Datasheet DC Brushless Motor Drivers for Fans Standard Single-phase Full wave Fan Motor Driver BD6981FVM Description This is the summary of application for BD6981FVM. BD6981FVM can drive FAN motor silently by BTL soft switching. Features Small package (MSOP8) BTL soft switching drive Constant voltage output for hall element Lock protection and auto restart (without external capacitor) Rotating speed pulse signal (FG) output Package MSOP8 W(Typ) x D(Typ) x H(Max) 2.90mm x 4.00mm x 0.90mm Applications PC, PC peripheral component (Power supply, VGA card, case FAN etc.) BD player, Projector etc. MSOP8 Absolute Maximum Ratings Parameter Symbol Rating Unit VCC 18 V Pd 0.58(Note 1) W Operating Temperature Topr -40 to +105 °C Storage Temperature Tstg -55 to +150 °C Junction Temperature Tjmax 150 °C Output Voltage VOMAX 18 V Output Current IOMAX 800(Note 2) mA Hall Input Voltage VH 7 V FG Signal Output Voltage VFG 18 V FG Signal Output Current IFG 10 mA HB Output Current IHB 10 mA Supply Voltage Power Dissipation (Note 1) Reduce by 4.68mW/°C over 25°C. (On 70.0mm×70.0mm×1.6mm glass epoxy board) (Note 2) This value is not to exceed Pd. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product has no designed protection against radioactive rays 1/14 TSZ02201-0H1H0B100030-1-2 20.May 2015 Rev.003 BD6981FVM Recommended Operating Conditions Parameter Symbol Limit Unit Operating Supply Voltage Range VCC 2.8 to 16 V Hall Input Voltage Range VH 0.4 to VCC/4 V Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC=12V) Parameter Limit Symbol Min. Typ. Max. Unit Conditions Characteristics Circuit Current ICC 1.5 4 8 mA Figure 1 Hall Bias Voltage VHB 1.1 1.2 1.3 V Hall Input Offset VOFS 0 - ±6 mV - Input-output Gain GIO 53 55 57 dB - Output Voltage VO 0.20 0.45 0.70 V FG Hysteresis Voltage VHYS ±5 ±10 ±15 mV FG Low Voltage VFGL - 0.2 0.4 V IFG=5mA Figure 9,10 FG Leak Current IFGL 0 - 5 µA VFG=18V - Lock Detection ON Time tON 0.35 0.50 0.65 s Figure 11 Lock Detection OFF Time tOFF 2.0 3.0 4.0 s Figure 12 Lock Detection Time Ratio rLD - 6 - - IHB=-3mA Figure 2,3 IO=200mA Upper and Lower total Figure 4 to 7 Figure 8 rLD = tOFF / tON - Truth Table H+ H- OUT1 OUT2 FG H L H L H(Output Tr：OFF) L H L H L(Output Tr：ON) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/14 TSZ02201-0H1H0B100030-1-2 20.May 2015 Rev.003 BD6981FVM 8 1.4 6 1.3 HB Voltage, VHB [V] Circuit Current, ICC [mA] Reference Data 105°C 4 25°C -40°C 16V 1.2 12V 2.8V 1.1 2 Operating Range 1.0 0 0 3 6 9 12 15 0 18 2 4 6 8 10 HB Current, IHB [mA] Supply Voltage, VCC [V] Figure 2. Hall Bias voltage (Voltage characteristics) Figure 1. Circuit Current 1.4 2.0 1.6 2.8V 1.2 Output H Voltage [V] HB Voltage, VHB [V] 1.3 105°C 25°C -40°C 1.1 1.2 12V 16V 0.8 0.4 1.0 0.0 0 2 4 6 8 10 0.0 0.2 0.4 0.6 HB Current, IHB [mA] Output Current, IO [A] Figure 3. Hall Bias Voltage (Temperature Characteristics) Figure 4. Output H Voltage (Voltage Characteristics) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/14 0.8 TSZ02201-0H1H0B100030-1-2 20.May 2015 Rev.003 2.0 1.0 1.6 0.8 105°C 1.2 25°C 0.8 -40°C Output L Voltage [V] Output H Voltage [V] BD6981FVM 0.4 2.8V 0.6 12V 16V 0.4 0.2 0.0 0.0 0.0 0.2 0.4 0.6 0.8 0.0 0.2 0.4 0.6 Output Current, IO [A] Output Current,IO [A] Figure 5. Output H Voltage (Temperature Characteristics) Figure 6. Output L Voltage (Voltage Characteristics) 0.8 20 1.0 0.8 Output L Voltage [V] 105°C 0.6 25°C -40°C 0.4 0.2 FG Hysteresis Voltage, VHYS [mV] 15 105°C 25°C -40°C 10 5 0 Operating Range -5 -40°C -10 25°C 105°C -15 -20 0.0 0.0 0.2 0.4 0.6 0 0.8 6 9 12 15 18 Supply Voltage, VCC [V] Output Current,IO [A] Figure 7. Output L Voltage (Temperature Characteristics) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3 Figure 8. FG Hysteresis Voltage 4/14 TSZ02201-0H1H0B100030-1-2 20.May 2015 Rev.003 1.0 1.0 0.8 0.8 0.6 2.8V 0.4 12V 16V 0.2 FG L Voltage, VFGL [V] FG L Voltage, VFGL [V] BD6981FVM 105°C 0.4 25°C 0.2 0.0 -40°C 0.0 0 2 4 6 8 0 2 4 6 8 FG Current, IFG [mA] FG Current, IFG [mA] Figure 9. FG Output Voltage (Voltage Characteristics) Figure 10. FG Output Voltage (Temperature Characteristics) 6.0 1.0 5.0 0.6 Lock Detection OFF Time, tOFF [s] 0.8 Lock Detection ON Time, tON [s] 0.6 -40°C 25°C 105°C 0.4 0.2 4.0 -40°C 3.0 25°C 105°C 2.0 1.0 Operating Range Operating Range 0.0 0.0 0 3 6 9 12 15 0 18 6 9 12 15 18 Supply Voltage, VCC [V] Supply Voltage, VCC [V] Figure 11. Lock Detection ON Time www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3 Figure 12. Lock Detection OFF Time 5/14 TSZ02201-0H1H0B100030-1-2 20.May 2015 Rev.003 BD6981FVM Block Diagram, Application Circuit and Pin Assignment Incorporates soft switching function. Adjust at an optimum value because gradient of switching of output waveform depends on hall element output. M OUT2 GND 1 8 P.7 H+ HB Hall OUT1 Lock Protection 2 0Ω to Take a measure against VCC voltage rise due to reverse connection of power supply and back electromotive force. OSC TSD P.9 VCC Hall Bias 3 7 6 0.1uF to 1uF 500Ω H- FG 4 5 This is an open drain output. Connect a pull-up resistor. P.10 OSC : Internal reference oscillation circuit TSD : Thermal shut down(heat rejection circuit) Pin Description Pin No. Pin Name 1 OUT2 2 H+ Hall input + 3 HB Constant voltage output for hall element 4 H- Hall input - 5 FG Rotational speed pulse output 6 VCC Power supply pin 7 OUT1 Motor output 1 8 GND GND www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Function Motor output 2 6/14 TSZ02201-0H1H0B100030-1-2 20.May 2015 Rev.003 BD6981FVM Description of Operations 1) Lock Protection and Automatic Restart Motor rotation is detected by hall signal. Lock detection ON time (tON) and lock detection OFF time (tOFF) are set by the digital counter based on internal oscillator. Therefore the ratio of ON/OFF time is always constant. Timing chart is shown in Figure 13. Idling H+ OUT1 tOFF tON Output Tr OFF ON OUT2 Depends on hall signal (L in this figure) FG Motor locking Lock detection Lock release Recovers normal operation Figure 13. Lock Protection Timing Chart 2) Soft Switching (silent drive setting) Input signal to hall amplifier is amplified to produce an output signal. When the hall element output signal is small, the gradient of switching of output waveform is gentle. When it is large, the gradient of switching of output waveform is steep. Gain of 55dB (560 times) is provided between input and output, therefore enter an appropriate hall element output to IC where output waveform swings sufficiently. (H+)-(H-) OUT1 Figure 14. Relation between Hall Element Output Amplitude and Output Waveform www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/14 TSZ02201-0H1H0B100030-1-2 20.May 2015 Rev.003 BD6981FVM 3) Hall Input Setting Hall Input Voltage Range VCC VCC/4V 0.4V GND Figure 15. Hall Input Voltage Range Adjust the value of R1 in Figure 16 so that the input voltage of a hall signal is input in "Hall Input Voltage Range" including signal amplitude. In order to detect rotation of a motor, the amplitude of hall signal more than “FG hysteresis voltage” is required. Please input the hall signal of at least 30mVpp. ○Reducing the Noise of Hall Signal Hall element may be affected by VCC noise or the like depending on the wiring pattern of board. In this case, place a capacitor like C1 in Figure 16. In addition, when wiring from the hall element output to IC hall input is long, noise may be loaded on wiring. In this case, place a capacitor like C2 in Figure 16. H- H+ HB C2 C1 RH Hall element Figure 16. Bias current = HB / (RH+ R1) R1 Application near of Hall Signal Equivalent Circuit 1) Hall Input 2) Motor Output VCC 1kΩ 1kΩ H+,H- 1kΩ OUT1 OUT2 1kΩ GND 3) HB Output 4) FG Output FG HB 50kΩ www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/14 TSZ02201-0H1H0B100030-1-2 20.May 2015 Rev.003 BD6981FVM Safety Measure 1) Reverse Connection Protection Diode Reverse connection of power results in IC destruction as shown in Figure 17. When reverse connection is possible, reverse connection protection diode must be added between power supply and VCC. Reverse power connection In normal energization VCC After reverse connection destruction prevention VCC VCC Circuit block Circuit block Each pin GND Internal circuit impedance high amperage small Circuit block Each pin GND Large current flows Thermal destruction Each pin GND No destruction Figure 17. Flow of Current when Power is Connected Reversely 2) Measure against VCC Voltage Rise by Back Electromotive Force Back electromotive force (Back EMF) generates regenerative current to power supply. However, when reverse connection protection diode is connected, VCC voltage rises because the diode prevents current flow to power supply. ON ON ON Phase switching ON Figure 18. VCC Voltage Rise by Back Electromotive Force When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place (A) Capacitor or (B) Zener diode between VCC and GND. It necessary, add both (C). (B) Zener Diode (A) Capacitor ON ON ON ON (C) Capacitor and Zener Diode ON ON Figure 19. Measure against VCC Voltage Rise www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/14 TSZ02201-0H1H0B100030-1-2 20.May 2015 Rev.003 BD6981FVM 3) Problem of GND Line PWM Switching Do not perform PWM switching of GND line because GND potential cannot be kept to a minimum. VCC Motor Driver M Controller GND PWM input Prohibited Figure 20. GND Line PWM Switching Prohibited 4) FG Output FG output is an open drain and requires pull-up resistor. The IC can be protected by adding resistor R1. An excess of absolute maximum rating, when FG output pin is directly connected to power supply, could damage the IC. VCC FG Pull-up resistor Protection Resistor R1 Connector of board Figure 21. Protection of FG Pin Thermal Derating Curve Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition, wind velocity, etc., even when the same package is used. Thermal derating curve indicates a reference value measured at a specified condition. Figure 22 shows a thermal derating curve. Pd(W) 0.7 0.6 0.58 0.5 0.4 0.3 0.2 0.1 0 25 50 75 100 105 125 150 Ta(°C) * Reduce by 4.68 mW/°C over 25°C. (70.0mm x 70.0mm x 1.6mm glass epoxy board) Figure 22. Thermal Derating Curve www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/14 TSZ02201-0H1H0B100030-1-2 20.May 2015 Rev.003 BD6981FVM Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/14 TSZ02201-0H1H0B100030-1-2 20.May 2015 Rev.003 BD6981FVM Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 23. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/14 TSZ02201-0H1H0B100030-1-2 20.May 2015 Rev.003 BD6981FVM Ordering Information B D 6 9 8 1 Part Number F V M Package FVM: MSOP8 - GTR Packaging and forming specification G: Halogen free TR: Embossed tape and reel Marking Diagram MSOP8 (TOP VIEW) Ｄ６９ ８ １ Lot No. 1PIN MARK www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/14 TSZ02201-0H1H0B100030-1-2 20.May 2015 Rev.003 BD6981FVM Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 MSOP8 14/14 TSZ02201-0H1H0B100030-1-2 20.May 2015 Rev.003 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. 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ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD6981FVM - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD6981FVM MSOP8 3000 3000 Taping inquiry Yes