BYV52HR Aerospace 30 A - 200 V fast recovery rectifier Features ■ Very small conduction losses ■ Negligible switching losses ■ High surge current capability ■ High avalanche energy capability ■ Hermetic package ■ Target radiation qualification: – 150 krad (Si) low dose rate – 3 Mrad high dose rate ■ Package mass: 10 g ■ ESCC qualified TO-254 Figure 1. Description Packaged in an hermetic TO-254 this device is intended for use in medium voltage, high frequency switching mode power supplies, high frequency DC to DC converters, and other aerospace applications. The complete ESCC specification for this device is available from the European space agency web site. ST guarantees full compliance of qualified parts with such ESCC detailed specifications. Table 1. Device configuration BYV52-200FSY1 BYV52-200FSYHRB Terminal 1: Cathode 3 Terminal 2: No connection Terminal 3: Anode The case is not connected to any lead 1 Device summary(1) Order code BYV52-200FSY1 BYV52-200FSYHRB ESCC detailed Quality level specification Lead finish EPPL Engineering model Gold - Flight part Solder dip 5103/030/01 IF(AV) VRRM Tj(max) VF (max) 30 A 200 V 150 °C 1.15 V Y 1. Contact ST sales office for information about the specific conditions for products in die form and QML-Q versions. April 2010 Doc ID 17395 Rev 1 1/8 www.st.com 8 Characteristics 1 BYV52HR Characteristics Table 2. Absolute maximum ratings Symbol IFSM VRRM IO IF(RMS) TOP TJ Characteristic Value Unit 400 A 200 V Average output rectified current (50% duty cycle): 30 A Forward rms current (per diode) 30 A -55 to +150 °C +150 °C -55 to +150 °C +260 °C Forward surge current (per diode)(1) (2) Repetitive peak reverse voltage (3) Operating case temperature range (4) Junction temperature range(4) TSTG Storage temperature TSOL Soldering temperature(5) 1. Sinusoidal pulse of 10 ms duration 2. Pulsed, duration 5 ms, F = 50 Hz 3. For Tcase ≥ +120°C, derate linearly to 0 A at +150°C. 4. For devices with hot solder dip lead finish all testing performed at Tamb > +125 °C are carried out in a 100% inert atmosphere. 5. Duration 10 seconds maximum at a distance of not less than 1.5 mm from the device body and the same lead shall not be resoldered until 3 minutes have elapsed. Table 3. Thermal resistance Symbol Rth (j-c) Parameter Junction to case (1) 1. Package mounted on infinite heatsink. 2/8 Doc ID 17395 Rev 1 Value Unit 0.9 °C/W BYV52HR Table 4. Symbol IR VF1 Characteristics s Electrical measurements at ambiant temperature (per diode), Tamb = 22 ±3 °C Characteristic MIL-STD-750 test method Reverse current 4016 Forward voltage 4011 (1) VF2(1) VBR Limits Test conditions Units Min. Max. DC method, VR = 200 V - 25 µA Pulse method, IF = 20 A - 1.01 V Pulse method, IF = 30 A - 1.15 V 200 - V Breakdown voltage 4021 IR = 100 µA C Capacitance 4001 VR = 10 V, F = 1 MHz - 400 pF trr Reverse recovery time 4031 IF = 1 A, VR = 30 V, dIF/dt = -50 A/µs - 55 ns Relative thermal impedance, junction to case 3101 IH = 15 to 40 A, tH = 50 ms IM = 50 mA, tmd = 100 µs Zth(j-c)(2) Calculate ΔVF(3) °C/W 1. Pulse width ≤ 300µs, duty cycle ≤ 2% 2. Performed only during screening tests parameter drift values (initial measurements for HTRB), go-no-go. 3. The limits for ΔVF shall be defined by the manufacturer on every lot in accordance with MIL-STD-750 Method 3101 and shall guarantee the Rth(j-c) limits specified in maximum ratings. Table 5. Symbol IR VF2 (2) Electrical measurements at high and low temperatures (per diode) Characteristic Reverse current Forward voltage MIL-STD-750 test method 4016 4011 Limits Test conditions(1) Units Min. Max. Tcase = +125 (+0, -5) °C DC method, VR = 200 V - 15 mA Tcase = +125 (+0, -5) °C pulse method, IF = 20 A - 0.95 V Tcase = +55 (+0, -5) °C pulse method, IF = 20 A - 1.15 V 1. Read and record measurements shall be performed on a sample of 5 components with 0 failures allowed. Alternatively a 100% inspection may be performed. 2. Pulse width ≤ 300µs, duty cycle ≤ 2% To evaluate the conduction losses use the following equation: P = 0.74 x IF(AV) + 1.00 x IF2(RMS ) Doc ID 17395 Rev 1 3/8 Package information 2 BYV52HR Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 2. Metal flange mount package (TO-254(a)), 3 lead dimension definitions B R1 D E H ØF C G A 3 2 1 N ØM R2 L K ØI K J a. The terminal identification is specified by the device configuration. See Figure 1 for terminal connections 4/8 Doc ID 17395 Rev 1 BYV52HR Package information Table 6. Metal flange mount package (TO-254), 3-lead dimension values Dimension in millimetres Dimlension in inches Reference Min. Max. Min. Max. A 13.59 13.84 0.535 0.545 B 13.59 13.84 0.535 0.545 C 20.07 20.32 0.790 0.800 D 6.3 6.7 0.248 0.264 E 1 3.9 0.039 0.154 ØF 3.5 3.9 0.138 0.154 G 16.89 17.4 0.665 0.685 H ØI (1) 6.86 BSC 0.89 0.270 BSC 1.14 0.035 0.045 J 3.81 BSC 0.150 BSC K 3.81 BSC 0.150 BSC L 12.95 14.5 ØM 0.510 3.05 Typ. 0.571 0.120 Typ. N - 0.71 - 0.028 R1(2) - 1 - 0.039 (3) 1.65 Typ. R2 0.065 1. 3 locations 2. Radius of heatsink flange corner - 4 locations 3. Radius of body corner - 4 locations Doc ID 17395 Rev 1 5/8 Ordering information BYV52HR 3 Ordering information Table 7. Ordering information(1) Order code BYV52-200FSY1 ESCC Lead detailed Package Comment finish specification - BYV52-200FSYHRB 5103/030/01 Mass EPPL Packing BYV52200FSY1 + BeO Gold TO-254 Marking Single die Solder dip Strip pack 10 g 510303001 + BeO Y 1. Contact ST sales office for information about the specific conditions for products in die form and QML-Q versions. 6/8 Doc ID 17395 Rev 1 BYV52HR 4 Revision history Revision history Table 8. Document revision history Date Revision 14-Apr-2010 1 Changes First issue. Doc ID 17395 Rev 1 7/8 BYV52HR Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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