring a Darlington configuration using high fT transistors and excellent thermal performance. They are an ideal choice for DVB-S LNB cable receiver applications. Features Other members of the family include: • Gain of 13.5dB at 1GHz • ISL55012 and ISL55015 match a 75Ω source to a 50Ω load • Noise figure of 4.8dB at 2GHz • ISL55014 matches a 50Ω source to a 50Ω load • OIP3 of 31dBm at 1GHz Ordering Information • Low input and output return losses PART NUMBER (Notes 1, 2, 3) CCK 3k ISL55015IEZ-EVAL Evaluation board • Output impedance of 50Ω • Pb-free (RoHS compliant) PACKAGE PART TAPE AND (RoHS MARKING REEL COMPLIANT) (Note 4) (UNITS) ISL55015IEZ-T7 • Input impedance of 75Ω 6 Ld SC-70 PKG. DWG. # P6.049B Applications • LNB and LNB-T (HDTV) amplifiers • IF gain blocks for satellite and terrestrial STBs • PA driver amplifier NOTES: • Wireless data, satellite 1. Refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. • Bluetooth/WiFi • Satellite locator and signal strength meters Pin Configuration ISL55015 (6 LD SC-70) TOP VIEW 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL55015. For more information on MSL please techbrief TB363. GND 1 6 OUT 4. The part marking is located on the bottom of the part. GND 2 5 GND IN 3 4 VSP Related Literature • For a full list of related documents, visit our website - ISL55015 product page +5V TABLE 1. KEY DIFFERENCES BETWEEN FAMILY OF PARTS IMPEDANCE 0.1µF 100pF 3 24Ω 4 6 68pF 100pF 0.1µF 100nH 68pF 1, 2, 5 SOURCE (Ω) LOAD (Ω) GAIN AT 1GHz (dB) NOISE FIGURE AT 2GHz (dB) ISL55012 75 50 18 4.7 ISL55014 50 50 17.2 4.3 ISL55015 75 50 13.5 4.8 PART # FIGURE 1. TYPICAL APPLICATION CIRCUIT FN6284 Rev 3.00 February 6, 2017 Page 1 of 7 ISL55015 Absolute Maximum Ratings (TA = +25°C) Supply Voltage from VSP to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6V Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VS+ +0.3V to GND - 0.3V ESD Rating Human Body Model (Per MIL-STD-883 Method 3015.7) . . . . . . . . 6000V Machine Model (Per EIAJ ED-4701 Method C-111) . . . . . . . . . . . . . 250V Thermal Information Thermal Resistance (Typical) JA (°C/W) JC (°C/W) 6 Ld SC-70 (Notes 5, 6) . . . . . . . . . . . . . . . . 255 195 Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +125°C Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . .+135°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493 Recommended Operating Conditions Ambient Operating Temperature . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 5. JA is measured with the component mounted on a high-effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 6. For JC, the “case temp” location is taken at the package top center. Electrical Specifications PARAMETER Supply Voltage Small Signal Gain Output Power at 1dB Compression Output Third Order Intercept Point VSP = +5V, ZRSC = ZLOAD = 50Ω, TA = +25°C, 24Ω VSP to OUT, unless otherwise specified. SYMBOL VSP Gt P1dB OIP3 TEST CONDITIONS MIN (Note 7) TYP MAX (Note 7) UNIT 5.5 V To operate below 5V, the 24Ω resistor to supply should be reduced 3.0 1.0GHz 12.3 13.5 14.8 dB 1.5GHz 11.7 13.3 14.2 dB 2.0GHz 11.0 12.4 13.5 dB 1.0GHz 16.4 18.1 21.6 dBm 2.0GHz 15.3 19.4 21.0 dBm 1.0GHz 31.3 dBm 2.0GHz 28.4 dBm Output Second Order Intercept Point OIP2 Input tones at 1.0GHz and 1.1GHz, at Input Power = -15dBm, Output tone 2.1GHz 47 dBm 3dB Bandwidth BW 3dB below Gain at 500MHz 2.9 GHz Input Return Loss IRL 1.0GHz ZRSC = 75Ω, ZLOAD = 50Ω 20.2 dB Output Return Loss ORL 1.0GHz ZRSC = 75Ω, ZLOAD = 50Ω 21.4 dB RISOL 2.0GHz 18.9 dB Noise Figure NF 2.0GHz 4.8 dB Device Operating Current ID Reverse Isolation 54 62.5 69 mA NOTE: 7. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. FN6284 Rev 3.00 February 6, 2017 Page 2 of 7 ISL55015 Device Test Setup AGILENT _8753ES VNA 50Ω 50Ω CONNECTORLESS PLATFORM 50Ω DC BLOCK PIN 3 PICOSECOND LABS MODEL 5508-110 PICOSECOND LABS MODEL 5542 PIN 6 50Ω DUT BIAS TEE 5V 24Ω I1 I2 IDEVICE OUTPUT REFERENCE PLANE INPUT REFERENCE PLANE 5V POWER SUPPLY FIGURE 2. DEVICE TEST SETUP ZSRC = 75Ω, ZLOAD = 50Ω 25 25 20 20 15 15 ORL (dB) IRL (dB) Typical Performance Curves 10 5 5 0 10 0.5 1.0 1.5 2.0 FREQUENCY (GHz) 2.5 0 3.0 0.5 FIGURE 3. INPUT RETURN LOSS vs FREQUENCY Typical Performance Curves 1.0 1.5 2.0 FREQUENCY (GHz) 2.5 3.0 FIGURE 4. OUTPUT RETURN LOSS vs FREQUENCY 50Ω environment 16 0 -2 -4 S11 (dB) S21 (dB) 14 12 -6 -8 -10 -12 10 0.5 1.0 1.5 2.0 FREQUENCY (GHz) 2.5 FIGURE 5. |S21| vs FREQUENCY FN6284 Rev 3.00 February 6, 2017 3.0 -14 0.5 1.0 1.5 2.0 FREQUENCY (GHz) 2.5 3.0 FIGURE 6. |S11| vs FREQUENCY Page 3 of 7 ISL55015 Typical Performance Curves 50Ω environment (Continued) -8 -16 -10 -20 S22 (dB) S12 (dB) -18 -22 -24 -12 -14 -26 -28 0.5 1.0 1.5 2.0 2.5 -16 0.5 3.0 1.0 FIGURE 7. |S12| vs FREQUENCY 20 32 10 HD (dBm) OIP3 (dBm) 28 26 24 -10 3.0 FUNDAMENTAL (1GHz) -20 -30 -40 IM2 (2.1GHz) -50 22 -60 1.0 1.5 2.0 2.5 3.0 -70 -25 -20 -15 -10 -5 0 INPUT POWER (dBm) FREQUENCY (GHz) FIGURE 9. OIP3 vs FREQUENCY FIGURE 10. IM2 vs INPUT POWER 7 1dB OUTPUT COMPRESSION POINT (dBm) 20 6 NOISE FIGURE (dB) 2.5 0 30 5 4 3 2 1 0 0.5 2.0 FIGURE 8. |S22| vs FREQUENCY 34 20 0.5 1.5 FREQUENCY (GHz) FREQUENCY (GHz) 1.0 1.5 2.0 2.5 FREQUENCY (Hz) FIGURE 11. NOISE FIGURE vs FREQUENCY FN6284 Rev 3.00 February 6, 2017 3.0 19 18 17 16 15 14 13 12 11 10 0.5 1.0 1.5 2.0 2.5 FREQUENCY (Hz) FIGURE 12. P1dB vs FREQUENCY Page 4 of 7 3.0 ISL55015 Typical Performance Curves 1 .8 0.6 1.6 0. 7 1.4 1.2 0.8 0.9 1.0 50Ω environment (Continued) 0.5 2.0 0.2 0.4 3. 0 0. 4 0. 6 0 .3 0.8 4.0 1.0 1. 0 5.0 0.2 8 0. 6.0 7.0 0.6 8.0 9.0 10 0.1 0.4 20 3GHz 50 20 10 5.0 4.0 3.0 2.0 1.8 1.6 1.4 1.2 1.0 0.9 0.8 0.7 0.5 0.4 0.3 0.2 0 0.6 0.2 50 0.1 0.2 0.5GHz 1.0 0.5GHz 50 20 0.4 2.2 0.6 7.0 0. 1. 0 5.0 8 S11 6 .0 S22 0. 2 1.0 2.2 8.0 9.0 10 0.1 1.0 4.0 0.8 3GHz 0.3 0 3. 0. 6 0.4 1 .8 2.0 0.5 0.4 1.2 1.0 0.9 0.8 1.4 0 .7 1 .6 0.6 0.2 RF Café 2002 FIGURE 13. S11 AND S22 vs FREQUENCY FN6284 Rev 3.00 February 6, 2017 Page 5 of 7 ISL55015 Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please visit our website to make sure you have the latest revision. DATE REVISION CHANGE February 6, 2017 FN6284.3 Removed mention of obsolete part ISL55013. On page 1: Updated Ordering Information table - added ISL55015IEZ-EVAL and added column for tape & reel quantity. Added Related Literature and Table of Differences. Thermal Resistance on page 2: Moved Storage Temperature and Operating Junction Temperature from Abs Max to Thermal Information section. Added Recommended Operating Conditions section and moved Ambient Operating Temperature to this section from Abs Max. Added Revision History and About Intersil sections. About Intersil Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products address some of the largest markets within the industrial and infrastructure, mobile computing, and high-end consumer markets. For the most updated datasheet, application notes, related documentation, and related parts, see the respective product information page found at www.intersil.com. For a listing of definitions and abbreviations of common terms used in our documents, visit: www.intersil.com/glossary. You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask. Reliability reports are also available from our website at www.intersil.com/support. © Copyright Intersil Americas LLC 2006-2017. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. 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For information regarding Intersil Corporation and its products, see www.intersil.com FN6284 Rev 3.00 February 6, 2017 Page 6 of 7 ISL55015 Small Outline Transistor Plastic Packages (SC70-6) 0.20 (0.008) M P6.049B VIEW C C 6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE CL MILLIMETERS e b SYMBOL 6 5 4 CL CL E1 E 1 2 3 MAX NOTES 0.80 1.00 - A1 0.000 0.09 - A2 0.80 0.91 - b 0.15 0.30 - b1 0.15 0.25 - c 0.08 0.25 6 c1 0.10 0.15 6 D D 1.85 2.25 3 CL E e1 C E1 A MIN A A2 A1 SEATING PLANE -C- 1.15 e N - 1.35 3 0.65 Ref e1 L 0.10 (0.004) C 2.30 BSC - 1.30 Ref 0.21 - 0.44 4 6 5 Rev. 0 4/07 NOTES: WITH b PLATING b1 c 1. Dimensioning and tolerance per ASME Y14.5M-1994. 2. Package conforms to EIAJ SC70 and JEDEC MO203AB. c1 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. 4. Footlength L measured at reference to gauge plane. BASE METAL 5. “N” is the number of terminal positions. 6. These Dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip. SEATING PLANE L C For the most recent package outline drawing, see P6.049B. VIEW C FN6284 Rev 3.00 February 6, 2017 Page 7 of 7