ETC2 LZ1-00UA00-U6 High efficacy violet led emitter Datasheet

High Efficacy
VIOLET LED Emitter
LZ1-00UA00
Key Features

High Efficacy 5W VIOLET LED

Ultra-small foot print – 4.4mm x 4.4mm

Surface mount ceramic package with integrated glass lens

Very low Thermal Resistance (4.2°C/W)

Electrically neutral thermal path

Very high Radiant Flux density

Autoclave (121°C, 2 ATM, 100% RH, 168 Hours)

JEDEC Level 1 for Moisture Sensitivity Level

Lead (Pb) free and RoHS compliant

Reflow solderable (up to 6 cycles)

Emitter available on Standard or Miniature MCPCB (optional)
Typical Applications

Dental Curing and Teeth Whitening

Ink and adhesive curing

Sterilization and Medical

DNA Gel
Description
The LZ1-00UA00 VIOLET LED emitter provides superior radiometric power in the wavelength range specifically
required for sterilization, dental curing lights, and numerous medical applications. With a 4.4mm x 4.4mm ultrasmall footprint, this package provides exceptional optical power density. The radiometric power performance and
optimal peak wavelength of this LED are matched to the response curves of dental resins, inks and adhesives,
resulting in a significantly reduced curing time. The patented design has unparalleled thermal and optical
performance. The high quality materials used in the package are chosen to optimize light output, have excellent
VIOLET resistance, and minimize stresses which results in monumental reliability and radiant flux maintenance.
UV RADIATION
Avoid exposure to the beam
Wear protective eyewear
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em [email protected] | www.ledengin.com
Part number options
Base part number
Part number
Description
LZ1-00UA00-xxxx
LZ1 emitter
LZ1-10UA00-xxxx
LZ1 emitter on Standard Star MCPCB
LZ1-30UA00-xxxx
LZ1 emitter on Miniature round MCPCB
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Bin kit option codes
Full distribution wavelength (385-410nm)
Kit number suffix
Min flux Bin
Color Bin Range
Description
0000
H
U4 - U8
full distribution flux; full distribution wavelength
J000
J
U4 - U8
J minimum flux bin; full distribution wavelength
K000
K
U4 - U8
K minimum flux bin; full distribution wavelength
L000
L
U4 - U8
L minimum flux bin; full distribution wavelength
Color Bin Range
Description
Two wavelength bins (10nm range)
Kit number suffix
Min flux Bin
Wavelength U4 and U5 bin (385 – 395nm)
0U45
H
U4 - U5
full distribution flux; wavelength U4 and U5 bin
JU45
J
U4 – U5
J minimum flux bin; wavelength U4 and U5 bins
KU45
K
U4 – U5
K minimum flux bin; wavelength U4 and U5 bins
LU45
L
U4 – U5
L minimum flux bin; wavelength U4 and U5 bins
Wavelength U5 and U6 bin (390 – 400nm)
0U56
H
U5 - U6
full distribution flux; wavelength U5 and U6 bin
JU56
J
U5 - U6
J minimum flux bin; wavelength U5 and U6 bins
KU56
K
U5 - U6
K minimum flux bin; wavelength U5 and U6 bins
LU56
L
U5 - U6
L minimum flux bin; wavelength U5 and U6 bins
Wavelength U6 and U7 bin (395 – 405nm)
0U67
H
U6 - U7
full distribution flux; wavelength U6 and U7 bin
JU67
J
U6 - U7
J minimum flux bin; wavelength U6 and U7 bins
KU67
K
U6 - U7
K minimum flux bin; wavelength U6 and U7 bins
LU67
L
U6 - U7
L minimum flux bin; wavelength U6 and U7 bins
Wavelength U7 and U8 bin (400 – 410nm)
0U78
H
U7 - U8
full distribution flux; wavelength U7 and U8 bin
JU78
J
U7 - U8
J minimum flux bin; wavelength U7 and U8 bins
KU78
K
U7 - U8
K minimum flux bin; wavelength U7 and U8 bins
LU78
L
U7 - U8
L minimum flux bin; wavelength U7 and U8 bins
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Single wavelength bin (5nm range)
Kit number suffix
Min flux Bin
Color Bin Range
Description
Wavelength U4 bin only (385 – 390nm)
00U4
H
U4
full distribution flux; wavelength U4 bin only
Wavelength U5 bin only (390 – 395nm)
00U5
H
U5
full distribution flux; wavelength U5 bin only
J0U5
J
U5
J minimum flux bin; wavelength U5 bin only
K0U5
K
U5
K minimum flux bin; wavelength U5 bin only
L0U5
L
U5
L minimum flux bin; wavelength U5 bin only
Wavelength U6 bin only (395 – 400nm)
00U6
H
U6
full distribution flux; wavelength U6 bin only
J0U6
J
U6
J minimum flux bin; wavelength U6 bin only
K0U6
K
U6
K minimum flux bin; wavelength U6 bin only
L0U6
L
U6
L minimum flux bin; wavelength U6 bin only
Wavelength U7 bin only (400 – 405nm)
00U7
H
U7
full distribution flux; wavelength U7 bin only
J0U7
J
U7
J minimum flux bin; wavelength U7 bin only
K0U7
K
U7
K minimum flux bin; wavelength U7 bin only
L0U7
L
U7
L minimum flux bin; wavelength U7 bin only
Wavelength U8 bin only (405 – 410nm)
00U8
H
U8
full distribution flux; wavelength U8 bin only
J0U8
J
U8
J minimum flux bin; wavelength U8 bin only
K0U8
K
U8
K minimum flux bin; wavelength U8 bin only
L0U8
L
U8
L minimum flux bin; wavelength U8 bin only
Notes:
1.
Default bin kit option is -0000
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Radiant Flux Bins
Table 1:
Bin Code
Minimum
Radiant Flux (Φ)
@ IF = 700mA [1,2]
(mW)
Maximum
Radiant Flux (Φ)
@ IF = 700mA [1,2]
(mW)
H
410
512
J
512
640
K
640
800
L
800
1000
M
1000
1250
Notes for Table 1:
1.
Radiant flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10%
on flux measurements.
2.
Future products will have even higher levels of radiant flux performance. Contact LED Engin Sales for updated information.
Peak Wavelength Bins
Table 2:
Bin Code
Minimum
Peak Wavelength (λP)
@ IF = 700mA [1]
(nm)
Maximum
Peak Wavelength (λP)
@ IF = 700mA [1]
(nm)
U4
385
390
U5
390
395
U6
395
400
U7
400
405
U8
405
410
Notes for Table 2:
1.
LED Engin maintains a tolerance of ± 2.0nm on peak wavelength measurements.
Forward Voltage Bins
Table 3:
Bin Code
Minimum
Forward Voltage (VF)
@ IF = 700mA [1]
(V)
Maximum
Forward Voltage (VF)
@ IF = 700mA [1]
(V)
0
3.20
4.40
Notes for Table 3:
1.
LED Engin maintains a tolerance of ± 0.04V for forward voltage measurements.
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Absolute Maximum Ratings
Table 4:
Parameter
DC Forward Current
Symbol
Value
Unit
IF
1000
mA
[1]
Peak Pulsed Forward Current
[2]
IFP
1000
mA
Reverse Voltage
VR
See Note 3
V
Storage Temperature
Tstg
-40 ~ +150
°C
Junction Temperature
TJ
125
°C
Soldering Temperature
Tsol
260
°C
Allowable Reflow Cycles
6
Autoclave Conditions
121°C at 2 ATM,
100% RH for 168 hours
ESD Sensitivity [4]
> 2,000 V HBM
Class 2 JESD22-A114-D
Notes for Table 4:
1.
Maximum DC forward current is determined by the overall thermal resistance and ambient temperature.
Follow the curves in Figure 10 for current derating.
2:
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.
3.
LEDs are not designed to be reverse biased.
4.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ1-00UA00 in an electrostatic protected area (EPA).
An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
Optical Characteristics @ TC = 25°C
Table 5:
Typical
Parameter
Symbol
Radiant Flux (@ IF = 700mA)
Φ
Radiant Flux (@ IF = 1000mA)
Φ
λP
385
Peak Wavelength
Viewing Angle
[1]
[2]
Total Included Angle [3]
385-390nm
Unit
390-400nm
400-410nm
760
860
1000
mW
1070
1200
1400
mW
395
405
nm
2Θ1/2
85
Degrees
Θ0.9V
100
Degrees
Notes for Table 5:
1.
When operating the VIOLET LED, observe IEC 60825-1 class 3B rating. Avoid exposure to the beam.
2.
Viewing Angle is the off axis angle from emitter centerline where the radiometric power is ½ of the peak value.
3.
Total Included Angle is the total angle that includes 90% of the total radiant flux.
Electrical Characteristics @ TC = 25°C
Table 6:
Parameter
Symbol
Typical
Unit
Forward Voltage (@ IF = 700mA)
VF
3.9
V
Forward Voltage (@ IF = 1000mA)
VF
4.1
V
Temperature Coefficient
of Forward Voltage
ΔVF/ΔTJ
-3.7
mV/°C
Thermal Resistance
(Junction to Case)
RΘJ-C
4.2
°C/W
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IPC/JEDEC Moisture Sensitivity Level
Table 7 - IPC/JEDEC J-STD-20D.1 MSL Classification:
Soak Requirements
Floor Life
Standard
Accelerated
Level
Time
Conditions
Time (hrs)
Conditions
Time (hrs)
Conditions
1
Unlimited
≤ 30°C/
85% RH
168
+5/-0
85°C/
85% RH
n/a
n/a
Notes for Table 7:
1.
The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and the
floor life of maximum time allowed out of the bag at the end user of distributor’s facility.
Average Radiant Flux Maintenance Projections
Lumen maintenance generally describes the ability of an emitter to retain its output over time. The useful lifetime
for power LEDs is also defined as Radiant Flux Maintenance, with the percentage of the original light output
remaining at a defined time period.
Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, 70% Radiant Flux
Maintenance (RP70%) at 20,000 hours of operation at a forward current of 700 mA per die. This projection is
based on constant current operation with junction temperature maintained at or below 80°C.
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Mechanical Dimensions (mm)
Pin Out
Pad
Function
1
Cathode
2
Anode
3
Anode
4
Cathode
5
1
[2]
Thermal
2
5
4
3
Figure 1: Package outline drawing.
Notes for Figure 1:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
Thermal contact, Pad 5, is electrically neutral.
Recommended Solder Pad Layout (mm)
Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad
Note for Figure 2a:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
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Recommended Solder Mask Layout (mm)
Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad
Note for Figure 2b:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Recommended 8mil Stencil Apertures Layout (mm)
Figure 2c: Recommended solder mask opening for anode, cathode, and thermal pad
Note for Figure 2c:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
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Reflow Soldering Profile
Figure 3: Reflow soldering profile for lead free soldering.
Typical Radiation Pattern
100
90
Relative Intensity (%)
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Angular Displacement (Degrees)
Figure 4: Typical representative spatial radiation pattern.
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Typical Relative Spectral Power Distribution
1
Relative Spectral Power
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
300
350
400
450
500
Wavelength (nm)
Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C.
Typical Peak Wavelength Shift over Temperature
Peak Wavelength Shift (nm)
6.0
5.0
4.0
3.0
2.0
1.0
0.0
0
20
40
60
80
100
120
Case Temperature (ºC)
Figure 6: Typical peak wavelength shift vs. case temperature.
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Typical Normalized Radiant Flux
1.4
Normalized Radiant Flux
1.2
1
0.8
0.6
0.4
0.2
0
0
200
400
600
800
1000
IF - Forward Current (mA)
Figure 7: Typical normalized radiant flux vs. forward current @ TC = 25°C.
Typical Normalized Radiant Flux over Temperature
1.2
Normalized Radiant Flux
1
0.8
0.6
0.4
0.2
0
0
20
40
60
80
100
120
Case Temperature (ºC)
Figure 8: Typical normalized radiant flux vs. case temperature.
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Typical Forward Current Characteristics
1200
IF - Forward Current (mA)
1000
800
600
400
200
0
2.5
3.0
3.5
4.0
4.5
5.0
100
125
VF - Forward Voltage (V)
Figure 9: Typical forward current vs. forward voltage @ T C = 25°C.
Current De-rating
IF - Maximum Current (mA)
1200
1000
800
700
(Rated)
600
400
RΘJ-A = 9°C/W
RΘJ-A = 11°C/W
RΘJ-A = 13°C/W
200
0
0
25
50
75
Maximum Ambient Temperature (ºC)
Figure 10: Maximum forward current vs. ambient temperature based on T J(MAX) = 125°C.
Notes for Figure 10:
1.
RΘJ-C [Junction to Case Thermal Resistance] for the LZ1-00UA00 is typically 4.2°C/W.
2.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].
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Emitter Tape and Reel Specifications (mm)
Figure 11: Emitter carrier tape specifications (mm).
Figure 12: Emitter reel specifications (mm).
Notes:
1.
Reel quantity minimum: 100 emitters. Reel quantity maximum: 2000 emitters
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LZ1 MCPCB Family
Emitter + MCPCB
Typical Vf
Thermal Resistance
(V)
(°C /W)
Typical If
(mA)
Part number
Type of MCPCB
Diameter
(mm)
LZ1-1xxxxx
1-channel Star
19.9
4.2 + 1.5 = 5.7
3.9
700
LZ1-3xxxxx
1-channel Mini
11.5
4.2 + 2.0 = 6.2
3.9
700
Mechanical Mounting of MCPCB


MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to
substrate cracking and subsequently LED dies cracking.
To avoid MCPCB bending:
o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws.
o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3
screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will
increase the likelihood of board bending.
o It is recommended to always use plastics washers in combinations with the three screws.
o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after
tightening (with controlled torque) and then re-tighten the screws again.
Thermal interface material



To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when
mounting the MCPCB on to the heat sink.
There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal
epoxies. An example of such material is Electrolube EHTC.
It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating
conditions.
Wire soldering


To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)
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LZ1-1xxxxx
1 channel, Standard Star MCPCB (1x1) Dimensions (mm)
Notes:

Unless otherwise noted, the tolerance = ± 0.2 mm.

Slots in MCPCB are for M3 or #4-40 mounting screws.

LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.

LED Engin recommends using thermal interface material when attaching the MCPCB to a heat sink.

The thermal resistance of the MCPCB is: RΘC-B 1.5°C/W
Components used
MCPCB:
ESD chips:
HT04503
BZT52C5-C10
(Bergquist)
(Diodes, Inc, for 1 LED die)
Pad layout
Ch.
1
MCPCB
Pad
1,2,3
4,5,6
String/die
Function
1/A
Cathode Anode +
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LZ1-3xxxxx
1 channel, Mini Round MCPCB (1x1) Dimensions (mm)
Notes:

Unless otherwise noted, the tolerance = ± 0.20 mm.

LED Engin recommends using thermal interface material when attaching the MCPCB to a heat sink.

The thermal resistance of the MCPCB is: RΘC-B 2.0°C/W
Components used
MCPCB:
ESD chips:
HT04503
BZT52C5-C10
(Bergquist)
(Diodes, Inc, for 1 LED die)
Pad layout
Ch.
1
MCPCB
Pad
1
2
String/die
Function
1/A
Anode +
Cathode -
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Company Information
LED Engin, Inc., based in California’s Silicon Valley, specializes in ultra-bright, ultra compact solid state lighting
solutions allowing lighting designers & engineers the freedom to create uncompromised yet energy efficient
lighting experiences. The LuxiGen™ Platform — an emitter and lens combination or integrated module solution,
delivers superior flexibility in light output, ranging from 3W to 90W, a wide spectrum of available colors, including
whites, multi-color and UV, and the ability to deliver upwards of 5,000 high quality lumens to a target. The small
size combined with powerful output allows for a previously unobtainable freedom of design wherever high-flux
density, directional light is required. LED Engin’s packaging technologies lead the industry with products that
feature lowest thermal resistance, highest flux density and consummate reliability, enabling compact and efficient
solid state lighting solutions.
LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions.
LED Engin reserves the right to make changes to improve performance without notice.
Please contact [email protected] or (408) 922-7200 for more information.
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Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
LED Engin:
LZ1-00UA00 LZ1-10UA00 LZ1-30UA00 LZ1-00UA00-U4 LZ1-00UA00-U5 LZ1-00UA00-U6 LZ1-00UA00-U7 LZ100UA00-U8 LZ1-10UA00-U4 LZ1-10UA00-U5 LZ1-10UA00-U6 LZ1-10UA00-U7 LZ1-10UA00-U8 LZ1-00UA00-J000
LZ1-10UA00-J000 LZ1-10UA00-K000 LZ1-00UA00-L000 LZ1-10UA00-L000 LZ1-00UA00-K000
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