Product Folder Order Now Support & Community Tools & Software Technical Documents DLP3310 DLPS089 – JANUARY 2017 DLP3310 0.33 1080p DMD 1 Features 3 Description • The DLP3310 digital micromirror device (DMD) is a digitally controlled micro-opto-electromechanical system (MOEMS) spatial light modulator (SLM). When coupled to an appropriate optical system, the DLP3310 DMD displays a very crisp and high quality image or video. DLP3310 is part of the chipset comprising of the DLP3310 DMD, DLPC3437 display controller and DLPA3000 PMIC/LED driver. The compact physical size of the DLP3310 coupled with the controller and the PMIC/LED driver provides a complete system solution that enables small form factor, low power, and high resolution Full-HD displays. • • 0.33-Inch (8.38-mm) Diagonal Micromirror Array – Displays Full-HD 1920 × 1080 Pixels on the Screen – 5.4 – Micron Micromirror Pitch – ±17° Micromirror Tilt (Relative to Flat Surface) – Side Illumination for Optimal Efficiency and Optical Engine Size – Polarization Independent Aluminum Micromirror Surface 32-Bit SubLVDS Input Data Bus Dedicated DLPC3437 Display Controller and DLPA3000 PMIC/LED Driver for Reliable Operation 2 Applications • • • • • • • • • • Mobile Smart TVs Screenless TVs Gaming Displays Digital Signage Wearable Displays Pico Projectors Interactive Displays Ultra Mobile Displays Smart Home Displays Virtual Assistant Device Information(1) PART NUMBER DLP3310 PACKAGE FQM (92) BODY SIZE (NOM) 19.25 mm × 7.2 mm × 3.80 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to change without notice. ADVANCE INFORMATION 1 DLP3310 DLPS089 – JANUARY 2017 www.ti.com 4 Device and Documentation Support 4.1 Device Support 4.1.1 Device Nomenclature Figure 1. Part Number Description 4.1.2 Device Markings The device marking includes the legible character string GHJJJJK DLP3310FQM. GHJJJJK is the lot trace code. DLP3310FQM is the device marking. ADVANCE INFORMATION Two-dimension matrix code DMD part number and lot trace code Lot Trace Code GHJJJJK DLP 3310FQM Part Marking Figure 2. DMD Marking 4.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY DLP3310 Click here Click here Click here Click here Click here DLPC3437 Click here Click here Click here Click here Click here DLPA3000 Click here Click here Click here Click here Click here 4.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 2 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DLP3310 DLP3310 www.ti.com DLPS089 – JANUARY 2017 4.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 4.5 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 4.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 5 Mechanical, Packaging, and Orderable Information ADVANCE INFORMATION The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DLP3310 3 PACKAGE OPTION ADDENDUM www.ti.com 19-Jan-2017 PACKAGING INFORMATION Orderable Device Status (1) DLP3310FQM PREVIEW Package Type Package Pins Package Drawing Qty CLGA FQM 92 100 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) TBD Call TI Call TI Op Temp (°C) Device Marking (4/5) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. 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