Material Content Data Sheet Sales Product Name BAS 21-03W E6327 MA# MA001094556 Package PG-SOD323-2-1 Issued Weight* Construction Element Material Group Substances chip non noble metal noble metal inorganic material non noble metal inorganic material non noble metal non noble metal noble metal inorganic material organic material plastics plastics inorganic material non noble metal noble metal < 10% arsenic gold silicon chromium silicon titanium copper gold antimonytrioxide carbon black brominated resin epoxy resin silicondioxide tin silver leadframe wire encapsulation leadfinish plating *deviation 29. August 2013 4.46 mg CAS# if applicable Weight [mg] Average Mass [%] 7440-38-2 7440-57-5 7440-21-3 7440-47-3 7440-21-3 7440-32-6 7440-50-8 7440-57-5 1309-64-4 1333-86-4 60676-86-0 7440-31-5 7440-22-4 0.000 0.00 14 0.006 0.13 1348 0.051 1.15 0.004 0.09 0.000 0.01 63 0.001 0.03 312 1.387 31.08 31.21 310791 312102 0.006 0.13 0.13 1303 1303 0.032 0.71 0.032 0.71 7123 0.078 1.75 17485 0.725 16.25 2.023 45.34 64.76 453304 647576 0.076 1.71 1.71 17061 17061 0.041 0.91 0.91 9085 Sum [%] 1.28 Average Mass [ppm] 11511 2. 3. 7123 162541 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 12873 936 Important Remarks: 1. Sum [ppm] 9085 1000000