Renesas HD74AC259FPEL 8-bit addressable latch Datasheet

HD74AC259
8-bit Addressable Latch
REJ03D0264–0200Z
(Previous ADE-205-385 (Z))
Rev.2.00
Jul.16.2004
Description
The HD74AC259 is a high-speed 8-bit addressable latch designed for general purpose storage applications in digital
systems. It is a multifunctional device capable or storing single line data in eight addressable latches, and also a 1-of-8
decoder and demultiplexer with active HIGH outputs. The device also incorporates an active LOW Common Clear for
resetting all latches, as well as an active LOW Enable.
Features
• Serial-to-Parallel Conversion
• Eight Bits of Storage with Output of Each Bit Available
• Random (Addressable) Data Entry
• Active High Demultiplexing or Decoding Capability
• Easily Expandable
• Common Clear
• Outputs Source/Sink 24 mA
• Ordering Information
Part Name
Package Type
Package Code Package Abbreviation Taping Abbreviation (Quantity)
HD74AC259FPEL
SOP-16 pin (JEITA)
FP-16DAV
FP
EL (2,000 pcs/reel)
HD74AC259RPEL
SOP-16 pin (JEDEC) FP-16DNV
RP
EL (2,500 pcs/reel)
Notes: 1. Please consult the sales office for the above package availability.
2. The packages with lead-free pins are distinguished from the conventional products by adding V at the end of
the package code.
Pin Arrangement
A0 1
16 VCC
A1 2
15 MR
A2 3
14 E
Q0 4
13 D
Q1 5
12 Q7
Q2 6
11 Q6
Q3 7
10 Q5
GND 8
9 Q4
(Top view)
Rev.2.00, Jul.16.2004, page 1 of 7
HD74AC259
Logic Symbol
E
D
A0
A1
A2
MR Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
Pin Names
A0 – A2
D
E
MR
Q0 – Q 7
Address Inputs
Data Inputs
Enable Input (Active LOW)
Master Reset (Active LOW)
Latch Outputs
Rev.2.00, Jul.16.2004, page 2 of 7
HD74AC259
Logic Diagram
Q7
Q6
Q5
MR
Q4
A2
Q3
A1
A0
Q2
Q1
D
E
Q0
Rev.2.00, Jul.16.2004, page 3 of 7
HD74AC259
Function Table
Inputs
Outputs
Operating Mode
Master reset
MR E
L
H
D
X
A0 A1 A2
Q0
X
X
X
L
L
L
L
L
L
L
L
Demultiplex
(Active HIGH
L
L
L
L
d
d
L
H
L
L
L
L
Q=d
L
L
Q=d
L
L
L
L
L
L
L
L
L
L
L
L
Decoder when
D = H)
L
L
L
L
d
d
L
H
H
H
L
L
L
L
L
L
Q=d
L
L
Q=d
L
L
L
L
L
L
L
L
L
L
L
L
d
d
L
H
L
L
H
H
L
L
L
L
L
L
L
L
Q=d
L
L
Q=d
L
L
L
L
L
L
L
L
d
d
L
H
H
H
H
H
L
L
L
L
L
L
L
L
L
L
L
L
Q=d
L
L
Q=d
H
H
H
L
X
d
X
L
X
L
X
L
q0
Q=d
q1
q1
q2
q2
q3
q3
q4
q4
q5
q5
q6
q6
q7
q7
H
H
L
L
d
d
H
L
L
H
L
L
q0
q0
Q=d
q1
q2
Q=d
q3
q3
q4
q4
q5
q5
q6
q6
q7
q7
H
H
L
L
d
d
H
L
H
L
L
H
q0
q0
q1
q1
q2
q2
Q=d
q3
q4
Q=d
q5
q5
q6
q6
q7
q7
H
H
L
L
d
d
H
L
L
H
H
H
q0
q0
q1
q1
q2
q2
q3
q3
q4
q4
Q=d
q5
q6
Q=d
q7
q7
H
L
d
H
H
H
q0
q1
q2
q3
q4
q5
q6
Q=d
Store (Do nothing)
Addressable latch
H
L
X
d
q
:
:
:
:
:
Q1
Q2
Q3
Q4
Q5
Q6
Q7
High Voltage Level
Low Voltage Level
Immaterial
High or Low data one setup time prior to the Low-to-High Enable transition.
Lower case letters indicate the state of the referenced output established during the last cycle in which it was
addressed or cleared.
Absolute Maximum Ratings
Item
Supply voltage
DC input diode current
Symbol
Ratings
Unit
Condition
VCC
IIK
–0.5 to 7
–20
V
mA
VI
mA
V
VI = Vcc+0.5V
DC input voltage
20
–0.5 to Vcc+0.5
DC output diode current
IOK
–50
50
mA
mA
VO = –0.5V
VO = Vcc+0.5V
DC output voltage
DC output source or sink current
VO
IO
–0.5 to Vcc+0.5
±50
V
mA
DC VCC or ground current per output pin
Storage temperature
ICC, IGND
Tstg
±50
–65 to +150
mA
°C
VI = –0.5V
Recommended Operating Conditions
Item
Symbol
Ratings
Unit
Supply voltage
Input and output voltage
VCC
VI, VO
2 to 6
0 to VCC
V
V
Operating temperature
Input rise and fall time
(except Schmitt inputs)
VIN 30% to 70% VCC
Ta
tr, tf
–40 to +85
8
°C
ns/V
Rev.2.00, Jul.16.2004, page 4 of 7
Condition
VCC = 3.0V
VCC = 4.5 V
VCC = 5.5 V
HD74AC259
DC Characteristics
Item
Input Voltage
Symbol
VIH
VIL
Output voltage
VOH
VOL
Ta = 25°°C
Vcc
(V)
3.0
min.
2.1
typ.
1.5
max.
—
Ta = –40 to
+85°°C
min.
max.
2.1
—
4.5
5.5
3.15
3.85
2.25
2.75
—
—
3.15
3.85
—
—
3.0
4.5
—
—
1.50
2.25
0.9
1.35
—
—
0.9
1.35
5.5
3.0
—
2.9
2.75
2.99
1.65
—
—
2.9
1.65
—
4.5
5.5
4.4
5.4
4.49
5.49
—
—
4.4
5.4
—
—
3.0
4.5
2.58
3.94
—
—
—
—
2.48
3.80
—
—
5.5
3.0
4.94
—
—
0.002
—
0.1
4.80
—
—
0.1
4.5
5.5
—
—
0.001
0.001
0.1
0.1
—
—
0.1
0.1
3.0
4.5
—
—
—
—
0.32
0.32
—
—
0.37
0.37
Unit
V
Condition
VOUT = 0.1 V or VCC –0.1 V
VOUT = 0.1 V or VCC –0.1 V
V
VIN = VIL or VIH
IOUT = –50 µA
VIN = VIL or VIH
IOH = –12 mA
IOH = –24 mA
IOH = –24 mA
VIN = VIL or VIH
IOUT = 50 µA
VIN = VIL or VIH
IOL = 12 mA
IOL = 24 mA
Input leakage
current
IIN
5.5
5.5
—
—
—
—
0.32
±0.1
—
—
0.37
±1.0
µA
VIN = VCC or GND
IOL = 24 mA
Dynamic output
current*
IOLD
IOHD
5.5
5.5
—
—
—
—
—
—
86
–75
—
—
mA
mA
VOLD = 1.1 V
VOHD = 3.85 V
Quiescent supply
current
ICC
5.5
—
—
8.0
—
80
µA
VIN = VCC or ground
*Maximum test duration 2.0 ms, one output loaded at a time.
AC Characteristics
Item
Symbol
VCC (V)*1
Ta = +25°C
CL = 50 pF
Min
Typ
Max
Ta = –40°C to +85°C
CL = 50 pF
Min
Max
Unit
Maximum clock
frequency
fmax
3.3
5.0
65
110
—
—
—
—
60
95
—
—
MHz
Propagation delay
MR to Qn
tPHL
3.3
5.0
1.0
1.0
8.5
6.5
14.5
9.0
1.0
1.0
16.5
10.5
ns
Propagation delay
Dn to Qn
tPLH
3.3
5.0
1.0
1.0
7.0
5.5
10.5
7.5
1.0
1.0
12.0
8.5
ns
Propagation delay
Dn to Qn
tPHL
3.3
5.0
1.0
1.0
7.0
5.5
10.5
7.5
1.0
1.0
12.0
8.5
ns
Propagaion delay
An to Qn
tPLH
3.3
5.0
1.0
1.0
11.5
8.0
18.5
11.5
1.0
1.0
21.5
14.0
ns
Propagation delay
An to Qn
tPHL
3.3
5.0
1.0
1.0
11.5
8.0
18.5
11.5
1.0
1.0
21.0
13.5
ns
Propagation delay
E to Q
tPLH
3.3
5.0
1.0
1.0
9.0
6.5
15.0
9.0
1.0
1.0
17.0
10.5
ns
Propagation delay
E to Qn
tPHL
3.3
5.0
1.0
1.0
9.0
6.5
14.0
8.5
1.0
1.0
16.0
10.0
ns
Note:
1. Voltage Range 3.3 is 3.3 V ± 0.3 V
Voltage Range 5.0 is 5.0 V ± 0.5 V
Rev.2.00, Jul.16.2004, page 5 of 7
HD74AC259
AC Operating Requirements
Ta = +25°C
CL = 50 pF
Item
Setup time, HIGH or LOW
Symbol VCC (V)*1
Typ
tsu
3.3
1.0
D to E
Hold time, HIGH or LOW
th
5.0
3.3
D to E
Setup time, HIGH or LOW
Ta = –40°C
to +85°C
CL = 50 pF
Guaranteed Minimum
3.5
3.5
ns
Unit
0.0
0.5
3.0
2.0
3.0
2.0
ns
0.5
1.0
2.0
6.0
2.0
7.0
ns
tsu
5.0
3.3
An to E
Hold time, HIGH or LOW
th
5.0
3.3
0.0
–3.0
4.5
0.0
5.0
0.0
ns
An to E
Pulse width
tw
5.0
3.3
–1.0
3.0
0.0
5.5
0.0
7.0
ns
5.0
3.0
4.5
5.0
Note:
1. Voltage Range 3.3 is 3.3 V ± 0.3 V
Voltage Range 5.0 is 5.0 V ± 0.5 V
Capacitance
Item
Input capacitance
Power dissipation capacitance
Rev.2.00, Jul.16.2004, page 6 of 7
Symbol
CIN
CPD
Typ
4.5
35
Unit
pF
pF
Condition
VCC = 5.5 V
VCC = 5.0 V
HD74AC259
Package Dimensions
As of January, 2003
Unit: mm
10.06
10.5 Max
9
1
8
1.27
*0.40 ± 0.06
0.20
7.80 +– 0.30
1.15
0 ˚ – 8˚
0.10 ± 0.10
0.80 Max
*0.20 ± 0.05
2.20 Max
5.5
16
0.70 ± 0.20
0.15
0.12 M
Package Code
JEDEC
JEITA
Mass (reference value)
*Ni/Pd/Au plating
FP-16DAV
—
Conforms
0.24 g
As of January, 2003
Unit: mm
9.9
10.3 Max
9
1
8
0.635 Max
*0.40 ± 0.06
0.15
*0.20 ± 0.05
1.27
0.11
0.14 +– 0.04
1.75 Max
3.95
16
0.10
6.10 +– 0.30
1.08
0˚ – 8˚
+ 0.67
0.60 – 0.20
0.25 M
*Ni/Pd/Au plating
Rev.2.00, Jul.16.2004, page 7 of 7
Package Code
JEDEC
JEITA
Mass (reference value)
FP-16DNV
Conforms
Conforms
0.15 g
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
http://www.renesas.com
RENESAS SALES OFFICES
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500 Fax: <1> (408) 382-7501
Renesas Technology Europe Limited.
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom
Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900
Renesas Technology Europe GmbH
Dornacher Str. 3, D-85622 Feldkirchen, Germany
Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11
Renesas Technology Hong Kong Ltd.
7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2375-6836
Renesas Technology Taiwan Co., Ltd.
FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology (Shanghai) Co., Ltd.
26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China
Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952
Renesas Technology Singapore Pte. Ltd.
1, Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
© 2004. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .1.0
Similar pages