Infineon IPB120N10S4-03 N-channel - normal level - enhancement mode Datasheet

IPB120N10S4-03
IPI120N10S4-03, IPP120N10S4-03
OptiMOS®-T2 Power-Transistor
Product Summary
VDS
100
V
RDS(on),max (SMD version)
3.5
mW
ID
120
A
Features
• N-channel - Normal Level - Enhancement mode
PG-TO263-3-2
• AEC Q101 qualified
PG-TO262-3-1
PG-TO220-3-1
• MSL1 up to 260°C peak reflow
• 175°C operating temperature
• Green Product (RoHS compliant)
• 100% Avalanche tested
Type
Package
Marking
IPB120N10S4-03
PG-TO263-3-2
4N1003
IPI120N10S4-03
PG-TO262-3-1
4N1003
IPP120N10S4-03
PG-TO220-3-1
4N1003
Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter
Symbol
Continuous drain current
ID
Conditions
Value
T C=25°C, V GS=10V1)
120
T C=100°C, V GS=10V2)
120
Unit
A
Pulsed drain current2)
I D,pulse
T C=25°C
480
Avalanche energy, single pulse2)
E AS
I D=60A
770
mJ
Avalanche current, single pulse
I AS
-
120
A
Gate source voltage
V GS
-
±20
V
Power dissipation
P tot
T C=25°C
250
W
Operating and storage temperature
T j, T stg
-
-55 ... +175
°C
Rev. 1.0
page 1
2014-06-30
IPB120N10S4-03
IPI120N10S4-03, IPP120N10S4-03
Parameter
Symbol
Values
Conditions
Unit
min.
typ.
max.
Thermal characteristics2)
Thermal resistance, junction - case
R thJC
-
-
-
0.6
Thermal resistance, junction ambient, leaded
R thJA
-
-
-
62
SMD version, device on PCB
R thJA
minimal footprint
-
-
62
6 cm2 cooling area3)
-
-
40
K/W
Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V (BR)DSS V GS=0V, I D= 1mA
100
-
-
Gate threshold voltage
V GS(th)
V DS=V GS, I D=180µA
2.0
2.7
3.5
Zero gate voltage drain current
I DSS
V DS=100V, V GS=0V
-
0.1
1
T j=125°C2)
-
10
100
V DS=100V, V GS=0V,
V
µA
Gate-source leakage current
I GSS
V GS=20V, V DS=0V
-
-
100
nA
Drain-source on-state resistance
R DS(on)
V GS=10V, I D=100A
-
3.4
3.9
mW
V GS=10V, I D=100A,
SMD version
-
3.0
3.5
Rev. 1.0
page 2
2014-06-30
IPB120N10S4-03
IPI120N10S4-03, IPP120N10S4-03
Parameter
Symbol
Values
Conditions
Unit
min.
typ.
max.
-
7780
10120 pF
-
2460
3200
Dynamic characteristics2)
Input capacitance
C iss
Output capacitance
C oss
Reverse transfer capacitance
Crss
-
150
300
Turn-on delay time
t d(on)
-
20
-
Rise time
tr
-
10
-
Turn-off delay time
t d(off)
-
45
-
Fall time
tf
-
40
-
Gate to source charge
Q gs
-
36
47
Gate to drain charge
Q gd
-
21
42
Gate charge total
Qg
-
108
140
Gate plateau voltage
V plateau
-
4.7
-
V
-
-
120
A
-
-
480
V GS=0V, V DS=25V,
f =1MHz
V DD=50V, V GS=10V,
I D=120A, R G=3.5W
ns
Gate Charge Characteristics2)
V DD=80V, I D=120A,
V GS=0 to 10V
nC
Reverse Diode
Diode continous forward current2)
IS
Diode pulse current2)
I S,pulse
Diode forward voltage
V SD
V GS=0V, I F=100A,
T j=25°C
-
1.0
1.3
V
Reverse recovery time2)
t rr
V R=50V, I F=50A,
di F/dt =100A/µs
-
80
-
ns
Reverse recovery charge2)
Q rr
-
170
-
nC
T C=25°C
1)
Current is limited by bondwire; with an R thJC = 0.6K/W the chip is able to carry 186A at 25°C.
2)
Specified by design. Not subject to production test.
3)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
Rev. 1.0
page 3
2014-06-30
IPB120N10S4-03
IPI120N10S4-03, IPP120N10S4-03
1 Power dissipation
2 Drain current
P tot = f(T C); V GS = 10 V
I D = f(T C); V GS = 10 V; SMD
300
140
120
250
100
80
ID [A]
Ptot [W]
200
150
60
100
40
50
20
0
0
0
50
100
150
200
0
50
100
TC [°C]
150
200
TC [°C]
3 Safe operating area
4 Max. transient thermal impedance
I D = f(V DS); T C = 25 °C; D = 0; SMD
Z thJC = f(t p)
parameter: t p
parameter: D =t p/T
1000
101
1 µs
10 µs
1 ms
100 µs
100
100
ID [A]
ZthJC [K/W]
0.5
10-1
0.1
0.05
10
0.01
10-2
single pulse
1
10-3
0.1
1
10
100
VDS [V]
Rev. 1.0
10-6
10-5
10-4
10-3
10-2
10-1
100
tp [s]
page 4
2014-06-30
IPB120N10S4-03
IPI120N10S4-03, IPP120N10S4-03
5 Typ. output characteristics
6 Typ. drain-source on-state resistance
I D = f(V DS); T j = 25 °C; SMD
R DS(on) = f(I D); T j = 25 °C; SMD
parameter: V GS
parameter: V GS
480
10
10 V
7V
5.5 V
5V
6V
6V
360
8
RDS(on) [mW]
ID [A]
5.5 V
240
6
5V
120
4
7V
10 V
0
2
0
1
2
3
4
5
0
120
240
VDS [V]
360
480
ID [A]
7 Typ. transfer characteristics
8 Typ. drain-source on-state resistance
I D = f(V GS); V DS = 6V
R DS(on) = f(T j); I D = 100 A; V GS = 10 V; SMD
parameter: T j
480
7
-55 °C
25 °C
6
175 °C
RDS(on) [mW]
ID [A]
360
240
5
4
120
3
0
3
4
5
6
7
VGS [V]
Rev. 1.0
2
-60
-20
20
60
100
140
180
Tj [°C]
page 5
2014-06-30
IPB120N10S4-03
IPI120N10S4-03, IPP120N10S4-03
9 Typ. gate threshold voltage
10 Typ. capacitances
V GS(th) = f(T j); V GS = V DS
C = f(V DS); V GS = 0 V; f = 1 MHz
parameter: I D
104
4
Ciss
3.5
Coss
103
C [pF]
VGS(th) [V]
3
1800 µA
2.5
180 µA
Crss
102
2
1.5
101
1
-60
-20
20
60
100
140
0
180
5
10
15
20
25
30
VDS [V]
Tj [°C]
11 Typical forward diode characteristicis
12 Avalanche characteristics
I F = f(VSD)
I A S= f(t AV)
parameter: T j
parameter: Tj(start)
103
1000
102
100
175
175 °C
°C
IAV [A]
IF [A]
25 °C
25 °C
150 °C
101
10
100
0
0.2
0.4
0.6
0.8
1
1.2
1.4
VSD [V]
Rev. 1.0
100 °C
1
1
10
100
1000
tAV [µs]
page 6
2014-06-30
IPB120N10S4-03
IPI120N10S4-03, IPP120N10S4-03
13 Avalanche energy
14 Drain-source breakdown voltage
E AS = f(T j)
V BR(DSS) = f(T j); I D = 1 mA
parameter: I D
110
2000
108
106
1500
30 A
EAS [mJ]
VBR(DSS) [V]
104
1000
102
100
60 A
98
500
120 A
96
94
0
25
75
125
-55
175
-15
Tj [°C]
25
65
105
145
Tj [°C]
15 Typ. gate charge
16 Gate charge waveforms
V GS = f(Q gate); I D = 120 A pulsed
parameter: V DD
10
V GS
20 V
9
Qg
80 V
8
7
VGS [V]
6
5
V g s(th)
4
3
2
Q g (th)
Q sw
Q gate
1
Q gs
0
0
20
40
60
80
100
Q gd
120
Qgate [nC]
Rev. 1.0
page 7
2014-06-30
IPB120N10S4-03
IPI120N10S4-03, IPP120N10S4-03
Published by
Infineon Technologies AG
81726 Munich, Germany
© Infineon Technologies AG 2014
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions
or characteristics. With respect to any examples or hints given herein, any typical values stated
herein and/or any information regarding the application of the device, Infineon Technologies hereby
disclaims any and all warranties and liabilities of any kind, including without limitation, warranties
of non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact
the nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances.
For information on the types in question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the
express written approval of Infineon Technologies, if a failure of such components can reasonably be
expected to cause the failure of that life-support device or system or to affect the safety or
effectiveness of that device or system. Life support devices or systems are intended to be implanted
in the human body or to support and/or maintain and sustain and/or protect human life.
If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Rev. 1.0
page 8
2014-06-30
IPB120N10S4-03
IPI120N10S4-03, IPP120N10S4-03
Revision History
Version
Date
Changes
Revision 1.0
Rev. 1.0
30.06.2014 Data Sheet Revision 1.0
page 9
2014-06-30
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