Material Content Data Sheet Sales Product Name IPD85P04P4-07 MA# MA000876408 Package PG-TO252-3-313 Issued 29. August 2013 Weight* 318.63 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal inorganic material non noble metal noble metal non noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin phosphorus nickel silver tin lead phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7723-14-0 7440-02-0 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7439-89-6 7440-50-8 2.544 0.80 0.147 0.05 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.80 7985 7985 462 0.044 0.01 147.096 46.17 46.23 461660 139 462261 4.411 1.38 1.38 13843 13843 1.377 0.43 4322 24.101 7.56 112.240 35.23 43.22 352264 75639 432225 3.740 1.17 1.17 11738 11738 0.003 0.00 1.421 0.45 0.057 0.02 0.046 0.01 2.195 0.69 0.006 0.00 0.019 0.01 19.177 6.02 11 0.45 4458 144 0.72 6889 2. 3. 60 6.03 60188 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 7213 18 Important Remarks: 1. 4469 180 60266 1000000