TI LP3997MM-3.3/NOPB Micropower 250-ma cmos ldo regulator with error flag and power-on-reset Datasheet

LP3997
www.ti.com
SNVS272B – MAY 2004 – REVISED MAY 2013
Micropower 250-mA CMOS LDO Regulator With Error Flag and Power-On-Reset
Check for Samples: LP3997
FEATURES
DESCRIPTION
•
•
•
•
•
•
•
•
The LP3997 regulator is designed to meet the
requirements of portable, battery-powered systems,
providing accurate output voltage, low noise, and low
quiescent current. The LP3997 provides 3.3V output
at up to 250mA load current. The chip architecture is
capable of providing output voltages as low as 0.8V.
When switched in shutdown mode, the power
consumption is virtually zero.
1
2
Low 140-mV Dropout at 250-mA Load
Stable With Ceramic Capacitor.
Low Noise With Bypass Capacitor
Less Than 80 µA Typical IQ at 250 mA
Virtually Zero IQ (Disabled)
Thermal and Short Circuit Protection
3.3-V Output (1)
8-Lead VSSOP Package (2)
The LP3997 is designed to be stable with space
saving ceramic output capacitor as small as 1µF.
The LP3997 also includes an out-of-regulation error
flag. When the output is more than 5% below its
nominal voltage, the error flag sets to low. If a
capacitor is connected to device’s delay pin, a
delayed power-on reset signal will be generated.
APPLICATIONS
•
•
•
•
•
(1)
(2)
Portable Consumer Electronics
Cellular Handsets
Laptop and Palm Computers
PDAs
Digital Cameras
For other voltage options, contact your TI sales office
For other package options, contact your TI sales office.
Typical Application Circuit
4
VIN
5
VIN
6
8
Enable
VOUT
VOUT
SENSE
SD
470k
LP3997
7
2
Error/POR
ERROR
DELAY
1
GND
2.2 PF
0.1 PF
3
CBYP
0.1 PF
2.2 PF
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2013, Texas Instruments Incorporated
LP3997
SNVS272B – MAY 2004 – REVISED MAY 2013
www.ti.com
Functional Block Diagram
VIN
VOUT
+
SENSE
ON
OFF
SD
RFB2
POR
2.2 PA
0.5V
ERROR
6 M:
RFB1
VREF
1.2V
+
-
GND
CBYP
DELAY
Pin Descriptions
Pin No.
Name
Description
1
CBYP
Noise bypass pin. For low noise applications a 0.1µF or larger ceramic capacitor should be connected from
this pin to ground. This will also improve PSSR.
2
DELAY
A capacitor connected from this pin to ground will allow a delayed power-on-reset signal at the ERROR (pin
7) output. See Applications Information.
3
GND
Ground pin. Local ground for CBYP ,CIN, COUT and CDELAY.
4
VIN
Input supply pin. Connect CIN between this pin and GND.
5
VOUT
6
SENSE
Connect this pin to VOUT (pin 5). For best performance the connection should be made as close to the load
as possible.
7
ERROR
This open drain output is an error flag output which goes low when VOUT drops 5% below its nominal
voltage. This pin also provides a power-on-reset signal if a capacitor is connected to the DELAY pin.
8
SD
Output voltage, Connect COUT between this pin and ground.
Shutdown. Disables the regulator when less than 0.4V is applied. Enables the regulator when greater than
0.9V. The Shutdown pin is pulled down internally by a 6MΩ resistor.
Connection Diagram
CBYP
1
8
SD
DELAY
2
7
ERROR
GND
3
6
SENSE
VIN
4
5
VOUT
8-Lead VSSOP
Package Number DGK
2
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LP3997
LP3997
www.ti.com
SNVS272B – MAY 2004 – REVISED MAY 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1)
(2) (3)
Input Voltage
-0.3 to 6.5V
Output Voltage
-0.3 to (VIN + 0.3V) with 6.5V (max)
SD Input Voltage
-0.3 to (VIN + 0.3V) with 6.5V (max)
Junction Temperature
150°C
Lead/Pad Temp.
VSSOP
260°C
Storage Temperature
-65 to 150°C
Internally Limited (4)
Continuous Power Dissipation
Human Body Model (5)
All Pins Except CBYP
Machine Model
ESD
(2)
(3)
(4)
(5)
200V
Human Body Model (5)
CBYP Pin
(1)
2KV
1KV
Machine Model
100V
Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the
device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test
conditions, see the Electrical Characteristics tables.
All Voltages are with respect to the potential at the GND pin.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
Internal thermal shutdown circuitry protects the device from permanent damage.
The human body model is 100pF discharged through a 1.5kΩ resistor into each pin. The machine model is a 200pF capacitor
discharged directly into each pin.
Operating Ratings (1)
Input Voltage
2V to 6V
Junction Temperature
-40°C to 125°C
Ambient Temperature TA Range (2)
(1)
(2)
-40°C to 85°C
Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the
device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test
conditions, see the Electrical Characteristics tables.
The maximum ambient temperature (TA(max)) is dependant on the maximum operating junction temperature (TJ(max-op) = 125°C), the
maximum power dissipation of the device in the application (PD(max)), and the junction to ambient thermal resistance of the part/package
in the application (θJA), as given by the following equation: TA(max) = TJ(max-op) - (θJA × PD(max)).
Thermal Properties (1)
Junction To Ambient Thermal Resistance (2), θJA (VSSOP)
(1)
(2)
210°C/W
Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the
device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test
conditions, see the Electrical Characteristics tables.
Junction to ambient thermal resistance is dependant on the application and board layout. In applications where high maximum power
dissipation is possible, special care must be paid to thermal dissipation issues in board design.
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LP3997
3
LP3997
SNVS272B – MAY 2004 – REVISED MAY 2013
www.ti.com
Electrical Characteristics
Unless otherwise noted, SD = 950mV, VIN = VOUT + 1.0V, CIN = 2.2 µF, IOUT = 1 mA, COUT = 2.2 µF and CBYP = 0.1 µF.
Typical values and limits appearing in normal type apply for TJ = 27°C. Limits appearing in boldface type apply over the full
temperature range for operation, −40 to +125°C. (1)
Symbol
Parameter
VIN
Input Voltage
ΔVOUT
Output Voltage Tolerance
Test Conditions
Typ
Over full line and load regulation
Line Regulation Error
VIN = (VOUT(NOM) + 1.0V) to 6.0V,
IOUT = 1mA
Limit
Unit
Min
Max
2
6
V
-1.5
+1.5
%
-3
+3
0.02
0.3
%/V
Load Regulation Error
IOUT = 1mA to 250mA
20
80
µV/mA
VDO
Dropout Voltage (2)
IOUT = 250mA
140
400
mV
ILOAD
Load Current
See
IQ
Quiescent Current
SD = 950mV, IOUT = 0mA
55
100
SD = 950mV, IOUT = 250mA
80
150
0.01
0.5
(3) (4)
0
SD = 0.4V
ISC
Short Circuit Current Limit
IOUT
Maximum Output Current
PSRR
Power Supply Rejection Ratio
See
(5)
600
µA
1000
250
CBYP = 0.1µF
Without CBYP
f = 1kHz, IOUT =
1mA to 150mA
61
f = 10kHz, IOUT =
150mA
55
f = 1kHz, IOUT =
1mA to 150mA
61
f = 10kHz, IOUT =
150mA
39
en
Output noise Voltage (4)
BW = 10Hz to 100kHz, w/o CBYP
VIN = VOUT(nom) +1V
CBYP = 0.1µF
180
TSHUTDOWN
Thermal Shutdown
Temperature
150
Hysteresis
10
Maximum Input Current at SD
Input
SD = 0.0V
0.01
VIL
Low Input Threshold
VIN = 2V to 6V
VIH
High Input Threshold
VIN = 2V to 6V
µA
mA
mA
dB
µVRMS
100
°C
Shutdown Control Characteristics
ISD
SD = 6V
(6)
µA
1
0.4
0.95
V
V
Error Flag Characteristics
VTH
Power Good Trip Threshold
VIN Rising
95
VHYST
Hysteresis
VIN Rising or Falling
2.5
VOL
ErrorError OutputOutput low
Voltage
ISINK = 2mA
0.1
IOFF
Error Output High Leakage
ERROR = VOUT(NOM)
10
IDELAY
Delay Pin Current Source
VOUT > 95% VOUT(NOM)
2.2
(1)
(2)
(3)
(4)
(5)
(6)
4
91
99
%VOUT
%VOUT
0.4
1.2
V
2000
nA
3
µA
All limits are ensured. All electrical characteristics having room-temperature limits are tested during production at TJ = 25°C or correlated
using Statistical Quality Control methods. Operation over the temperature specification is ensured by correlating the electrical
characteristics to process and temperature variations and applying statistical process control.
Dropout voltage is defined as the voltage difference between input and output when the output voltage drops 100mV below its nominal
value.
The device maintains the regulated output voltage without the load.
This electrical specification is ensured by design.
Short circuit current is measured on the input supply line at the point when the short circuit condition reduces the output voltage to 5% of
its nominal value.
SD Pin has 6MΩ typical, resistor connected to GND.
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LP3997
LP3997
www.ti.com
SNVS272B – MAY 2004 – REVISED MAY 2013
Electrical Characteristics (continued)
Unless otherwise noted, SD = 950mV, VIN = VOUT + 1.0V, CIN = 2.2 µF, IOUT = 1 mA, COUT = 2.2 µF and CBYP = 0.1 µF.
Typical values and limits appearing in normal type apply for TJ = 27°C. Limits appearing in boldface type apply over the full
temperature range for operation, −40 to +125°C. (1)
Symbol
Parameter
Test Conditions
Typ
Limit
Min
Max
Unit
Timing Characteristics
tON
Turn On Time
Transient
Response
(7)
(7)
To 95% Level
w/o CBYP
Line Transient Response
|δVOUT|
Trise = Tfall = 30µs (7)
δVIN = 600mV
Load Transient Response
|δVOUT|
Trise = Tfall = 1µs (7)
IOUT = 1mA to 150mA
150
250
µs
CBYP = 0.1µF
2
ms
w/o CBYP
40
CBYP = 0.1µF
4
mV
(pk - pk)
70
80
mV
This electrical specification is ensured by design.
Output Capacitor, Recommended Specifications
Symbol
Co
Parameter
Output Capacitor
Conditions
Capacitance (1)
ESR
(1)
Typ
2.2
Limit
Min
Max
Unit
0.7
5
µF
500
mΩ
The capacitor tolerance should be 30% or better over temperature. The full operating conditions for the application should be considered
when selecting a suitable capacitor to ensure that the minimum value of capacitance is always met. Recommended capacitor type is
X7R. However, dependent on application, X5R, Y5V, and Z5U can also be used. (See capacitor characteristics section in Applications
Information).
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LP3997
5
LP3997
SNVS272B – MAY 2004 – REVISED MAY 2013
www.ti.com
Typical Performance Characteristics.
Unless otherwise noted, SD = 950mV, VIN = VOUT + 1.0V, CIN = 2.2 µF, IOUT = 1 mA, COUT = 2.2 µF and CBYP = 0.1 µF.
Typical values and limits appearing in normal type apply for TJ = 27°C. Limits appearing in boldface type apply over the full
temperature range for operation, −40 to +125°C.
Output Voltage Change vs Temperature
Ground Current vs Load Current
100
3.00
90
GROUND CURRENT (PA)
VOUT CHANGE (%)
2.00
1.00
0.00
-1.00
-2.00
TA = 125oC
80
70
TA = -40oC
60
50
TA = 25oC
40
30
20
10
-3.00
-50
0
-25
0
25
50
75
100
0
125
50
TEMPERATURE (oC)
120
110
110
100
100
90
90
80
TA = 25oC
70
60
TA = 85oC
50
40
80
TA = 25oC
70
TA = 85oC
60
40
TA = -40oC
TA = -40oC
30
4
4.5
5
5.5
20
3.5
6
Ground Current vs VIN. ILOAD = 250mA
110
DROPOUT VOLTAGE (mV)
GND I (PA)
5.5
6
180
TA = 85oC
80
TA = -40oC
50
40
30
160
140
TA = 125oC
120
100
80
TA = -40oC
60
40
TA = 25oC
20
0
4
4.5
5
5.5
6
VIN
6
5
Dropout Voltage vs Load Current
TA = 25oC
60
4.5
200
100
70
4
VIN
120
20
3.5
250
Ground Current vs VIN. ILOAD = 1mA
VIN
90
200
50
30
20
3.5
150
LOAD CURRENT (mA)
Ground Current vs VIN. ILOAD = 0mA
GND I (PA)
GND I (PA)
120
100
0
50
100
150
200
250
LOAD CURRENT (mA)
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LP3997
LP3997
www.ti.com
SNVS272B – MAY 2004 – REVISED MAY 2013
Typical Performance Characteristics. (continued)
Unless otherwise noted, SD = 950mV, VIN = VOUT + 1.0V, CIN = 2.2 µF, IOUT = 1 mA, COUT = 2.2 µF and CBYP = 0.1 µF.
Typical values and limits appearing in normal type apply for TJ = 27°C. Limits appearing in boldface type apply over the full
temperature range for operation, −40 to +125°C.
VIN (V)
4.9
4.3
'VOUT
'VOUT
(20 mV/DIV)
Line Transient
CIN = COUT = 2.2 PF
CBYP = 0
IL = 1 to 250 mA
4.9
4.3
(10 mV/DIV)
VIN (V)
Line Transient
CIN = COUT = 2.2 PF
CBYP = 0.1 PF
IL = 1 to 250 mA
TIME (100 Ps/DIV)
TIME (100 Ps/DIV)
Load Transient (No CBYP)
Enable Start-up Time
CBYP = 0
CIN = COUT = 2.2 PF
VOUT
(1V/DIV)
VSD
250
(1V/DIV)
'VOUT
LOAD CURRENT
(mA)
(50 mV/DIV)
IL = 1 mA
1
TIME (500 Ps/DIV)
TIME (100 Ps/DIV)
Enable Start-up Time
(1V/DIV)
VOUT
VIN = 4.3V
VOUT (1V/DIV)
CBYP = 0.1 PF
IL = 1 mA
Short Circuit Current
CURRENT (A)
(1V/DIV)
VSD
2.0
1.5
1.0
0.5
0
TIME (500 Ps/DIV)
TIME (50 Ps/DIV)
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LP3997
7
LP3997
SNVS272B – MAY 2004 – REVISED MAY 2013
www.ti.com
Typical Performance Characteristics. (continued)
Unless otherwise noted, SD = 950mV, VIN = VOUT + 1.0V, CIN = 2.2 µF, IOUT = 1 mA, COUT = 2.2 µF and CBYP = 0.1 µF.
Typical values and limits appearing in normal type apply for TJ = 27°C. Limits appearing in boldface type apply over the full
temperature range for operation, −40 to +125°C.
Power Supply Rejection Ratio
0
CBYP = 0.1 PF
-10
IOUT = 150 mA
-20
CBYP = 0
-30
NOISE (PV/ Hz)
RIPPLE REJECTION (dB)
Noise Spectrum
10
-40
-50
IOUT = 1 mA
-60
1
CBYP = 0.1 PF
0.1
-70
-80
-90
100
1k
10k
100k
1M
0.01
0.1
1
10
FREQUENCY (kHz)
FREQUENCY (kHz)
Turn-On Sequence
Turn-Off Sequence
VIN 2V/DIV
CDELAY = 0.1 PF
CBYP = 0
ILOAD = 250 mA
VIN 2V/DIV
CDELAY = 0.1 PF
CBYP = 0
ILOAD = 250 mA
100
VOUT 2V/DIV
VOUT 2V/DIV
CDELAY 2V/DIV
CDELAY 2V/DIV
ERROR 2V/DIV
ERROR 2V/DIV
TIME (50 Ps/DIV)
TIME (20 ms/DIV)
8
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LP3997
LP3997
www.ti.com
SNVS272B – MAY 2004 – REVISED MAY 2013
Applications Information
External Capacitors
In common with most regulators, the LP3997 requires the inclusion of external capacitors.
VIN
An input capacitor is required for stability. It is recommended that a minimum of 1.0µF capacitor is connected
between the LP3997 input pin and ground (this capacitance value may be increased without limit).
This capacitor must be located a distance of not more than 1cm from the input pin and returned to a clean
analog ground. Any good quality ceramic, tantalum, or film capacitor may be used at the input.
Important: To ensure stable operation it is essential that good PCB design practices are employed to minimize
ground impedance and keep input inductance low. If these conditions cannot be met, or if long wire leads are
used to connect the battery or other power source to the LP3997, then it is recommended to increase the input
capacitor to at least 2.2µF. Also, tantalum capacitors can suffer catastrophic failures due to surge current when
connected to a low-impedance source of power (like a battery or a very large capacitor). If a tantalum capacitor is
used at the input, it must be ensured by the manufacturer to have a surge current rating sufficient for the
application.
There are no requirements for the ESR (Equivalent Series Resistance) on the input capacitor, but tolerance and
temperature coefficient must be considered when selecting the capacitor to ensure the capacitance will remain ≊
1.0µF over the entire operating temperature range.
VOUT
VOUT is the output voltage of the regulator. Connect capacitance (minimum 1.0µF) to ground from this pin. To
ensure stability the capacitor must meet the minimum value for capacitance and have an ESR in the range 5mΩ
to 500mΩ. Ceramic X7R types are recommended. If an output capacitor larger than 4.7µF is fitted then checks
on in-rush current, transient performance and stability, should be made.
SENSE
SENSE is used to sense the output voltage. Connect sense to VOUT
SHUTDOWN
SD controls the turning on and off of the LP3997. VOUT is ensured to be on when the voltage on the SD pin is
greater than 0.95V. VOUT is ensured to be off when the voltage on the SD pin is less than 0.4V.
ERROR
ERROR is an open drain output which is set low when VOUT is more than 5% below its nominal value. An
external pull up resistor is required on this pin. When a capacitor is connected from DELAY to GROUND, the
error signal is delayed (see DELAY section). This delayed error signal can be used as the power-on reset signal
for the application system. The ERROR pin is disconnected when not used.
DELAY
A capacitor from DELAY to GROUND sets the time delay for ERROR changing from low to high state. The delay
time is set by the following formula.
t DELAY
VTH(DELAY)
X
C DELAY
=
I DELAY
VTH(DELAY) is nominally 1.2V.
The DELAY pin should be open circuit if not used.
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LP3997
9
LP3997
SNVS272B – MAY 2004 – REVISED MAY 2013
www.ti.com
CBYP
For low noise application, connect a high frequency ceramic capacitor from CBYP to ground, A 0.01µF to 0.1µF
X5R or X7R is recommended. This capacitor is connected directly to high impedance node in the band gap
reference circuit. Any significant loading on this node will cause a change in the regulated output voltage. For this
reason, DC leakage current from this pin must be kept as low as possible for best output voltage accuracy.
CAPACITOR CHARACTERISTICS
In common with most regulators, the LP3997 requires external capacitors for regulator stability. The LP3997 is
specifically designed for portable applications requiring minimum board space and can use capacitors in the
range 1µF to 4.7µF.These capacitors must be correctly selected for good performance. Ceramic capacitors are
the smallest, least expensive and have the lowest ESR values (which makes them best for eliminating high
frequency noise). The ESR of a typical 1µF ceramic capacitor is in the range of 20 mΩ to 40 mΩ, which easily
meets the ESR requirement for stability by the LP3997.These capacitors must be correctly selected to ensure
good performance of the LP3997.
For both input and output capacitors careful interpretation of the capacitor specification is required to ensure
correct device operation. The capacitor value can change greatly dependant on the conditions of operation and
capacitor type.
CAP VALUE (% of Nom. 1 PF)
In particular the output capacitor selection should take account of all the capacitor parameters to ensure that the
specification is met within the application. Capacitance value can vary with DC bias conditions as well as
temperature and frequency of operation. Capacitor values will also show some decrease over time due to aging.
The capacitor parameters are also dependant on the particular case size with smaller sizes giving poorer
performance figures in general. As an example Figure 1 shows a typical graph showing a comparison of
capacitor case sizes in a Capacitance versus DC Bias plot. As shown in the graph, as a result of the DC Bias
condition, the capacitance value may drop below the minimum capacitance value given in the recommended
capacitor table (0.7µF in this case). Note that the graph shows the capacitance out of spec for the 0402 case
size capacitor at higher bias voltages. It is therefore recommended that the capacitor manufacturers’
specifications for the nominal value capacitor are consulted for all conditions as some capacitor sizes (e.g. 0402)
may not be suitable in the actual application.
0603, 10V, X5R
100%
80%
60%
0402, 6.3V, X5R
40%
20%
0
1.0
2.0
3.0
4.0
5.0
DC BIAS (V)
Figure 1. Capacitance versus DC Bias Plot
The value of ceramic capacitors can vary with temperature. The capacitor type X7R, which operates over a
temperature range of -55°C to +125°C, will only vary the capacitance to within ±15%. The capacitor type X5R
has a similar tolerance over a reduced temperature range of -55°C to +85°C. Most large value ceramic
capacitors, larger than 1µF are manufactured with Z5U or Y5V temperature characteristics. Their capacitance
can drop by more than 50% as the temperature goes from 25°C to 85°C. Therefore X7R is recommended over
Z5U and Y5V in applications where the ambient temperature will change significantly above or below 25°C.
Tantalum capacitors are less desirable than ceramic for use as output capacitors because they are more
expensive when comparing equivalent capacitance and voltage ratings in the 1µF to 4.7µF range.
10
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LP3997
LP3997
www.ti.com
SNVS272B – MAY 2004 – REVISED MAY 2013
Another important consideration is that tantalum capacitors have higher ESR values than equivalent size
ceramics. This means that while it may be possible to find a tantalum capacitor with an ESR value within the
stable range, it would have to be larger in capacitance (which means bigger and more costly ) than a ceramic
capacitor with the same ESR value. It should also be noted that the ESR of a typical tantalum will increase about
2:1 as the temperature goes from 25°C down to -40°C, so some guard band must be allowed.
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LP3997
11
LP3997
SNVS272B – MAY 2004 – REVISED MAY 2013
www.ti.com
REVISION HISTORY
Changes from Revision A (May 2013) to Revision B
•
12
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 11
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LP3997
PACKAGE OPTION ADDENDUM
www.ti.com
7-Oct-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
LP3997MM-3.3/NOPB
ACTIVE
Package Type Package Pins Package
Drawing
Qty
VSSOP
DGK
8
1000
Eco Plan
Lead/Ball Finish
(2)
Green (RoHS
& no Sb/Br)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
CU SN
Level-1-260C-UNLIM
(4/5)
-40 to 125
SAKB
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
LP3997MM-3.3/NOPB
Package Package Pins
Type Drawing
VSSOP
DGK
8
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
178.0
12.4
Pack Materials-Page 1
5.3
B0
(mm)
K0
(mm)
P1
(mm)
3.4
1.4
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LP3997MM-3.3/NOPB
VSSOP
DGK
8
1000
210.0
185.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated