Rohm BD87A29FVM-TR Voltage detector ics with watchdog timer Datasheet

Datasheet
Voltage Detectors
Voltage Detector ICs with Watchdog Timer
BD37Axx Series
BD87Axx Series
BD99A41F
General Description
Key Specifications
 RESET Power Supply Voltage Range: 1.0V to 10V
 WDT Power Supply Voltage Range:
2.5V to 10V
 High Precision Detection Voltage:
(Ta = 25°C)
±1.5%
(Ta = −40°C to 105°C)
±2.5%
 Super-Low Current Consumption:
5μA(Typ)
 Operating Temperature Range:
-40°C to +105°C
The BD37A19FVM, BD37A41FVM, BD87A28FVM,
BD87A29FVM, BD87A34FVM, BD87A41FVM and
BD99A41F are watchdog timer reset ICs. It delivers a
high precision detection voltage of ±1.5% and a
super-low current consumption of 5 µA (Typ). It can be
used in a wide range of electronic devices to monitor
power supply voltages and in system operation to
prevent runaway operation.
Packages
Features
 Built-in Watchdog Timer
 Reset delay time can be set with the CT pin's
external capacitance
 Watchdog timer monitor time and reset time can be
set with the CTW pin's external capacitance.
 Output Circuit Type: N-Channel Open Drain
Applications
W (Typ) x D (Typ) x H (Max)
 MSOP8
2.90mm x 4.00mm x 0.90mm
 SOP8
5.00mm x 6.20mm x 1.71mm
All devices using microcontrollers or DSP, including
vehicle equipment, displays, servers, DVD players,
and telephone systems
Ordering Information
B
D
3
7
A
1
9
F
V
M
-
TR
Part Number
Detection Voltage
Package
Packaging and forming specification
37A:WDT H Active
87A:WDT L Active
99A:WDT H Active
19:1.9V
28:2.8V
29:2.9V
34:3.4V
41:4.1V
FVM : MSOP8
F
: SOP8
TR: Embossed tape and reel
E2: Embossed tape and reel
Lineup
Detection voltage (Typ)
INH logic
1.9V
H: Active
MSOP8
Reel of 3000
BD37A19FVM-TR
4.1V
H: Active
MSOP8
Reel of 3000
BD37A41FVM-TR
2.8V
L: Active
MSOP8
Reel of 3000
BD87A28FVM-TR
2.9V
L: Active
MSOP8
Reel of 3000
BD87A29FVM-TR
3.4V
L: Active
MSOP8
Reel of 3000
BD87A34FVM-TR
4.1V
L: Active
MSOP8
Reel of 3000
BD87A41FVM-TR
4.1V
H: Active
SOP8
Reel of 2500
BD99A41F-E2
○Product structure:Silicon monolithic integrated circuit
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Orderable
Part Number
○This product has not designed protection against radioactive rays
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BD37Axx Series
BD87Axx Series
Datasheet
BD99A41F
Pin Configurations
MSOP8
(TOP VIEW)
8 7 6 5
SOP8
(TOP VIEW)
8 7 6 5
1 2 3 4
1
2
3
4
Figure 1. Pin Configurations
Pin Descriptions
BD37AxxFVM
No.
Pin
name
1
CLK
2
CT
3
BD87AxxFVM / BD99A41F
No.
Pin
name
Function
Clock input from microcontroller
1
CTW
WDT time setting capacitor connection pin
Reset delay time setting capacitor
connection pin
2
CT
CTW
WDT time setting capacitor connection pin
3
CLK
Clock input from microcontroller
4
VDD
Power supply pin
4
GND
GND pin
5
N.C.
NC pin
5
VDD
Power supply pin
6
GND
GND pin
6
INH
WDT ON/OFF setting pin
INH=H/L:WDT=OFF/ON(BD87AxxFVM)
INH=H/L:WDT=ON/OFF(BD99A41F)
7
INH
WDT ON/OFF setting pin
INH=H/L:WDT=ON/OFF
7
N.C.
NC pin
8
Function
RESET Reset output pin
Reset delay time setting capacitor
connection pin
8 RESET Reset output pin
Block Diagrams
BD37AxxFVM
BD87AxxFVM / BD99A41F
VDD
VDD
RESET
RESET
8
CLK
8
CTW
1
1
R
R
+
S
Q
+
Vref
S
Q
Vref
2
N.C.
CT
INH
CT
7
2
7
VDD
Pulse
Generation
Circuit
CTW
+
R
3
+
VthH
VDD
S
+
CLK
GND
Q
Pulse
Generation
Circuit
VthL
4
+
VthH
S
Q
INH
6
VthL
GND
N.C.
VDD
R
3
6
VDD
4
5
5
CT pin capacitor: 470pF to 3.3µF
CTW pin capacitor: 0.001µF to 10µF
Figure 2.Block Diagrams
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BD37Axx Series
BD87Axx Series
Datasheet
BD99A41F
Absolute Maximum Ratings (Ta=25℃)
Parameter
Power Supply Voltage *1
Symbol
Ratings
Unit
VDD
−0.3 to 10
V
VCT
−0.3 to VDD + 0.3
V
VCTW
−0.3 to VDD + 0.3
V
VRESET
−0.3 to VDD + 0.3
V
INH Pin Voltage
VINH
−0.3 to VDD + 0.3
V
CLK Pin Voltage
VCLK
−0.3 to VDD + 0.3
V
CT Pin Voltage
CTW Pin Voltage
RESET Pin Voltage
Power Dissipation
0.47*2
Pd
Operating Ambient Temperature
Storage Temperature
Maximum Junction Temperature
W
0.55*3
Topr
−40 to + 105
°C
Tstg
−55 to + 125
°C
Tjmax
125
°C
*1 Do not exceed Pd.
*2 MSOP8 : Reduced by 4.70 mW/℃ over 25°C, when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm).
*3 SOP8 : Reduced by 5.50 mW/℃ over 25°C, when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm).
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Ratings(Ta = −40°C to 105°C)
Parameter
Symbol
RESET Power Supply Voltage
WDT Power Supply Voltage
Min
Max
Unit
VDD RESET
1.0
10
V
VDD WDT
2.5
10
V
Electrical Characteristics
(Unless otherwise specified, Ta = −40°C to 105°C, VDD = 5V)
Limits
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
[Overall]
Total Supply Current 1
(during WDT operation)
Total Supply Current 2
(when WDT stopped)
IDD1
—
5
14
µA
INH : WDT ON Logic Input
CTW = 0.1µF
IDD2
—
5
14
µA
INH : WDT OFF Logic Input
Output Leak Current
Ileak
—
—
1
µA
VDD = VDS = 10V
Output Current Capacity
IOL
0.7
—
—
mA
VDD = 1.2V, VDS = 0.5V
1.9V Detect
VDET1
1.871
1.900
1.929
V
Ta = 25°C
2.8V Detect
VDET1
2.758
2.800
2.842
V
Ta = 25°C
2.9V Detect
VDET1
2.886
2.930
2.974
V
Ta = 25°C
3.4V Detect
VDET1
3.349
3.400
3.451
V
Ta = 25°C
4.1V Detect
VDET1
4.039
4.100
4.162
V
Ta = 25°C
1.9V Detect
VDET2
1.852
1.900
1.948
V
Ta = −40°C to 105°C
2.8V Detect
VDET2
2.730
2.800
2.870
V
Ta = −40°C to 105°C
2.9V Detect
VDET2
2.857
2.930
3.003
V
Ta = −40°C to 105°C
3.4V Detect
VDET2
3.315
3.400
3.485
V
Ta = −40°C to 105°C
4.1V Detect
VDET2
4.007
4.100
4.202
V
Ta = −40°C to 105°C
1.9V Detect
Vrhys
VDET×0.03
VDET×0.13
VDET×0.19
V
Ta=−40°C to 105°C
2.8V Detect
Vrhys
VDET×0.018
VDET×0.045
VDET×0.060
V
Ta=−40°C to 105°C
2.9V Detect
Vrhys
VDET×0.02
VDET×0.05
VDET×0.06
V
Ta=−40°C to 105°C
3.4V Detect
Vrhys
VDET×0.02
VDET×0.05
VDET×0.07
V
Ta=−40°C to 105°C
4.1V Detect
Vrhys
VDET×0.018
VDET×0.035
VDET×0.050
V
Ta=−40°C to 105°C
[RESET]
Detection
Voltage 1
Detection
Voltage 2
Hysteresis
Width
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BD37Axx Series
BD87Axx Series
Datasheet
BD99A41F
●Electrical Characteristics - continued
(Unless otherwise specified, Ta = −40°C to 105°C, VDD = 5V)
Limits
Parameter
Symbol
Min
Typ
RESET Transmission
tPLH
3.9
6.9
Delay Time: Low → High
Max
Unit
Conditions
10.1
ms
CCT = 0.001µF *1
When VDD = VDET ±0.5V
Delay Circuit Resistance
Rrst
5.8
10.0
14.5
MΩ
VCT = GND
Delay Pin Threshold
Voltage
VCTH
VDD×0.3
VDD×0.45
VDD×0.6
V
RL = 470KΩ
ICT
150
—
—
µA
VDD = 1.50V, VCT = 0.5V
VOPL
1.0
—
—
V
VOL ≤ 0.4V, RL = 470KΩ
WDT Monitor Time
twH
7.0
10.0
20.0
ms
CCTW = 0.01µF *2
WDT Reset Time
twL
2.4
3.3
7.0
ms
CCTW = 0.01µF *3
Clock Input Pulse Width
tWCLK
500
—
—
ns
CLK High Threshold
Voltage
VCLKH
VDD × 0.8
—
VDD
V
CLK Low Threshold Voltage
VCLKL
0
—
VDD × 0.3
V
INH High Threshold Voltage
VINHH
VDD × 0.8
—
VDD
V
INH Low Threshold Voltage
VINHL
0
—
VDD × 0.3
V
CTW Charge Current
ICTWC
0.25
0.50
0.75
µA
VCTW = 0.2V
CTW Discharge Current
ICTWO
0.75
1.50
2.00
µA
VCTW = 0.8V
Delay Pin Output Current
Min Operating Voltage
[WDT]
*1
*2
*3
tPLH can be varied by changing the CT capacitance value.
tPLH (s) ≈ 0.69 × Rrst (MΩ) × CCT (µF)
Rrst = 10 MΩ (Typ)
twH can be varied by changing the CTW capacitance value.
twH (s) ≈ (0.5 × CCTW (µF))/ICTWC (µA)
ICTWC = 0.5 µA(Typ)
twL can be varied by changing the CTW capacitance value.
twL (s) ≈ (0.5 × CCTW (µF))/ICTWO (µA)
ICTWO = 1.5 µA(Typ)
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Datasheet
BD99A41F
Typical Performance Curves
(Unless otherwise specified, Ta = 25°C) : 4.1V Detection
10
10
CIRCUIT CURRENT: IDD [μA]
RESET VOLTAGE: VRESET [V] .
12
8
6
4
2
0
8
Ta=105°C
6
Ta=25°C
4
Ta=-40°C
2
0
0
2
4
6
8
10
0
4
6
8
10
SUPPLY VOLTAGE: VDD [V]
SUPPLY VOLTAGE: VDD [V]
Figure 4. Total Supply Current
Figure 3. Detection Voltage
2
400
CTW PIN CURRENT: ICTW [μA]
350
CT PIN CURRENT: ICT [μA] .
2
300
250
200
150
100
1.5
1
0.5
0
-0.5
50
-1
0
0
1
2
3
4
5
SUPPLY VOLTAGE: VDD [V]
Figure 5. Delay Pin Current vs Power Supply Voltage
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1
2
3
4
CTW PIN VOLTAGE: VCTW [V]
Figure 6. CTW Charge Discharge Current
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05.Sep.2014 Rev.003
5
BD37Axx Series
BD87Axx Series
Datasheet
BD99A41F
Typical Performance Curves – continued
(Unless otherwise specified, Ta = 25°C) : 4.1V Detection
10000
OUTPUT DELAY TIME: TPLH [ms] .
RESET CURRENT: IRESET [mA]
2
Ta=105°C
1.5
1
Ta=25°C
Ta=-40°C
0.5
1000
100
10
1
0.0001
0
0
2
4
6
8
10
5
DETECTION VOLTAGE: VDET [V]
10000
WDT RESET TIME: Tw [ms]
0.1
Figure 8. T RESET Transmission
Delay Time vs Capacitance
Figure 7. Output Current
1000
Moniter Time
10
Reset Time
1
0.1
0.001
0.01
CT PIN CAPACITY: CT [μF]
RESET VOLTAGE: VRESET [V]
100
0.001
4.75
4.5
L→H
4.25
4
H→L
3.75
3.5
0.01
0.1
1
10
-40
0
40
80
CTW PIN CAPACITY: CTW [V]
AMBIENT TEMPERATURE: Ta [℃]
Figure 9. WDT Time vs Capacitance
Figure 10. Detection Voltage vs Temperature
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BD37Axx Series
BD87Axx Series
Datasheet
BD99A41F
Typical Performance Curves – continued
(Unless otherwise specified, Ta = 25°C) : 4.1V Detection
OUTPUT DELAY RESISTANCE: Rrst [MΩ]
OPERATING VOLTAGE: VOPL [V]
1
0.75
0.5
0.25
0
-40
0
40
13
12
11
10
9
8
80
-40
AMBIENT TEMPERATURE: Ta [℃]
40
80
AMBIENT TEMPERATURE: Ta [℃]
Figure 11. Operating Marginal Voltage
vs Temperature
Figure 12. CT Pin Circuit Resistance
vs Temperature
10
15
9
12
WDT RESET TIME: Tw [ms]
OUTPUT DELAY TIME: TPLH [ms]
0
8
7
6
9
6
3
0
5
-40
0
40
-40
80
40
80
AMBIENT TEMPERATURE: Ta [℃]
AMBIENT TEMPERATURE: Ta [℃]
Figure 13. RESET Transmission Delay Time
vs Temperature
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Figure 14. WDT Time vs Temperature
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BD37Axx Series
BD87Axx Series
Timing Chart
VDD
Datasheet
BD99A41F
VDETH
VDET
VDETH=VDET+Vrhys
WDT circuit turns off when INH is low
INH0
(BD37AxxFVM/BD99A41F)
0
WDT circuit turns off when INH is high
INH
(BD87AxxFVM)
0
CLK
0
*4 tWCLK
VCT
tWCLK
VCTH
0
VCTW
VthH
VthL
0
*2
*1
*3
TWH
TWL
TPLH
RESET
0
①② ③
④⑤
④⑤ ⑥
⑦
⑦
④ ⑤⑧
⑨
④ ⑤⑩
②③
④ ⑤ ⑩ ②③
④ ⑤⑩ ⑪
Figure 15. Timing Chart
Explanation
①
The RESET pin voltage (RESET) switches to low when the power supply voltage (VDD) falls to 0.8 V.
②
The external capacitor connected to the CT pin begins to charge when VDD rises above the reset detection voltage
(VDETH). The RESET signal stays low until VDD reaches the VDETH voltage and switches to high when VDD reaches or
exceeds the VDETH voltage. The RESET transmission delay time tPLH allowed to elapse before RESET switches from
low to high is given by the following equation:
tPLH (s) ≈ 0.69 × Rrst × CCT (µF)   [1]
Rrst denotes the IC's built-in resistance and is designed to be 10 MΩ (Typ). CCT denotes the external capacitor
connected to the CT pin.
③
The external capacitor connected to the CTW pin begins to charge when RESET rises, triggering the watchdog timer.
④
The CTW pin state switches from charge to discharge when the CTW pin voltage (VCTW) reaches VthH, and RESET
switches from high to low. The watchdog timer monitor time tWH is given by the following equation:
tWH (s) ≈ (0.5 × CCTW (µF))/(ICTWC)   [2]
ICTWC denotes the CTW charge current and is designed to be 0.50 µA (Typ). CCTW denotes the external capacitor
connected to the CTW pin.
⑤
The CTW pin state switches from charge to discharge when VCTW reaches VthL, and RESET switches from low to
high. The watchdog timer reset time tWL is given by the following equation:
tWL (s) ≈ (0.5 × CCTW (µF))/(ICTWO)   [3]
ICTWO denotes the CTW discharge current and is designed to be 1.50 µA (Typ).
⑥
The CTW pin state may not switch from charge to discharge when the CLK input pulse width tWCLK is short. Use a
tWCLK input pulse width of at least 500 ns.
tWCLK ≥ 500 ns (Min)
⑦
When a pulse (positive edge trigger) of at least 500 ns is input to the CLK pin while the CTW pin is charging, the CTW
state switches from charge to discharge. Once it discharges to VthL, it will charge again.
⑧
Watchdog timer operation is forced off when the INH pin switches to low (L: BD37Axx Series. BD99A41F, H:
BD87AxxSeries). At that time, only the watchdog timer is turned off. Reset detection is performed normally.
⑨
The watchdog timer function turns on when the INH pin switches to high(H: BD37Axx Series. BD99A41F, L:
BD87AxxSeries). The external capacitor connected to the CTW pin begins to charge at that time.
⑩
RESET switches from high to low when VDD falls to the RESET detection voltage (VDET) or lower.
⑪
When VDD falls to 0 V, the RESET signal stays low until VDD reaches 0.8 V.
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BD37Axx Series
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Datasheet
BD99A41F
Power Dissipation
MSOP8
SOP8
800
800
When mounted on a glass epoxy board
(70 mm × 70 mm × 1.6mm) θja = 181.8 (°C /W)
POWER DISSIPATION: Pd [mW]
POWER DISSIPATION: Pd [mW]
When mounted on a glass epoxy board
(70 mm × 70 mm × 1.6mm) θja = 212.8 (°C /W)
600
470mW
400
200
105°C
0
600
550mW
400
200
105°C
0
0
25
50
75
100
125
0
AMBIENT TEMPERATURE: Ta [°C]
25
50
75
100
125
AMBIENT TEMPERATURE: Ta [°C]
Figure 16. Power Dissipation
I/O Equivalence Circuit
CLK
INH
CT
VDD
VDD
VDD
VDD
10MΩ(Typ)
INH
CLK
CTW
VDD
CT
RESET
VDD
RESET
CTW
Figure 17. I/O equivalence circuit
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BD87Axx Series
Datasheet
BD99A41F
External Settings for Pins and Precautions
1.
Connect a capacitor (0.001 µF to 1,000 µF) between the VDD and GND pins when the power line impedance is high.
Use of the IC when the power line impedance is high may result in oscillation.
2.
External capacitance
A capacitor must be connected to the CTW pin. When using a large capacitor such as 1 µF, the INH pin must allow a
CTW discharge time of at least 2 ms. The power-on reset time is given by equation [1] on page 8. The WDT time is
given by equations [2] and [3] on page 8. The setting times are proportional to the capacitance value from the
equations, so the maximum and minimum setting times can be calculated from the electrical characteristics according
to the capacitance. Note however that the electrical characteristics do not include the external capacitor's
temperature characteristics.
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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TSZ02201-0G1G0AN00130-1-2
05.Sep.2014 Rev.003
BD37Axx Series
BD87Axx Series
Datasheet
BD99A41F
Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
C
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 18. Example of monolithic IC structure
12. Applications or inspection processes with modes where the potentials of the VDD pin and other pins may be reversed
from their normal states may cause damage to the IC’s internal circuitry or elements. Use an output pin capacitance
of 1000 µF or lower in case VDD is shorted with the GND pin while the external capacitor is charged. It is
recommended to insert a diode for preventing back current flow in series with VDD or bypass diodes between VDD
and each pin.
Back current prevention diode
Bypass diode
VDD
Pin
Figure 19.
13. When VDD falls below the operating marginal voltage, output will be open. When output is being pulled up to input,
output will be equivalent to VDD.
14. Regarding the CLK and INH pins
The CLK and INH pins comprise inverter gates and should not be left open. (These pins should be either pulled up or
down.) Input to the CLK pin is detected using a positive edge trigger and does not affect the CLK signal duty. Input
the trigger to the CLK pin within the tWH time.
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
11/15
TSZ02201-0G1G0AN00130-1-2
05.Sep.2014 Rev.003
BD37Axx Series
BD87Axx Series
BD99A41F
Datasheet
Physical Dimension, Tape and Reel Information
Package Name
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
MSOP8
12/15
TSZ02201-0G1G0AN00130-1-2
05.Sep.2014 Rev.003
BD37Axx Series
BD87Axx Series
Datasheet
BD99A41F
Physical Dimension, Tape and Reel Information – continued
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
13/15
TSZ02201-0G1G0AN00130-1-2
05.Sep.2014 Rev.003
BD37Axx Series
BD87Axx Series
Datasheet
BD99A41F
Marking Diagrams
MSOP8(TOP VIEW)
SOP8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
Part Number Marking
Package
Part Number
D3719
MSOP8
Reel of 3000
BD37A19FVM-TR
D3741
MSOP8
Reel of 3000
BD37A41FVM-TR
D8728
MSOP8
Reel of 3000
BD87A28FVM-TR
D8729
MSOP8
Reel of 3000
BD87A29FVM-TR
D8734
MSOP8
Reel of 3000
BD87A34FVM-TR
D8741
MSOP8
Reel of 3000
BD87A41FVM-TR
99A41
SOP8
Reel of 2500
BD99A41F-E2
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
14/15
TSZ02201-0G1G0AN00130-1-2
05.Sep.2014 Rev.003
BD37Axx Series
BD87Axx Series
Datasheet
BD99A41F
Revision History
Date
Revision
12.Apr.2013
001
25.Apr.2013
002
05.Sep.2014
003
Changes
New Release
P.8 Explanation ⑨ modified.
P.9 Figure 17. I/O equivalence circuit the error in writing of the part of CLK was corrected.
Applied the ROHM Standard Style
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© 2013 ROHM Co., Ltd. All rights reserved.
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15/15
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05.Sep.2014 Rev.003
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BD37A19FVM - Web Page
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Distribution Inventory
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BD37A19FVM
MSOP8
3000
3000
Taping
inquiry
Yes
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